Perspiration Nano-Patch for Hot Spot Thermal Management

2007 ◽  
Author(s):  
Shankar Narayanan ◽  
Andrei G. Fedorov ◽  
Yogendra K. Joshi
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Hot Spot ◽  
Evaporative Cooling ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Conceptual System ◽  
Sweeping Gas ◽  
Phase Change Heat Transfer ◽  
Latent Heat Of Vaporization

A novel cooling scheme utilizing evaporative cooling for an ultra-thin, spatially confined liquid film is described for meeting the challenge of hot spot thermal management aiming at locally removing heat fluxes in excess of 200 W/cm2. This work presents the conceptual system design and results of performance calculations supporting the feasibility of the proposed cooling scheme. The phase change heat transfer is one of the most efficient means of heat transfer due to an advantage offered by the significant latent heat of vaporization of liquids. Fundamentally, evaporation could be a much more efficient method of heat removal as compared to boiling if certain conditions are met. Theoretically, we demonstrate that if a stable monolayer of liquid can be maintained on the surface and fully dry sweeping gas (e.g., air) is blown at high velocity above this liquid monolayer one can dissipate heat fluxes of the order of several hundreds of Watts per cm2. We also show that a more volatile FC-72 can outperform water in evaporative cooling using stable liquid microfilms.

High Heat Flux Boiling Heat Transfer for Laser Diode Arrays

2016 ◽  
Author(s):  
Todd M. Bandhauer ◽  
Taylor A. Bevis
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Laser Diode ◽  
Boiling Heat Transfer ◽  
Single Phase ◽  
Laser Diodes ◽  
Heat Fluxes ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients ◽  
Laser Diode Arrays

The principle limit for achieving higher brightness of laser diode arrays is thermal management. State of the art laser diodes generate heat at fluxes in excess of 1 kW cm−2 on a plane parallel to the light emitting edge. As the laser diode bars are packed closer together, it becomes increasingly difficult to remove large amounts of heat in the diminishing space between neighboring diode bars. Thermal management of these diode arrays using conduction and natural convection is practically impossible, and, therefore, some form of forced convective cooling must be utilized. Cooling large arrays of laser diodes using single-phase convection heat transfer has been investigated for more than two decades by multiple investigators. Unfortunately, either large fluid temperature increases or very high flow velocities must be utilized to reject heat to a single phase fluid, and the practical threshold for single phase convective cooling of laser diodes appears to have been reached. In contrast, liquid-vapor phase change heat transport can occur with a negligible increase in temperature and, due to a high enthalpy of vaporization, at comparatively low mass flow rates. However, there have been no prior investigations at the conditions required for high brightness edge emitting laser diode arrays: >1 kW cm−2 and >10 kW cm−3. In the current investigation, flow boiling heat transfer at heat fluxes up to 1.1 kW cm−2 was studied in a microchannel heat sink with plurality of very small channels (45 × 200 microns) using R134a as the phase change fluid. The high aspect ratio channels (4.4:1) were manufactured using MEMS fabrication techniques, which yielded a large heat transfer surface area to volume ratio in the vicinity of the laser diode. To characterize the heat transfer performance, a test facility was constructed that enabled testing over a range of fluid saturation temperatures (15°C to 25°C). Due to the very small geometric features, significant heat spreading was observed, necessitating numerical methods to determine the average heat transfer coefficient from test data. This technique is crucial to accurately calculate the heat transfer coefficients for the current investigation, and it is shown that the analytical approach used by many previous investigations requires assumptions that are inadequate for the very small dimensions and heat fluxes observed in the present study. During the tests, the calculated outlet vapor quality exceeded 0.6 and the base heat flux reached a maximum of 1.1 kW cm−2. The resulting experimental heat transfer coefficients are found to be as large a 58.1 kW m−2 K−1 with an average uncertainty of ±11.1%, which includes uncertainty from all measured and calculated values, required assumptions, and geometric discretization error from meshing.

Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement

2013 ◽  
Author(s):  
Enes Tamdogan ◽  
Mehmet Arik ◽  
M. Baris Dogruoz
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Light Extraction ◽  
Junction Temperature ◽  
System Level ◽  
Design Parameters ◽  
Liquid Cooling ◽  
Wide Range

With the recent advances in wide band gap device technology, solid-state lighting (SSL) has become favorable for many lighting applications due to energy savings, long life, green nature for environment, and exceptional color performance. Light emitting diodes (LED) as SSL devices have recently offered unique advantages for a wide range of commercial and residential applications. However, LED operation is strictly limited by temperature as its preferred chip junction temperature is below 100 °C. This is very similar to advanced electronics components with continuously increasing heat fluxes due to the expanding microprocessor power dissipation coupled with reduction in feature sizes. While in some of the applications standard cooling techniques cannot achieve an effective cooling performance due to physical limitations or poor heat transfer capabilities, development of novel cooling techniques is necessary. The emergence of LED hot spots has also turned attention to the cooling with dielectric liquids intimately in contact with the heat and photon dissipating surfaces, where elevated LED temperatures will adversely affect light extraction and reliability. In the interest of highly effective heat removal from LEDs with direct liquid cooling, the current paper starts with explaining the increasing thermal problems in electronics and also in lighting technologies followed by a brief overview of the state of the art for liquid cooling technologies. Then, attention will be turned into thermal consideration of approximately a 60W replacement LED light engine. A conjugate CFD model is deployed to determine local hot spots and to optimize the thermal resistance by varying multiple design parameters, boundary conditions, and the type of fluid. Detailed system level simulations also point out possible abatement techniques for local hot spots while keeping light extraction at maximum.

scholarly journals Capillary-Limited Evaporation From Well-Defined Microstructured Surfaces

2013 ◽  
Author(s):  
Solomon Adera ◽  
Rishi Raj ◽  
Evelyn N. Wang
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Thermal Management ◽  
Latent Heat ◽  
Thin Film Evaporation ◽  
Film Evaporation ◽  
Microstructured Surfaces ◽  
Latent Heat Of Vaporization

Thermal management is increasingly becoming a bottleneck for a variety of high power density applications such as integrated circuits, solar cells, microprocessors, and energy conversion devices. The performance and reliability of these devices are usually limited by the rate at which heat can be removed from the device footprint, which averages well above 100 W/cm2 (locally this heat flux can exceed 1000 W/cm2). State-of-the-art air cooling strategies which utilize the sensible heat are insufficient at these large heat fluxes. As a result, novel thermal management solutions such as via thin-film evaporation that utilize the latent heat of vaporization of a fluid are needed. The high latent heat of vaporization associated with typical liquid-vapor phase change phenomena allows significant heat transfer with small temperature rise. In this work, we demonstrate a promising thermal management approach where square arrays of cylindrical micropillar arrays are used for thin-film evaporation. The microstructures control the liquid film thickness and the associated thermal resistance in addition to maintaining a continuous liquid supply via the capillary pumping mechanism. When the capillary-induced liquid supply mechanism cannot deliver sufficient liquid for phase change heat transfer, the critical heat flux is reached and dryout occurs. This capillary limitation on thin-film evaporation was experimentally investigated by fabricating well-defined silicon micropillar arrays using standard contact photolithography and deep reactive ion etching. A thin film resistive heater and thermal sensors were integrated on the back side of the test sample using e-beam evaporation and acetone lift-off. The experiments were carried out in a controlled environmental chamber maintained at the water saturation pressure of ≈3.5 kPa and ≈25 °C. We demonstrated significantly higher heat dissipation capability in excess of 100 W/cm2. These preliminary results suggest the potential of thin-film evaporation from microstructured surfaces for advanced thermal management applications.

Pool Boiling of Mixtures for Electronics Thermal Management

2010 ◽  
Author(s):  
Aravind Sathyanarayana ◽  
Yogendra Joshi ◽  
Yunhyeok Im
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Pool Boiling ◽  
Nanowire Arrays ◽  
Test Surface ◽  
Electronic Components ◽  
Fluid Mixtures ◽  
Heat Transfer Fluids ◽  
Transfer Properties ◽  
Latent Heat Of Vaporization

Electrical and chemical compatibility requirements of electronic components pose significant constraints on the choice of liquid coolants. These constraints have led to the use of fluoroinerts and Novec liquids as coolants, which are plagued by significantly lower thermal conductivity, specific heat, and latent heat of vaporization compared to water, and also a number of these chemicals have significant environmental impact. These factors necessitate the development of new heat transfer fluids with improved heat transfer properties and applicability. Mixture formulations provide an avenue for enhancing the properties of existing heat transfer fluids. These can be tuned for specific applications. Mixture formulations of Novec fluid (HFE 7200) with alcohols and ethers (HFE 7200 and methanol; HFE 7200 and ethoxybutane) are considered in this study. A 1 cm × 1 cm Silicon (Si) sample having copper nanowire arrays is used as the test surface for pool boiling. Experiments are done under saturated conditions and also at different sub-cooled conditions to investigate the thermal performance of these new fluid mixtures. Pool boiling heat transfer performance and the critical heat flux are measured for fluid mixtures and compared with the corresponding base fluid. From the pool boiling experiments, it was observed that adding methanol to pure HFE 7200 enhances the CHF of the resulting mixture and adding ethoxybutane to pure HFE 7200 reduces the incipience temperature for boiling.

Analysis of Parallel Microchannels for Flow Control and Hot Spot Cooling

2013 ◽  
Vol 5 (4) ◽  
Author(s):  
Stephen A. Solovitz
Keyword(s):  
Heat Transfer ◽  
Power Law ◽  
Hot Spots ◽  
Hot Spot ◽  
Electronics Cooling ◽  
Flow Distribution ◽  
Reynolds Numbers ◽  
Heat Fluxes ◽  
Cooling Devices ◽  
Parallel Microchannels

Microchannel heat transfer is commonly applied in the thermal management of high-power electronics. Most designs involve a series of parallel microchannels, which are typically analyzed by assuming a uniform flow distribution. However, many devices have a nonuniform thermal distribution, with hot spots producing much higher heat fluxes and temperatures than the baseline. Although solutions have been developed to improve local heat transfer, these are advanced methods using embedded cooling devices. As an alternative, a passive solution is developed here using analytical methods to optimize the channel geometry for a desired, nonuniform flow distribution. This results in a simple power law for the passage diameter, which may be useful for many microfluidic systems, including electronics cooling devices. Computational simulations are then applied to demonstrate the effectiveness of the power law for laminar conditions. At low Reynolds numbers, the flow distribution can be controlled to good accuracy, matching the desired distribution to within less than 1%. Further simulations consider the control of hot spots in laminar developing flow. Under these circumstances, temperatures can be made uniform to within 2 °C over a range of Reynolds numbers (60 to 300), demonstrating the capability of this power law solution.

Numerical Simulations for Digitized Heat Transfer

2009 ◽  
Author(s):  
Eric Baird ◽  
Kamran Mohseni
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Liquid Metals ◽  
Heat Removal ◽  
Heat Sinks ◽  
Management Technique ◽  
High Power Density ◽  
Transfer Rates ◽  
Integrated Microsystems ◽  
High Degree

This paper presents estimates of heat removal capabilities of a Digitized Heat Transfer (DHT) cooled device, a novel active thermal management technique for high power density electronics and integrated microsystems. In DHT, thermal energy is transported by a discrete array of electrostatically activated microdroplets of liquid metals, alloys or aqueous solutions with the potential of supporting significantly higher heat transfer rates than classical air-cooled heat sinks. Actuation methods for dispensing and transporting individual fluid slugs with a high degree of precision and programmability are described, and numerical results for the amount of heat flux removal a DHT device can obtain are presented.

Experimental Study of a Single Microchannel Flow Under Non-Uniform Heat Flux

2017 ◽  
Author(s):  
Ahmed Eltaweel ◽  
Abdulla Baobeid ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Maximum Heat ◽  
Uniform Heat ◽  
Microchannel Heat Sinks

Non-uniform heat fluxes are commonly observed in thermo-electronic devices that require distinct thermal management strategies for effective heat dissipation and robust performance. The limited research available on non-uniform heat fluxes focus mostly on microchannel heat sinks while the fundamental component, i.e. a single microchannel, has received restricted attention. In this work, an experimental setup for the analysis of variable axial heat flux is used to study the heat transfer in a single microchannel with fully developed flow under the effect of different heat flux profiles. Initially a hot spot at different locations, with a uniform background heat flux, is studied at different Reynolds numbers while varying the maximum heat fluxes in order to compute the heat transfer in relation to its dependent variables. Measurements of temperature, pressure, and flow rates at a different locations and magnitudes of hot spot heat fluxes are presented, followed by a detailed analysis of heat transfer characteristics of a single microchannel under non-uniform heating. Results showed that upstream hotspots have lower tube temperatures compared to downstream ones with equal amounts of heat fluxes. This finding can be of importance in enhancing microchannel heat sinks effectiveness in reducing maximum wall temperatures for the same amount of heat released, by redistributing spatially fluxes in a descending profile.

Effect of Gap Distance on Confined Boiling Heat Transfer Over a Saturated Porous Structure

2005 ◽  
Author(s):  
M. J. Schertzer ◽  
M. Khammar ◽  
D. Ewing ◽  
C. Y. Ching ◽  
J. S. Chang
Keyword(s):  
Heat Transfer ◽  
Porous Media ◽  
High Speed ◽  
Imaging System ◽  
Porous Plate ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Maximum Heat ◽  
Porous Wick ◽  
Maximum Heat Transfer

An experimental investigation was performed to study the effect that the introduction of a gap between a heated fin and a porous media would have on the heat removal characteristics of a capillary evaporator. In these experiments, a thin stainless steel resistive foil stretched between two copper electrodes was used to heat a saturated porous plate with an effective pore size of 50 microns. The temperature distribution on a 10 mm wide simulated fin was measured by a high-speed infra-red thermal imaging system. The heat removal performance was investigated for gap distances of 0.00 to 1.00 mm and for heat fluxes of 17 to 180 kW/m2. These results showed that the maximum heat transfer rate that could be achieved before persistent hot spots were observed on the surface increased with gap distance. Local temperature measurements made using thermocouples embedded in the porous media indicate that vapour penetration into the porous wick is intermittent, and that there is no stable single phase blanket of vapour. For a gap distance of 0.00 mm, this penetration is more uniformly distributed across the width of the heated fin than at a gap distance of 0.50 mm. In the latter case, the vapour distribution is much higher near the edge of the heated fin.

scholarly journals Effect of Nanoparticle Deposition on the Thermal Performance of Evaporator in Thermosyphons

2021 ◽  
Vol 2116 (1) ◽  
pp. 012054
Author(s):  
T Donepudi ◽  
A V Korobko ◽  
J W R Peeters ◽  
S Fateh
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Electronic Devices ◽  
Heat Transfer Process ◽  
Heat Fluxes ◽  
Management Systems ◽  
Two Phase ◽  
Nanoparticle Deposition ◽  
Promising Alternative ◽  
Conventional Systems

Abstract Rapid advancements in technology have led to the miniaturization of electronic devices which typically dissipate heat fluxes in the order of 100 W/cm2. This has brought about an unprecedented challenge to develop efficient and reliable thermal management systems. Novel cooling technologies such as Two-Phase Thermosyphons that make use of nanofluids provide a promising alternative to the use of conventional systems. This article analytically estimates the effects caused by nanoparticles that deposit on the evaporator surface and their effect on the heat transfer process.

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