Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices

2005 ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Mastaka Mochizuki ◽  
Yuji Saito ◽  
Thang Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Thermal Control ◽  
Heat Fluxes ◽  
The Body ◽  
Handheld Devices ◽  
Working Fluid ◽  
Composite Fibre ◽  
Wick Structure

Heat pipe is a very reliable and efficient two phase heat transfer device that has been extensively investigated for applications in electronic cooling. In the past, different types of heat pipe have been developed for specific as well as general applications. With the development in technology and trend towards miniaturization, thermal control of electronic devices with compact structure and concentrated heat sources has really become a challenge. Miniature heat pipes can be considered as potential candidates to address these issues. In the present paper, experimental investigation of the Flat Miniature Heat Pipe (FMHP), with the characteristic thickness of 1.5 mm and new type of composite fibre wick structure (FB-G), has been done for the thermal management of the mobile handheld devices. The so called composite fibre structure consists of combination of copper fibres and axial grooves as a capillary wick along the inner wall of the heat pipe. The design configuration of the experimental FMHP comprised of L-shaped flat heat pipe with rectangular cross section (1.5 mm × 8 mm) and heat transfer length of 100 mm. The body of FMHP was made of copper with pure deionised water as the working fluid. FMHP was easily able to transfer required heat fluxes in the range of 1–6 W/cm2 given by mobile-handheld chipset. Thermal resistance of the heat pipe from evaporator to the condenser surface came out to be in the range of 0.25–0.45 °C/W. In order to highlight the performance of the FMHP with composite fibre wick, thermal resistance was compared to different prototypes with screen mesh and axial grooves. It can be concluded from the outcomes of the investigation that the composite fibre wick structure provides an optimum capillary head and permeability for better heat transfer capabilities and minimal end to end temperature gradient than the conventional type of wick structures. FMHPs with composite fibre wicks will find prospective applications in the cooling of the compact handheld devices like Palm PC, mobile phones and digital diaries.

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

2005 ◽  
Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong
Keyword(s):  
Thermal Resistance ◽  
Heat Pipe ◽  
Thermal Control ◽  
Capillary Forces ◽  
High Heat ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Wick Structure ◽  
Flat Evaporator ◽  
Heat Loads

Loop heat pipe (LHP) is a very versatile heat transfer device that uses capillary forces developed in the wick structure and latent heat of evaporation of the working fluid to carry high heat loads over considerable distances. Robust behaviour and temperature control capabilities of this device has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper, results of the investigation on the miniature LHP (mLHP) for thermal control of electronic devices with heat dissipation capacity of up to 70 W have been discussed. Copper mLHP with disk-shaped flat evaporator 30 mm in diameter and 10 mm thickness was developed. Flat evaporators are easy to attach to the heat source without any need of cylinder-plane-reducer saddle that creates additional thermal resistance in the case of cylindrical evaporators. Wick structure made from sintered nickel powder with pore size of 3–5 μm was able to provide adequate capillary forces for the continuos circulation of the working fluid, and successfully transport heat load at the required distance of 60 mm. Heat was transferred using 3 mm ID copper tube with vapour and liquid lines of 60 mm and 200 mm length respectively. mLHP showed very reliable start up at different heat loads and was able to achieve steady state without any symptoms of wick dry-out. Tests were conducted on the mLHP with evaporator and condenser at the same level. Total thermal resistance, R total of the mLHP came out to be in the range of 1–4°C/W. It is concluded from the outcomes of the investigation that mLHP with flat evaporator can be effectively used for the thermal control of the electronic equipments with restricted space and high heat flux chipsets.

Thermal Characteristics of a Cylindrical Heat Pipe using Multi-Layer Screen Mesh Wick

2018 ◽  
Vol 10 (5) ◽  
Author(s):  
R. Sankar Rao ◽  
S. Bhanu Prakash
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Thermal Resistance ◽  
Transfer Coefficient ◽  
Heat Pipe ◽  
Thermal Characteristics ◽  
Wire Mesh ◽  
Working Fluid ◽  
Wick Structure ◽  
Screen Mesh

Heat pipe is the most widely used heat exchanging device in removal of heat from any given system at a faster rate. The thermal characteristics of heat pipe with single and multi-layered screen mesh wicks have been observed with two working fluids water and acetone. Heat pipe of length 250 mm and 12.7 mm outer diameter, made of copper material is used in all the trials of with and without wick structure. A 100 mesh stainless steel screen wire mesh is chosen as wick structure. Experiments were conducted at different heat loads and various inclinations with 100% fill ratio in evaporator. The performance is measured based on total thermal resistance and overall heat transfer coefficient. The heat pipe is found effective at 60o inclination with acetone as a working fluid and with four layered screen mesh wick. Uncertainty in thermal resistance and heat transfer coefficient is calculated for a heat input of 10W at 0 and 60 inclinations.

scholarly journals An investigation on effect of EDL on heat transfer of micro heat pipe with square and triangular cross section

2020 ◽  
Vol 21 (3) ◽  
pp. 309
Author(s):  
Maryam Fallah Abbasi ◽  
Hossein Shokouhmand ◽  
Morteza Khayat
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Double Layer ◽  
Electric Double Layer ◽  
Heat Pipes ◽  
The Body ◽  
Working Fluid ◽  
Two Phase ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

Electronic industries have always been trying to improve the efficiency of electronic devices with small dimensions through thermal management of this equipment, thus increasing the use of small thermal sinks. In this study micro heat pipes with triangular and square cross sections have been manufactured and tested. One of the main objectives is to obtain an understanding of micro heat pipes and their role in energy transmission with electrical double layer (EDL). Micro heat pipes are highly efficient heat transfer devices, which use the continuous evaporation/condensation of a suitable working fluid for two-phase heat transport in a closed system. Since the latent heat of vaporization is very large, heat pipes transport heat at small temperature difference, with high rates. Because of variety of advantage features these devices have found a number of applications both in space and terrestrial technologies. The theory of operation micro heat pipes with EDL is described and the micro heat pipe has been studied. The temperature distribution have achieved through five thermocouples installed on the body. Water and different solution mixture of water and ethanol have used to investigate effect of the electric double layer heat transfer. It was noticed that the electric double layer of ionized fluid has caused reduction of heat transfer.

Experimental Investigation of Heat Transfer of Refrigerant Fluid Pulsating Heat Pipe

2017 ◽  
Vol 865 ◽  
pp. 137-142
Author(s):  
Somchai Maneewan ◽  
Chantana Punlek ◽  
Hoy Yen Chan ◽  
Atthakorn Thongtha
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Temperature Difference ◽  
Heat Input ◽  
Filling Ratio ◽  
Working Fluid ◽  
Pulsating Heat Pipe ◽  
Filling Volume ◽  
Volume Filling

Heat transfer performances of a pulsating heat pipe (PHP) having internal and external diameter with 4.5 mm and 6 mm with various contents of refrigerant are experimentally investigated. The working fluid as R404A refrigerant was filled in the volume ratios from 0% to 80% and the heat input was controlled in the range from 10 W to 80 W. Obtained results exhibited the ability of R404A refrigerant can enhance the thermal performance in steady state condition. The average temperature difference of the evaporating section and condensing section in the 80% filling volume ratio decreased from 9.5 °C to 2.5 °C when the heating power increase from 10 W to 80 W. The thermal resistance of evaporator and condenser decreased with an increase of the heat input as well. For other filling volume ratios, the trend of temperature difference and thermal resistance was similar to that of the 80% volume filling ratio. Considering the same heat input, the highest heat transfer performance was found at the 80% volume filling ratio. Refrigerant with a relatively low dynamic consistency can lead to relatively high velocity in the PHP that can reduce the temperature difference between the evaporating section and condensing section.

scholarly journals Experimental Set up of Two Closed Loop Pulsating Heat Pipe (CLPHP) with Water base Fluids

2019 ◽  
Vol 8 (12S) ◽  
pp. 715-719
Keyword(s):  
Thermal Resistance ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Heat Pipes ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Water Mixture ◽  
Working Fluids ◽  
Pure Fluids ◽  
Acetone Water

Heat pipes are deliberated to be effective heat dissipation devices compared to other types of heat sinks due to their high effective thermal conductivity. Because of the flexibility in the design and layout of heat pipe turns along the heat source, pulsating heat pipes have gained popularity. One of the parameters that have the mainimpact on the presentation of CLPHP is the thermo physical properties of the working fluid. The properties of the working fluid affect the temperature difference between the evaporator and the condenser which in turn affect the thermal resistance of the CLPHP. In this connection, the influence of different working fluids is experimentally investigated on a two loop CLPHP, varying the evaporator heat flux. Pure fluids, viz., water, acetone, benzene and binary mixture, viz., Acetone-water and Benzene-water are utilized on working fluids. The heat input considered at the evaporator is 32W, 48W and 60W. The filling ratio is kept as 50 %. The results show that among the working fluids considered for the study, acetone exhibits least thermal resistance among the pure fluids at all heat fluxes considered in the analysis, while Acetone-water mixture has exhibited least thermal resistance among the water based mixtures.

An Experimental Investigation of a Low Heat Flux, Wickless Heat Pipe

1983 ◽  
Vol 7 (2) ◽  
pp. 96-99
Author(s):  
B.S. Larkin
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Transfer Coefficients ◽  
Electronic Package ◽  
Ambient Temperatures ◽  
Heat Transfer Coefficients ◽  
Flux Charge

This paper reports tests on a wickless heat pipe to be used for transporting heat from the ground to protect an electronic package from low ambient temperatures. Evaporating heat transfer coefficients were measured for low heat fluxes where the behaviour of the evaporating film is unpredictable. The effects of type of working fluid, heat flux, charge quantity and tube inclination were investigated.

Effect of Operational Parameters on the Thermal Performance of Flat Plate Oscillating Heat Pipe

2019 ◽  
Vol 141 (12) ◽  
Author(s):  
Kamlesh K. Mehta ◽  
Nirvesh Mehta ◽  
Vivek Patel
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Flat Plate ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Charge Ratio ◽  
Working Fluid ◽  
Operational Parameters ◽  
Oscillating Heat Pipe ◽  
Transfer Device

Abstract Flat plate oscillating heat pipe (FP-OHP) is a unique heat transfer device and considered as a promising candidate for effective heat transfer device in electronics industries. A number of theoretical studies and experimental investigations have been carried out on FP-OHP in the past decades after its invention. However, due to the operational characteristics of FP-OHP, the effect of various parameters on the thermal performance of FP-OHP has not been completely revealed so far. This paper attempts to discuss the effect of operational parameters on the thermal performance of FP-OHP. In this study, the FP-OHP was investigated with different charge ratios, orientations, working fluids, and heat loads from 10 W to 150 W. In order to investigate the effect, 18 parallel square channels of 2 × 2 mm2 are machined onto pure copper plate (93 × 70 × 8 mm3) to form FP-OHP. DI water, ethanol, methanol, acetone, and FC-72 are investigated. The measured thermal resistance was strongly dependent on operational parameters. The optimum performance was observed with acetone with a charge ratio of 70% in the vertical orientation. The lowest thermal resistance of 0.39 °C/W is achieved using acetone as a working fluid at 100 W. A Kutateladze number (Ku) was used to compare the experimental data and found to be suitable for prediction of the thermal performance of FP-OHP with standard deviation of 15%.

Experimental Investigation and Performance Evaluation of a Multi Turn Closed Loop Pulsating Heat Pipe

2014 ◽  
Vol 592-594 ◽  
pp. 1554-1558 ◽  
Author(s):  
N. Narendra Babu ◽  
Rudra Naik
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Thermal Resistance ◽  
Transfer Coefficient ◽  
Heat Pipe ◽  
Closed Loop ◽  
Experimental Result ◽  
Working Fluid ◽  
Pulsating Heat Pipe ◽  
Working Fluids

Pulsating heat pipe (PHP) is a passive heat transfer device, which transfers heat from one region to another with exceptional heat transfer capacity. It utilizes the latent heat of vaporization of the working fluid as well as the sensible heat. As a result, the effective thermal conductivity is higher than that of the conductors. An experimental study on three turn closed loop pulsating heat pipe with three different working fluids viz., Acetone, Methanol, Heptane and distilled water were employed. The PHP is made up of brass material with an inner diameter of 1.95mm, with a total length of 1150 mm for different fill ratios (FR) was employed .The PHP is tested for the thermal resistance and the heat transfer coefficient. The experimental result strongly demonstrates that acetone is a better working fluid among the working fluids considered in terms of higher heat transfer coefficient and lower thermal resistance.

Utilization of Advanced Working Fluids With Biporous Evaporators

2011 ◽  
Vol 3 (2) ◽  
Author(s):  
Sean W. Reilly ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Operating Temperature ◽  
Temperature Drop ◽  
High Heat ◽  
Heat Fluxes ◽  
Working Fluid ◽  
High Heat Flux ◽  
Inorganic Aqueous Solution ◽  
Operating Temperature Range

A novel fluid for use as a working fluid in a heat pipe has been tested at UCLA. The fluid was discovered originally in use with a device consisting of a metal tube charged with the patented inorganic aqueous solution (IAS), which is evaporated when the tube is evacuated before use. According to the patent, this evaporation leaves a thin film that allows the tube to carry high heat flux loads with low temperature drop across the tube in a solid state mode. However, various experiments with these tubes have produced inconsistent results, and there are some questions as to whether the fluid is completely evaporated. The research on which this work is based is focused on testing whether the charging fluid will operate as the working fluid in a heat pipe, in order to determine the nature of the IAS fluid. A heat pipe apparatus was charged with a biporous wick in order to investigate if the fluid plays a role in heat transfer. There are extensive data for this experiment using water as the working fluid, which will be used to compare the two sets of results. Testing has shown a reduction of the superheat required to drive heat fluxes through a wick compared to water by approximately 40%. Some experiments have shown that the operating (temperature) range of the IAS is much larger than a standard heat pipe. It is theorized that the increase in performance of the IAS is due to an increased thermal conductivity of the wick and increased capillarity. If this fluid is proven to be effective, it would lead to more effective and tunable heat transfer devices.

Thermal Performance of Carbon Nanotube Enhanced Vapor Chamber Wicks

2010 ◽  
Author(s):  
Sungwon S. Kim ◽  
Justin A. Weibel ◽  
Timothy S. Fisher ◽  
Suresh V. Garimella
Keyword(s):  
Carbon Nanotubes ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Positive Bias ◽  
Maximum Heat ◽  
Capillary Action ◽  
Wick Structure ◽  
Copper Mesh

Vapor chambers are often used as spreaders to dissipate high heat fluxes by taking advantage of liquid-vapor phase change. Wicking of the working fluid in vapor chambers is accomplished through capillary action, which is strongly affected by the wick structure. Traditionally, copper meshes with micrometer-scale pore sizes have been used as wicking structures, but it is expected that heat fluxes in the next generation of high-power electronic devices will cause boiling in these devices and lead to dryout with conventional wick materials. With a goal of increasing maximum heat dissipation and reducing thermal resistance, a wick structure composed of both conventional copper mesh and carbon nanotubes has been developed and characterized. The high-permeability mesh provides for a low-resistance bulk flow path while the carbon nanotubes, with their high thermal conductivity and high surface area, modify the wick surface for enhanced capillary action. CNT-enhanced integrated wicks were fabricated by sintering a copper mesh on Cu-Mo-Cu substrates, on which CNTs were grown. A thin layer of copper was evaporated onto the CNTs to improve wicking and wettability with water, the working fluid of interest. Samples grown under varying degrees of positive bias voltage and varying thicknesses of post-CNT-growth copper evaporation were fabricated, so that the surface morphology of the samples could be varied. The resultant boiling curves and associated wick thermal resistances indicate that micro/nano integrated wicks fabricated with higher positive bias voltages during CNT synthesis, and thicker copper coatings, lead to improved thermal performance and lower wick thermal resistance. Notably, heat fluxes at the heater surface of greater than 500 W/cm2 were observed without reaching a critical heat flux condition.

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