Thermo-Viscoelastic Analysis for Warpage in CSP With Different Viscoelastic Properties for Several Layers

2007 ◽  
Author(s):  
Hideo Koguchi ◽  
Atsushi Ueno
Keyword(s):  
Thermal Expansion ◽  
Theoretical Analysis ◽  
Manufacturing Process ◽  
Viscoelastic Properties ◽  
Layered Material ◽  
Viscoelastic Analysis ◽  
Chip Size ◽  
The Difference ◽  
On Chip ◽  
Layered Body

In this study, a simple theory for estimating the warpage of chip size packaging (CSP) during a manufacturing process is presented. A single-sided CSP which is composed of IC, a resin and a substrate is modeled for an analysis as a three-layered material. Especially, the resin and the substrate have different thermo-viscoelastic properties. When the layered body is perfectly bonded, its warpage is caused by the difference of the thermal expansion coefficient in each layer when temperature varies. The warpage of CSP for a various thicknesses of the IC and the substrate is investigated. Finally, the warpage calculated using the theory is compared with the result in experiment, and both results are well agreed with each other. Then, it is shown that the simple theoretical analysis is valid. After that, this program is extended to be able to analyze the warpage in a CoC (Chip on Chip), and the result of the analysis is then presented.

A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

2005 ◽  
Author(s):  
Hideo Koguchi ◽  
Mirai Ishida ◽  
Kazuto Nishida ◽  
Tomoaki Kuroishi
Keyword(s):  
Normal Stress ◽  
Viscoelastic Properties ◽  
Normal Stresses ◽  
Layered Plate ◽  
Heat Cycle ◽  
Viscoelastic Analysis ◽  
Chip Size ◽  
Properties Of Materials ◽  
Rigid Walls ◽  
Gold Bump

In the present paper, a reliability of a single-sided chip-size package (CSP) manufactured using a non-conductive adhesive stud bump direct interconnection method is investigated. The reliability of the CSP is closely related with normal stress between an IC chip and a gold bump. Total normal stress can be decomposed into two parts, deflection related and thermal expansion related. The deflection for a three-layered plate, which is taken into account viscoelastic properties for the resin-sealed sheet and the substrate, respectively, is calculated and compared with experimental results on the deflection of the single-sided CSP. A relationship between the normal stress and the curvature derived from deflection is deduced. Through the use of this relationship, the variation of normal stress with the heat cycle is obtained considering the viscoelastic properties of materials. Furthermore, a relaxation behavior for the thermal stress in the resin-sealed sheet between two rigid walls considering its viscoelastic property is investigated. Summing up normal stresses for each calculation yields the normal stress between the IC and the bump. A relationship between the normal stress and the life of single-sided CSP is investigated for heat cycle. The life in experiment can be explained by the relaxation in the normal stress and the amplitude of the normal stress.

Algorithms for Density, Potential Temperature, Conservative Temperature, and the Freezing Temperature of Seawater

2006 ◽  
Vol 23 (12) ◽  
pp. 1709-1728 ◽  
Author(s):  
David R. Jackett ◽  
Trevor J. McDougall ◽  
Rainer Feistel ◽  
Daniel G. Wright ◽  
Stephen M. Griffies
Keyword(s):  
Thermal Expansion ◽  
Equation Of State ◽  
Thermodynamic Potential ◽  
Potential Temperature ◽  
Inverse Function ◽  
Freezing Temperature ◽  
Ocean Models ◽  
The Difference ◽  
New Equation ◽  
Density Equation

Abstract Algorithms are presented for density, potential temperature, conservative temperature, and the freezing temperature of seawater. The algorithms for potential temperature and density (in terms of potential temperature) are updates to routines recently published by McDougall et al., while the algorithms involving conservative temperature and the freezing temperatures of seawater are new. The McDougall et al. algorithms were based on the thermodynamic potential of Feistel and Hagen; the algorithms in this study are all based on the “new extended Gibbs thermodynamic potential of seawater” of Feistel. The algorithm for the computation of density in terms of salinity, pressure, and conservative temperature produces errors in density and in the corresponding thermal expansion coefficient of the same order as errors for the density equation using potential temperature, both being twice as accurate as the International Equation of State when compared with Feistel’s new equation of state. An inverse function relating potential temperature to conservative temperature is also provided. The difference between practical salinity and absolute salinity is discussed, and it is shown that the present practice of essentially ignoring the difference between these two different salinities is unlikely to cause significant errors in ocean models.

Current and Future Three-Dimensional LSI Integration Technology by “chip on chip”, “chip on wafer” and “wafer on wafer”

2006 ◽  
Vol 970 ◽  
Author(s):  
Manabu Bonkohara ◽  
Makoto Motoyoshi ◽  
Kazutoshi Kamibayashi ◽  
Mitsumasa Koyanagi
Keyword(s):  
Three Dimensional ◽  
Process Time ◽  
Future Technology ◽  
Sensor Device ◽  
Research Level ◽  
Key Technologies ◽  
The Future ◽  
Chip Size ◽  
On Chip ◽  
Chip Chip

ABSTRACTRecently the development of three dimensional LSI (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a view to mass production. This paper describes the current and the future 3D-LSI technologies which we have considered and imagined. The current technology is taken our Chip Size Package (CSP) for sensor device, for instance. In the future technology, there are the five key technologies are described. And considering con and pro of the current 3D LSI stacked approach, such as CoC (Chip on Chip), CoW (Chip on Wafer) and WoW (Wafer on Wafer), We confirmed that CoW combined with Super-Smart-Stack (SSS™) technology will shorten the process time per chip at the same level as WoW approach and is effective to minimize process cost.

Interferometric calibration of a strainmeter transducer

1971 ◽  
Vol 61 (4) ◽  
pp. 937-955
Author(s):  
Stanley Smookler ◽  
John V. Kline
Keyword(s):  
Thermal Expansion ◽  
Theoretical Analysis ◽  
Interference Pattern ◽  
Central Zone ◽  
Steel Tube ◽  
Peak Width ◽  
Strain Measurements ◽  
Fabry Perot

abstract A capacitive-strainmeter transducer is calibrated using a variable-spacing, Fabry-Perot interferometer. Optical flats are mounted on a spring parallelogram. Thermal expansion of a steel tube deforms the parallelogram, smoothly displacing one of the optical flats. This modulates the intensity of the 5016 àline, observed at the central zone of the interference pattern, and thus produces sharp peaks on a pen recorder. A theoretical analysis of the peak width, based on the work of Chabbal (1958), agrees with that recorded by the interferometer. This calibration permits earth-strain measurements to an accuracy of 1 per cent.

New repetitive motion planning scheme with cube end-effector planning precision for redundant robotic manipulators

Robotica ◽  
2021 ◽  
pp. 1-22
Author(s):  
Limin Shen ◽  
Yuanmei Wen
Keyword(s):  
Theoretical Analysis ◽  
Motion Planning ◽  
Robotic Manipulators ◽  
Robotic Manipulator ◽  
Repetitive Motion ◽  
End Effector ◽  
Difference Formula ◽  
Planning Scheme ◽  
Simulation Results ◽  
The Difference

Abstract Repetitive motion planning (RMP) is important in operating redundant robotic manipulators. In this paper, a new RMP scheme that is based on the pseudoinverse formulation is proposed for redundant robotic manipulators. Such a scheme is derived from the discretization of an existing RMP scheme by utilizing the difference formula. Then, theoretical analysis and results are presented to show the characteristic of the proposed RMP scheme. That is, this scheme possesses the characteristic of cube pattern in the end-effector planning precision. The proposed RMP scheme is further extended and studied for redundant robotic manipulators under joint constraint. Based on a four-link robotic manipulator, simulation results substantiate the effectiveness and superiority of the proposed RMP scheme and its extended one.

Effect of Aggregate Size on the Retention of Conventional and Rubberized Chip Seal

2019 ◽  
Author(s):  
Alireza Pourhassan ◽  
Ahmed A. Gheni ◽  
Mohamed A. ElGawady
Keyword(s):  
Impact Load ◽  
Mechanical Energy ◽  
Aggregate Size ◽  
Crumb Rubber ◽  
Superior Performance ◽  
Natural Aggregate ◽  
Modes Of Failure ◽  
Chip Seal ◽  
Chip Size ◽  
On Chip

<p>A common defect of chip seals is chip loss or raveling. The previous studies showed uniform grading of aggregate will enhance the retention ability of the chip seal. Also, it was shown that using crumb rubber as an aggregate will enhance the chip seal behavior including aggregate retention. However, no specific study has been done focusing on the effect of aggregate size for rubber nor natural aggregate. This paper is evaluating the effect of chip size on aggregate retention of both natural and rubber aggregate. Standard and modified Vialit tests, and standard and modified Pennsylvania tests which apply different forms of mechanical energy in different temperature was used to assess the aggregate-binder bond interaction and study the chip seal retention. Test results showed different trends for the effect of size on chip retention under impact load versus dynamic load because of different modes of failure. However, rubber particles showed a superior performance rather than natural aggregate in all cases.</p>

Failure time prognosis in manufacturing process using multi-dislocated time series convolutional neural network

2020 ◽  
pp. 095440892097414
Author(s):  
Bohao Li ◽  
Liping Zhao ◽  
Yiyong Yao
Keyword(s):  
Neural Network ◽  
Time Series ◽  
Convolutional Neural Network ◽  
Manufacturing Process ◽  
Failure Time ◽  
Great Difficulty ◽  
Milling Process ◽  
Machining Process ◽  
Massive Data ◽  
The Difference

Failure time prognosis in manufacturing process plays a crucial role in guaranteeing manufacturing safety and reducing maintenance loss. However, most current prognosis methods face great difficulty when handling massive data collected from manufacturing process. Convolutional neural network (CNN) provides an effective way to extract features with massive data. Due to the difference between images and multisensory signals, CNN is not suitable for machining process. Inspired by the idea of CNN, a novel prognosis framework is proposed based on the characteristics of multisensory signals, which is called multi-dislocated time series convolutional neural network (MDTSCNN). The proposed MDTSCNN is composed of multi-dislocate layer, convolutional layer, pooling layer and fully connected layer. By adding a multi-dislocate layer, this model can learn the relationship between different signals and different intervals in periodic multisensory signals. The effectiveness of proposed method is validated by a milling process. Compared to other prognosis method, the proposed MDTSCNN shows enhanced performances in prediction accuracy.

scholarly journals RANCANG BANGUN SISTEM INFORMASI PERSEDIAAN BAHAN BAKU DAN ADMINISTRASI GUDANG MAJEMUK (STUDI KASUS KAROSERI PT. XYZ MALANG)

2017 ◽  
Vol 2 (2) ◽  
pp. 146-152
Author(s):  
Denny Lukianto Kumala ◽  
Soetam Rizky Wicaksono
Keyword(s):  
Manufacturing Process ◽  
Raw Materials ◽  
Influential Factor ◽  
Raw Material ◽  
Accounting System ◽  
Accurate Calculation ◽  
Counting System ◽  
Administration System ◽  
The Difference ◽  
Production Losses

In the manufacturing process Bus and Mini Bus, a lot of the raw materials required. Raw materials are stored at many warehouses (especially on Body PT. XYZ Malang). Materials / goods are highly vulnerable to lost or stolen. The most influential factor in it is the counting system inventory / materials and administration. These changes will have an impact on the process of goods more accurate calculation based on the demand of production. Losses will have a greater likelihood of being used if the system can not address the calculation of the goods/raw materials better.And administration system that can cope with the calculation of the goods/raw materials are better here is a system that can calculate expenditures for production based on the incoming bill alone, and can calculate the receipt of goods in accordance with the letter received by the supplier. The system can also provide reports based on existing transactions during a certain period.With the inventory system and the administration is then the difference between the goods that previously occurred can be minimized and raw material inventory accounting system can work better.

Pressureless Co-Sintering of Al2O/ZrO2 Multilayers and Bilayers

1996 ◽  
Vol 434 ◽  
Author(s):  
Peter Z. Cai ◽  
David J. Green ◽  
Gary L. Messing
Keyword(s):  
Thermal Expansion ◽  
Cyclic Loading ◽  
Microscopic Observation ◽  
Surface Defects ◽  
Tape Casting ◽  
Thermal Expansion Mismatch ◽  
Heating Rates ◽  
The Difference ◽  
Extent Of Damage ◽  
Transverse Damage

AbstractVarious types of damage were observed in pressureless-sintered Al2O3/ZrO2 symmetric laminates (multilayers) and asymmetric laminates (bilayers) fabricated by tape casting and lamination. These defects included channel defects in ZrO2-containing layers, Al2O3 surface defects parallel to the layers, decohesion between the layers, and transverse damage within the Al2O3 layer in the bilayers. Detailed microscopic observation attributed the defects to a combined effect of mismatch in both sintering rate and thermal expansion coefficient between the layers. Crack-like defects were formed in the early stages of densification, and these defects acted as pre-existing flaws for thermal expansion mismatch cracks. Curling of the bilayers during sintering was monitored and the measured rate of curvature change, along with the layer viscosities obtained by cyclic loading dilatometry, was used to estimate the sintering mismatch stresses. The extent of damage could be reduced or even eliminated by decreasing the difference in layer sintering rate. This was accomplished by reducing the heating rates or by adding Al2O3 in the ZrO2 layers.

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