An Improved Method of Thermal Resistance Measurement for Variable Thermal Resistors

2007 ◽  
Author(s):  
Hyeun-Su Kim ◽  
Hyun Oh Song ◽  
Thomas W. Kenny
Keyword(s):  
Thermal Resistance ◽  
Measurement Method ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Response ◽  
Resistance Measurement ◽  
Response Signal ◽  
Improved Method ◽  
Temperature Signal ◽  
Thermal Resistors

As part of the study and development of a variable thermal resistor (VTR), we present an improved thermal resistance measurement method for the VTR in the presence of unwanted signal drifting. To measure the change of thermal resistance, instead of waiting for the steady state value of the temperature signal, we repeatedly measure only the early transient part of the thermal response signal and then fit to get thermal resistance estimation. The required lengths of measurement were studied for the tests with various thermal time constants. Using this method, we performed thermal switching tests with various material pairs in contact in order to find the material pair that minimizes thermal contact resistance.

Design and Verification of a Low-Powered Pre-Programmable In-Package Temperature Controller

2006 ◽  
Author(s):  
Hyeun-Su Kim ◽  
Hsien-Hsin Liao ◽  
Byeong-hee Lee ◽  
Thomas W. Kenny
Keyword(s):  
Thermal Resistance ◽  
Contact Resistance ◽  
Temperature Change ◽  
Thermal Contact Resistance ◽  
Operating Temperature ◽  
Electrostatic Force ◽  
Thermal Contact ◽  
Temperature Regulator ◽  
Thermal Resistors ◽  
Device Test

A zero power passive temperature regulator has been studied and designed to maintain electric chip operating temperature using a variable thermal resistor. Apart from the passive temperature regulator design, we also present active variable thermal resistors using electrostatic force to actuate the device. Test samples were fabricated to verify these two designs and we observed the temperature change of a heated chip due to thermal resistance changes. This study estimated and measured the thermal contact resistance and the force required to remove it.

scholarly journals Dynamic Thermal Contact Resistance Measurement Method Using Lock-in Thermography

Proceedings ◽  
2019 ◽  
Vol 27 (1) ◽  
pp. 42 ◽  
Author(s):  
Ishizaki ◽  
Igami ◽  
Ueno ◽  
Nagano
Keyword(s):  
Contact Resistance ◽  
Measurement Method ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Side Surface ◽  
Resistance Measurement ◽  
Phase Lag ◽  
Infrared Microscope ◽  
Measurement Principle ◽  
Lock In

This paper proposes a new thermal contact resistance measurement method using lock-in thermography. By the lock-in thermography with an infrared microscope, the dynamic temperature behavior across the contact interface was visualized in the sample side surface. Meanwhile, a new thermal contact resistance measurement principle was constructed by the superimposition of the temperature wave from virtual heat sources in consideration of the thermal contact resistance at the interface. Consequently, the thermal contact resistance was obtained as a fitting parameter by fitting the theoretical curve to the measured amplitude and phase lag. The validity of the principle was shown.

A Drain–Source Connection Technique: Thermal Resistance Measurement Method for GaN HEMTs Using TSEP at High Voltage

2020 ◽  
Vol 67 (12) ◽  
pp. 5454-5459
Author(s):  
Xuan Li ◽  
Shiwei Feng ◽  
Chang Liu ◽  
Yamin Zhang ◽  
Kun Bai ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Voltage ◽  
Measurement Method ◽  
Resistance Measurement ◽  
Gan Hemts

scholarly journals Measurement of the Thermophysical Properties of Anisotropic Insulation Materials with Consideration of the Effect of Thermal Contact Resistance

Materials ◽  
2020 ◽  
Vol 13 (6) ◽  
pp. 1353 ◽  
Author(s):  
Dongxu Han ◽  
Kai Yue ◽  
Liang Cheng ◽  
Xuri Yang ◽  
Xinxin Zhang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Maximum Deviation ◽  
Insulation Materials ◽  
Steady State Method ◽  
Different Temperatures

A novel method involving the effect of thermal contact resistance (TCR) was proposed using a plane heat source smaller than the measured samples for improving measurement accuracy of the simultaneous determination of in-plane and cross-plane thermal conductivities and the volumetric heat capacity of anisotropic materials. The heat transfer during the measurement process was mathematically modeled in a 3D Cartesian coordinate system. The temperature distribution inside the sample was analytically derived by applying Laplace transform and the variables separation method. A multiparameter estimation algorithm was developed on the basis of the sensitivity analysis of the parameters to simultaneously estimate the measured parameters. The correctness of the algorithm was verified by performing simulation experiments. The thermophysical parameters of insulating materials were experimentally measured using the proposed method at different temperatures and pressures. Fiber glass and ceramic insulation materials were tested at room temperature. The measured results showed that the relative error was 1.6% less than the standard value and proved the accuracy of the proposed method. The TCRs measured at different pressures were compared with those obtained using the steady-state method, and the maximum deviation was 8.5%. The thermal conductivity obtained with the contact thermal resistance was smaller than that without the thermal resistance. The measurement results for the anisotropic silica aerogels at different temperatures and pressures revealed that the thermal conductivity and thermal contact conductance increased as temperature and pressure increased.

Modeling and Experimental Characterization of Metal Microtextured Thermal Interface Materials

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
R. Kempers ◽  
A. M. Lyons ◽  
A. J. Robinson
Keyword(s):  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Small Scale ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Main Challenge

A metal microtextured thermal interface material (MMT-TIM) has been proposed to address some of the shortcomings of conventional TIMs. These materials consist of arrays of small-scale metal features that plastically deform when compressed between mating surfaces, conforming to the surface asperities of the contacting bodies and resulting in a low-thermal resistance assembly. The present work details the development of an accurate thermal model to predict the thermal resistance and effective thermal conductivity of the assembly (including contact and bulk thermal properties) as the MMT-TIMs undergo large plastic deformations. The main challenge of characterizing the thermal contact resistance of these structures was addressed by employing a numerical model to characterize the bulk thermal resistance and estimate the contribution of thermal contact resistance. Furthermore, a correlation that relates electrical and thermal contact resistance for these MMT-TIMs was developed that adequately predicted MMT-TIM properties for several different geometries. A comparison to a commercially available graphite TIM is made as well as suggestions for optimizing future MMT-TIM designs.

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