Analysis of an Annular-Geometry Thermoelectric Module (TEM)

2007 ◽  
Author(s):  
Shankar Krishnan ◽  
Marc Hodes ◽  
Christopher Jones ◽  
Oana Malis
Keyword(s):  
Heat Dissipation ◽  
Heat Conduction Problem ◽  
Electrical Contact ◽  
Thermoelectric Module ◽  
Outer Radius ◽  
Coefficient Of Performance ◽  
Cross Sectional ◽  
Annular Geometry ◽  
In Series ◽  
Current Flows

An annular-geometry thermoelectric module (TEM) operating in refrigeration mode is analyzed. As in conventional (Cartesian geometry) TEMs, the pellets are interconnected such that current flows through them in series whilst they act in parallel with respect to conduction heat transfer. Current direction is such that Peltier cooling is provided at the inner radius of an annular TEM and heat dissipation is at its outer radius, where a boundary condition of the first kind is imposed. The cross-sectional area of each pellet increases linearly with radius. Accounting for electrical contact resistances at the interconnects, the necessary (one-dimensional) heat-conduction problem is solved to determine general expressions for the cooling rate provided by and coefficient performance of an annular TEM. Maximum cooling flux into an annular TEM and coefficient of performance for cooling fluxes below the maximum value are calculated and compared to those for conventional TEMs. Finally, the benefits of using an annular-geometry TEM are discussed.

Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications

2005 ◽  
Author(s):  
Kazuhiko Fukutani ◽  
Ali Shakouri
Keyword(s):  
Power Density ◽  
Integrated Circuit ◽  
Heat Dissipation ◽  
Thermoelectric Module ◽  
Cooling Power ◽  
Cross Sectional ◽  
Maximum Heat ◽  
Chip Cooling ◽  
Operating Current ◽  
Key Parameter

The use of bulk thermoelectric (TE) coolers for thermal management of integrated circuit (IC) chips is analyzed by a detailed electrothermal model. Various ideal and non-ideal parameters that affect the maximum cooling performance are discussed. Thermal resistance between the hot side of the thermoelectric module and ambient is a key parameter determining maximum heat dissipation in the IC chip if its temperature should be kept below a critical value. We show that the thermoelectric geometry factor (the ratio of the leg’s cross sectional area to its length) and the TE module operating current can be optimized to significantly increase the maximum power dissipation. There is an optimum leg thickness that gives the highest cooling power density to the IC chip and further thinning of the TE module will degrade the performance. The optimum thickness and the corresponding maximum cooling power density are calculated. The effect of various material properties are also discussed.

Sizing of Pellets in Thermoelectric Modules (TEMs)

2005 ◽  
Author(s):  
Marc Hodes
Keyword(s):  
Electrical Contact ◽  
Coefficient Of Performance ◽  
Total Power ◽  
Operating Voltage ◽  
Electrical Contact Resistance ◽  
Cross Sectional ◽  
Thermoelectric Modules ◽  
Total Power Consumption ◽  
Generation Mode ◽  
Operating Current

Sizing the height and cross sectional area of the pellets within thermoelectric modules (TEMs) used to cool, heat and generate power is necessary to optimize their efficiency and/or performance. Here the heat flux that a TEM can accommodate, its coefficient of performance, and its operating current and voltage in refrigeration mode are provided as a function of pellet geometry. This enables designers to, for example, size pellets to refrigerate a load such that the total power consumption of a TEM and a power supply (that converts available voltage to that required by the TEM) is minimized. In generation mode, power output, conversion efficiency and operating voltage and current are provided as a function of pellet geometry and the electrical resistance of a load connected to a TEM. Finally, the effects of electrical contact resistance at the pellet interconnects on the aforementioned parameters are addressed.

Failure Analysis Due to Slightly Unetched Hard Mask Using Nano Probe

2013 ◽  
Author(s):  
Jong Hak Lee ◽  
Jong Eun Kim ◽  
Chang Su Park ◽  
Nam Il Kim ◽  
Jang Won Moon ◽  
...  
Keyword(s):  
Leakage Current ◽  
Circuit Simulation ◽  
The State ◽  
Physical Analysis ◽  
Cross Sectional ◽  
Hard Mask ◽  
Current Flows ◽  
Voltage Contrast ◽  
The One ◽  
Zero Voltage

Abstract In this work, a slightly unetched gate hard mask failure was analyzed by nano probing. Although unetched hard mask failures are commonly detected from the cross sectional view with FIB or FIB-TEM and planar view with the voltage contrast, in this case of the very slightly unetched hard mask, it was difficult to find the defects within the failed area by physical analysis methods. FIB is useful due to its function of milling and checking from the one region to another region within the suspected area, but the defect, located under contact was very tiny. So, it could not be detected in the tilted-view of the FIB. However, the state of the failure could be understood from the electrical analysis using a nano probe due to its ability to probe contact nodes across the fail area. Among the transistors in the fail area, one transistor’s characteristics showed higher leakage current and lower ON current than expected. After physical analysis, slightly remained hard mask was detected by TEM. Chemical processing was followed to determine the gate electrode (WSi2) connection to tungsten contact. It was also proven that when gate is floated, more leakage current flows compared to the state that the zero voltage is applied to the gate. This was not verified by circuit simulation due to the floating nodes.

Design and experimental analysis of a solar thermoelectric heating, ventilation, and air conditioning system as an integral element of a building envelope

2018 ◽  
Vol 40 (2) ◽  
pp. 220-236 ◽  
Author(s):  
Irfan Ahmad Gondal
Keyword(s):  
Experimental Analysis ◽  
Air Conditioning ◽  
Energy Use ◽  
New Technologies ◽  
Thermoelectric Module ◽  
Electrical Current ◽  
Building Envelope ◽  
Coefficient Of Performance ◽  
Heating And Cooling ◽  
Cooling Effects

This study presents an innovative concept of a compact integrated solar-thermoelectric module that can form part of the building envelope. The heating/cooling modes use the photovoltaic electrical current to power the heat pump. The experimental analysis was carried out and the results of coefficient of performance were in the range 0.5–1 and 2.6–5 for cooling and heating functions, respectively. The study demonstrates that thermoelectric cooler can effectively be used for heating, ventilation, and air conditioning applications by integrating with solar panels especially in cooling applications. The system is environmentally friendly and can contribute in the implementation of zero energy buildings concept. Practical application: In order to help address the challenge of climate change and associated environmental effects, there is continuous demand for new technologies and applications that can be readily integrated into day-to-day life as a means of reducing anthropogenic impact. Heating, ventilation, and air conditioning, as one of the largest energy consumers in buildings, is the focus of many researchers seeking to reduce building energy use and environmental impact. This article proposes using facades and windows that have an integrated modules of solar photovoltaic cells and thermoelectric devices that are able to work together to achieve heating and cooling effects as required by the building without requiring any external operational power.

scholarly journals Renewable energy sources: New opportunities for thermoelectric generators

2020 ◽  
Vol 10 (3) ◽  
pp. 442-451
Author(s):  
Igor Yu. Shelekhov ◽  
◽  
Natalia L. Dorofeeva ◽  
Evgeniy I. Smirnov ◽  
Anna A. Dorofeeva ◽  
...  
Keyword(s):  
Spatial Orientation ◽  
Heat Dissipation ◽  
New Technologies ◽  
Mutual Influence ◽  
Renewable Energy Sources ◽  
Thermoelectric Module ◽  
Heat Pumps ◽  
Thermoelectric Modules ◽  
Thermoelectric Systems ◽  
Future Work

The work sets out to analyse the application of new technologies in the design of thermoelectric systems, as well as to compare classical thermoelectric systems with those characterized by a spatial orientation of heat-transfer sides. New thermoelectric systems are increasingly competing with con-ventional methods of converting energy up to several hundred watts. In order to expand the application of thermoelectric systems, new design methods and solutions providing for a more efficient conversion of heat losses into useful energy should be developed. This work presents the results of a comparative analysis of a classical thermoelectric module and a thermoelectric module with a spatial orientation of the sides. It is shown that the efficiency of the latter is 36% and 43% higher than that of the former at currents of 4A and 8A, respectively. According to the findings, the efficiency of thermoelectric modules depends primarily on technical solutions in their design and engineering, rather than on the electro-physical characteristics of thermoelectric junctions. In order to increase the efficiency of thermoelectric systems, future work should be aimed at improving the design of thermoelectric modules. The applica-tion of new technologies in manufacturing thermoelectric modules allows the mutual influence of heated and cooled surfaces to be eliminated and the area of heat dissipation to be significantly expanded. The possibility of generating higher power values increases the efficiency of thermoelectric modules and expandsthe scope of their application, substituting conventional heat pumps.

Effect of Plating Layers on the Bonding Strength of p-Type Bi–Te Thermoelectric Elements

2021 ◽  
Vol 21 (8) ◽  
pp. 4503-4507
Author(s):  
Seong Min Yun ◽  
Injoon Son ◽  
Sung Hwa Bae
Keyword(s):  
Bonding Strength ◽  
Thermoelectric Module ◽  
Interface Layer ◽  
Ceramic Substrates ◽  
In Series ◽  
Cu Substrates ◽  
Solder Reaction ◽  
P Type ◽  
Substrate Defects ◽  
Solder Layer

In thermoelectric modules, multiple n-type and p-type thermoelectric elements are electrically connected in series on a Cu electrode that is bonded to a ceramic substrate. Defects in the bond between the thermoelectric elements and the Cu electrode could impact the performance of the entire thermoelectric module. This study investigated the effect of plating layers on the bonding strength of p-type Bi–Te thermoelectric elements. Ni and Pd electroplating was applied to Bi–Te thermoelectric elements; further, electroless Ni–P immersion gold (ENIG) plating was applied to Cu electrodes bonded to ceramic substrates. Forming a Pd/Ni electroplating layer on the surface of thermoelectric elements and an ENIG plating layer on the surface of the Cu electrode improved the bonding strength by approximately 3.5 times. When the Pd/Ni and ENIG plating layers were formed on Bi–Te elements and Cu substrates, respectively, the solderability greatly increased; as the solderability increased, the thickness of the diffusion layer formed with the solder layer increased. The improved bonding strength of the Pd/Ni plated thermoelectric element bonded on the ENIG plated substrate is attributed to the enhanced solderability due to the rapid inter-diffusion of Pd and Au into the solder layer and the formation of a stable and non-defected solder reaction interface layer.

Thermoelectric Heat Pipe-Based Refrigerator: System Development and Comparison with Thermoelectric, Absorption and Vapor Compression Refrigerators

2013 ◽  
Vol 651 ◽  
pp. 736-744
Author(s):  
Nandy Putra ◽  
H. Ardiyansya ◽  
Ridho Irwansyah ◽  
Wayan Nata Septiadi ◽  
A. Adiwinata ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Heat Dissipation ◽  
System Development ◽  
Coefficient Of Performance ◽  
Prototype System ◽  
Vapor Compression ◽  
Thermoelectric Coolers ◽  
Thermoelectric Systems ◽  
Vapor Compression System ◽  
Thermoelectric Heat

Thermoelectric coolers have been widely applied to provide cooling for refrigerators in addition to conventional absorption and vapor compression systems. To increase heat dissipation in the thermoelectric cooler’s modules, a heat pipe can be installed in the system. The aim of this study is to develop a thermoelectric heat pipe-based (THP) refrigerator, which consists of thermoelectric coolers that are connected by heat pipe modules to enhance heat transfer. A comparative analysis of the THP prototype and conventional refrigerator with vapor compression, absorption and thermoelectric systems is also presented. The prototype system has a faster cooling down time and a higher coefficient of performance than the absorption system but still lower than vapor compression system

Design Framework for Multi-Section Shape Memory Alloy Axial Actuators Considering Material and Geometric Uncertainties

2020 ◽  
Author(s):  
Weilin Guan ◽  
Edwin A. Peraza Hernandez
Keyword(s):  
Shape Memory Alloy ◽  
Shape Memory ◽  
High Energy ◽  
High Energy Density ◽  
Design Framework ◽  
Efficient Design ◽  
Cross Sectional ◽  
Geometric Uncertainties ◽  
In Series ◽  
The Wire

Abstract Shape memory alloys are metallic materials with the capability of performing as high energy density actuators driven by temperature control. This paper presents a design framework for shape memory alloy (SMA) axial actuators composed of multiple wire sections connected in series. The various wire sections forming the actuators can have distinct cross-sectional areas and lengths, which can be modulated to adjust the overall thermomechanical response of the actuator. The design framework aims to find the optimal cross-sectional areas and lengths of the wire sections forming the axial actuator such that its displacement vs. temperature actuation path approximates a target path. Constraints on the length-to-diameter aspect ratio and stress of the wire sections are incorporated. A reduced-order numerical model for the multi-section SMA actuators that allows for efficient design evaluations is derived and implemented. An approach to incorporate uncertainty in the geometry and material parameters of the actuators within the design framework is implemented to allow for the determination of robust actuator designs. A representative application example of the design framework is provided illustrating the benefits of using multiple wire sections in axial actuators to modulate their overall response and approximate a target displacement vs. temperature actuation path.

Improved Capillary Electrophoresis Separation Using a Capillary Bundle

2008 ◽  
Author(s):  
Nam-Trung Nguyen ◽  
Yi Sun ◽  
Yien-Chian Kwok
Keyword(s):  
Capillary Electrophoresis ◽  
Joule Heating ◽  
Heat Dissipation ◽  
Electrical Current ◽  
Electric Resistance ◽  
Separation Channel ◽  
Cross Sectional ◽  
Narrow Channels ◽  
Capillary Bundle ◽  
Separation Columns

Joule heating is an undesirable effect in capillary electrophoresis (CE). The heat generated by the electrical current leads to a temperature gradient along the separation channel and consequently affects the separation quality. Since the heat is inversely proportional to the electric resistance of the separation column, increasing the electric resistance can reduce the effect of Joule heating. Currently, due to the limit of fabrication technique and detection apparatus, the typical dimensions of CE microchannels are in the range of 50 μm to 200 μm. In this paper, we describe the method of reducing the cross-sectional area of the separation channel and increasing the channel’s surface for better heat dissipation. A photonic crystal fiber (PCF) is a bundle of extremely narrow channels, which ideally work as separation columns. The PCF was simply encapsulated in a polymethylmethacrylate (PMMA) microchannel right after a T-shaped injector. CE was simultaneously but independently carried out in 54 narrow capillaries, each capillary with diameter of 3.7 μm. The capillary bundle could sustain high electric field strength up to 1000 V/cm due to efficient heat dissipation, thus faster and enhanced separation was attained.

scholarly journals Numerical and Experimental Study on the Performance of Thermoelectric Radiant Panel for Space Heating

Materials ◽  
2020 ◽  
Vol 13 (3) ◽  
pp. 550 ◽  
Author(s):  
Hansol Lim ◽  
Jae-Weon Jeong
Keyword(s):  
Energy Consumption ◽  
Prediction Models ◽  
Thermoelectric Module ◽  
Coefficient Of Performance ◽  
Joule Effect ◽  
Heating Capacity ◽  
Simulation Based ◽  
Radiant Panel ◽  
And Performance ◽  
Heating Mode

The purpose of this study is to investigate the suitable operation and performance of a thermoelectric radiant panel (TERP) in the heating operation. First, the hypothesis was suggested that the heating operation of TERP can operate without a heat source at the cold side according to theoretical considerations. To prove this hypothesis, the thermal behavior of the TERP was investigated during the heating operation using a numerical simulation based on the finite difference method. The results indicated that it is possible to heat the radiant panel using a thermoelectric module without fan operation via the Joule effect. A mockup model of the TERP was constructed, and the numerical model and hypothesis were validated in experiment 1. Moreover, experiment 2 was performed to evaluate the necessity of fan operation in the heating operation of TERP regarding energy consumption. The results revealed that the TERP without fan operation showed the higher coefficient of performance (COP) in the heating season. After determining the suitable heating operation of the TERP, prediction models for the heating capacity and power consumption of the TERP were developed using the response surface methodology. Both models exhibited good R2 values of >0.94 and were validated within 10% error bounds in experimental cases. These prediction models are expected to be utilized in whole-building simulation programs for estimating the energy consumption of TERPs in the heating mode.

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