Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films

2007 ◽  
Author(s):  
Muneyuki Otani ◽  
Kazuhiko Sakutani ◽  
Kinji Tamakawa ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Boundaries ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Bulk Material ◽  
Tensile Load ◽  
Columnar Structure ◽  
Grain Boundary Sliding ◽  
Electroplated Copper

The mechanical properties of copper thin films formed by cold-rolling and electroplating were measured using a tensile test and nano-indentation. Both the Young’s modulus and the tensile strength of the films were found to vary drastically depending on the microstructure of the films. The Young’s modulus of the cold-rolled film was almost same as that of the bulk material. However, the Young’s modulus of the electroplated thin film was about a fourth of that of the bulk material. The microstructure of the electroplated film was polycrystalline and a columnar structure with a diameter of a few hundred-micron. The strength of the grain boundaries of the columnar grains seemed to be rather week. Such a columnar structure with porous grain boundaries caused the cooperative grain boundary sliding. As a result, the effective elasticity of the film became rather low and the superplastic deformation of the film appearred under an uni-axial tensile load. In addition, there was a sharp distribution of Young’s modulus along the thickness direction of the film. Though the modulus near the surface of the film was close to that of the bulk material, it decreased drastically to about a half at the depth of 1 μm. There was also a planar distribution of Young’s modulus near the surface of the film.

Fluctuation Mechanism of Mechanical Properties of Electroplated-Copper Thin Films Used for Three Dimensional Electronic Modules

2007 ◽  
Vol 353-358 ◽  
pp. 2954-2957 ◽  
Author(s):  
Hideo Miura ◽  
Kazuhiko Sakutani ◽  
Kinji Tamakawa
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Bulk Material ◽  
Three Dimensional ◽  
Columnar Structure ◽  
Columnar Grains ◽  
Plane Distribution ◽  
Electroplated Copper

The mechanical properties of copper thin films deposited by sputtering and electroplating were compared using tensile test and nano-indentation. Both the Young’s modulus and tensile strength of the films were found to vary drastically depending on the microstructure of the deposited films. The Young’s modulus of the sputtered film was almost same as that of bulk material. However, the Young’s modulus of the electroplated thin film was about a fourth of that of bulk material. The micro structure of the electroplated film was polycrystalline and a columnar structure with a diameter of a few hundred-micron. The strength of the grain boundaries of the columnar grains seemed to be rather week. In addition, there was a sharp distribution of Young’s modulus along the thickness direction of the film. Though the modulus near the surface of the film was close to that of bulk material, it decreased drastically to about a fourth within the depth of about 1 micron. There was also a plane distribution of Young’s modulus near the surface of the film.

Manufacturing of Porous Biomaterials for Dental Implant Applications through Selective Laser Melting

2012 ◽  
Vol 535-537 ◽  
pp. 1222-1229 ◽  
Author(s):  
Francesco Cardaropoli ◽  
Vittorio Alfieri ◽  
Fabrizia Caiazzo ◽  
Vincenzo Sergi
Keyword(s):  
Mechanical Properties ◽  
Young’S Modulus ◽  
Dental Implants ◽  
Selective Laser Melting ◽  
Young's Modulus ◽  
Bulk Material ◽  
Total Porosity ◽  
Porous Metals ◽  
Efficient Technology ◽  
Laser Melting

The paper discusses the possibility of manufacturing dental implants through Selective Laser Melting (SLM) of a Ti-6Al-4V alloy powder. Among all possible biomaterials, this alloy is widely used in biomedical applications due to high biocompatibility. Selective Laser Melting allows to obtain biomaterials with peculiar characteristics in terms of porosity gradient, roughness, customized geometry, and mechanical properties. Influence of input process parameters on porosity and analysis of Selective Laser Melting capabilities in implant dentistry have been focused. Porosity is a key parameter in dental implants as it affects stiffness, which is related to Young’s modulus. Ti-6Al-4V bulk material presents a Young’s modulus of 110 GPa, whereas the bone one ranges from 10 to 26 GPa. The relative difference of mechanical properties causes the phenomenon of stress shielding, which has a detrimental effect on the longevity of dental implants. Total porosity is important in reducing the effective modulus of porous metals. Biomaterials specimens obtained during experimental phase have been examined in terms of porosity (in inverse ratio to relative density), microstructure, microhardness and roughness. According to test results discussed in this paper, Selective Laser Melting is proved to be an efficient technology for the construction of Ti-6Al-4V dental implants, because biomaterials with adequate properties can be obtained changing processing parameters. Other fabrication techniques fail to produce biomaterials for dental implants with the desired features.

Crystallinity Control of Electroplated Interconnections for Improving Their Stability and Lifetime

2016 ◽  
Author(s):  
Jiatong Liu ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Residual Stress ◽  
Grain Boundaries ◽  
Lattice Mismatch ◽  
Bulk Material ◽  
Chemical Properties ◽  
Mechanical Fracture ◽  
Copper Thin Film ◽  
Electroplated Copper

In a three-dimensional (3D) packaging systems, the interconnections which penetrate stacked silicon chips have been employed. Such interconnection structure is called TSV (Through Silicon Via) structure, and the via is recently filled by electroplated copper thin film. The electroplated copper thin films often consist of fine columnar grains and porous grain boundaries with high density of defects which don’t appear in conventional bulk material. This unique micro texture has been found to cause the wide variation of physical and chemical properties of this material. In the TSV structure, the shrinkage of the copper thin film caused by thermal deformation and recrystallization of the unique texture during high-temperature annealing is strictly constrained by surrounding rigid Si and thus, high tensile residual stress remains in the thin film after thermal annealing. High residual stress should give rise to mechanical fracture of the interconnections and the shift of electronic function of thin film devices formed in Si. Therefore, the residual stress in the interconnections should be minimized by controlling the appearance of the porous boundaries during electroplating for assuring the longterm reliability of the interconnections. As the lattice mismatch between Cu and its barrier film (Ta) is as larger as 18%, which is the main reason for the fine columnar structures and porous grain boundaries, it is necessary to control the underlayer crystallinity to improve the crystallinity of electroplated copper thin films. In this study, the effective method for controlling the crystallinity of the underlayer was investigated by improving the atomic configuration in the electroplated copper thin film. The result showed that by controlling the crystallinity of underlayer, crystallinity of electroplated copper thin films can be improved, the mechanical properties of thin films was improved and thus, stability and lifetime of electroplated copper interconnections can be improved.

Micro-Texture Dependence of the Strength of Fine Metallic Bumps Used for Electronic Packaging

2012 ◽  
Author(s):  
Fumiaki Endo ◽  
Naokazu Murata ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Thin Films ◽  
Heat Treatment ◽  
Young’S Modulus ◽  
Electronic Packaging ◽  
Young's Modulus ◽  
Thickness Direction ◽  
Strong Anisotropy ◽  
Plane Direction ◽  
Electroplated Copper

Electroplated copper bumps expected as fine metallic bumps for electronic packaging were investigated experimentally considering the change of micro texture dependence of their electroplating conditions and heat treatment after the electroplating. Not only Young’s modulus but also the strength of electroplated copper thin films changed drastically depending on the change of their micro texture, and these values were significantly different from conventional bulk copper. In addition, the strong anisotropy of Young’s modulus was observed between that along their thickness direction, and that parallel to their plane direction.

Fabrication of Al2O3/BN Nanocomposites by Chemical Processing and Their Mechanical Properties

2005 ◽  
Vol 20 (1) ◽  
pp. 183-190 ◽  
Author(s):  
Takafumi Kusunose ◽  
Yoon-Ho Kim ◽  
Tohru Sekino ◽  
Takuya Matsumoto ◽  
Norihito Tanaka ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Grain Boundaries ◽  
Young’S Modulus ◽  
Hot Pressing ◽  
Young's Modulus ◽  
High Strength ◽  
Synthesis Process ◽  
Chemical Processing ◽  
Chemical Route ◽  
Nanocomposite Structures

Al2O3/BN nanocomposites were fabricated through a novel chemical route involving hot-pressing of α–Al2O3 powders covered partly with turbostratic BN (t-BN). The nano-sized hexagonal BN (h-BN) particles were found to be homogeneously dispersed within the Al2O3 grains as well as at grain boundaries, which is indicative of nanocomposite structures. Thus, the present nanocomposites exhibited the unique properties of high strength and low Young’s modulus associated with nanocomposites. This paper discusses in detail the synthesis process and microstructural features of these materials.

Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

2003 ◽  
Vol 125 (4) ◽  
pp. 361-367 ◽  
Author(s):  
Xiaoqin Huang ◽  
Assimina A. Pelegri
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Microelectromechanical Systems ◽  
Young's Modulus ◽  
Porous Silica ◽  
Silicon Substrates ◽  
Silica Thin Films ◽  
Low K

MEMS (MicroElectroMechanical Systems) are composed of thin films and composite nanomaterials. Although the mechanical properties of their constituent materials play an important role in controlling their quality, reliability, and lifetime, they are often found to be different from their bulk counterparts. In this paper, low-k porous silica thin films spin coated on silicon substrates are studied. The roughness of spin-on coated porous silica films is analyzed with in-situ imaging and their mechanical properties are determined using nanoindentation. A Berkovich type nanoindenter, of a 142.3 deg total included angle, is used and continuous measurements of force and displacements are acquired. It is shown, that the measured results of hardness and Young’s modulus of these films depend on penetration depth. Furthermore, the film’s mechanical properties are influenced by the properties of the substrate, and the reproduction of the force versus displacement curves depends on the quality of the thin film. The hardness of the studied low-k spin coated silica thin film is measured as 0.35∼0.41 GPa and the Young’s modulus is determined as 2.74∼2.94 GPa.

Mechanical Properties of Poly 3C-SiC Thin Films According to Carrier Gas (H2) Concentration

2008 ◽  
Vol 600-603 ◽  
pp. 867-870
Author(s):  
Gwiy Sang Chung ◽  
Ki Bong Han
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Surface Roughness ◽  
Atomic Force Microscope ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Carrier Gas ◽  
Nano Indentation ◽  
Atomic Force

This paper presents the mechanical properties of 3C-SiC thin film according to 0, 7, and 10 % carrier gas (H2) concentrations using Nano-Indentation. When carrier gas (H2) concentration was 10 %, it has been proved that the mechanical properties, Young’s Modulus and Hardness, of 3C-SiC are the best of them. In the case of 10 % carrier gas (H2) concentration, Young’s Modulus and Hardness were obtained as 367 GPa and 36 GPa, respectively. When the surface roughness according to carrier gas (H2) concentrations was investigated by AFM (atomic force microscope), when carrier gas (H2) concentration was 10 %, the roughness of 3C-SiC thin was 9.92 nm, which is also the best of them. Therefore, in order to apply poly 3C-SiC thin films to MEMS applications, carrier gas (H2) concentration’s rate should increase to obtain better mechanical properties and surface roughness.

Measurement of Mechanical Properties for Thin Film Using Visual Image Tracing Method

2007 ◽  
Vol 124-126 ◽  
pp. 1701-1704 ◽  
Author(s):  
Sang Joo Lee ◽  
Seung Woo Han ◽  
Jae Hyun Kim ◽  
Hak Joo Lee
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Measurement System ◽  
Strain Measurement ◽  
Poisson’S Ratio ◽  
Young's Modulus ◽  
Visual Image ◽  
Poisson's Ratio

It is quite difficult to accurately measure the mechanical properties of thin films. Currently, there are several methods (or application) available for measuring mechanical properties of thin films. Their properties, however, have been determined by indirect methods such as cantilever beam test and diaphragm bulge test. This paper reports the efforts to develop a direct strain measurement system for micro/nano scale thin film materials. The proposed solution is the Visual Image Tracing (VIT) strain measurement system coupled with a micro tensile testing unit, which consists of a piezoelectric actuator, load cell, microscope and CCD cameras. The advantage of this system is the ability to monitor the real time images of specimen during the test in order to determine its Young’s modulus and Poisson’s ratio at the same time. Stress-strain curve, Young’s modulus, yield strength and Poisson’s ratio of copper thin film measured using VIT system are presented.

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

2009 ◽  
Author(s):  
Naokazu Murata ◽  
Kinji Tamakawa ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fatigue Strength ◽  
Brittle Fracture ◽  
Grain Boundaries ◽  
The Other ◽  
Cycle Fatigue ◽  
Micro Structure ◽  
Columnar Grains ◽  
Electroplated Copper

Electroplated copper thin films have been used for interconnection of semiconductor devices. Both the mechanical and electrical properties of the films were found to be quite different from those of bulk material, and thus, the reliability of the devices is not so high as to be expected. The main reason for the difference was found to be their micro texture. When the films consist of fine columnar grains with weak grain boundaries, their mechanical properties show strong anisotropy and complicated fracture mode. Thus, the fatigue strength of the electroplated copper thin films was measured under uniaxial stress. The mechanical properties such as the yield stress, fracture elongation and Young’s modulus of each film were quite different from those of bulk copper due to their unique micro structure. The micro texture of each film was observed by using SEM (Scanning Electro Microscope) and SIM (Scanning Ion Microscope). The low-cycle fatigue strength varied drastically depending on their micro texture, while the high-cycle fatigue strength was almost same. The fracture surfaces were observed by SEM after the fatigue test. It was found that there were two fracture modes under the fatigue test. One was a typical ductile fracture, and the other was brittle one even under the fatigue load higher than its yield stress. The crack seemed to propagate in the grains when the ductile fracture occurred since typical striations and dimples were observed clearly on the fractured surfaces. On the other hand, the crack seemed to propagate along grain boundaries of columnar grains when the brittle fracture occurred. No striations or dimples remained on the fractured surfaces. One of the reasons for this brittle fracture can be explained by cooperative grain boundary sliding of the films which consist of fine columnar grains with weak grain boundaries. These results clearly indicated that the fatigue strength of the electroplated copper thin films varies depending on their micro structure. Since the initial micro texture was found to change significantly even after the annealing at temperatures lower than 300°C, the effect of the thermal history of them after electroplating on both their micro texture and fatigue strength was investigated quantitatively. Not only the average grain size, but also the crystallographic structure of the films changed significantly depending on their thermal history, and thus, the fatigue strength of the films varied drastically. It is important, therefore, to control the micro texture of the films for assuring their reliability.

Mechanical properties of W and W(C) thin films: Young’s modulus, fracture toughness and adhesion

1998 ◽  
Vol 332 (1-2) ◽  
pp. 195-201 ◽  
Author(s):  
Emmanuelle Harry ◽  
André Rouzaud ◽  
Michel Ignat ◽  
Pierre Juliet
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Young’S Modulus ◽  
Young's Modulus
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