High Dense Plate Fin Heat Sinks Characterization and Validation

2005 ◽  
Author(s):  
Guoping Xu ◽  
Chakravarthy Akella ◽  
Lee Follmer
Keyword(s):  
Heat Transfer ◽  
Laminar Flow ◽  
Turbulent Flows ◽  
Heat Sink ◽  
Analytical Methods ◽  
Parallel Plate ◽  
Electronics Cooling ◽  
Heat Sinks ◽  
Laminar And Turbulent Regimes ◽  
Laminar And Turbulent Flows

Plate fin heat sinks are commonly used in electronics cooling including high end processors. A number of empirical and analytical methods are available to predict their performance but most of the models are valid for fin pitch larger than 3 mm heat sinks in laminar flow. The present work is to investigate high dense plate fin heat sink in both laminar and turbulent regimes. Thermal and hydraulic performance of several dense plate-fin heat sinks were characterized for high end processors in a fully-ducted wind tunnel. All the three heat sinks tested have the same dimensions of 89 mm (L) × 56 mm (W) × 50 mm (H), and fin number varied between 23 and 33. Heat sink base for all heat sinks was made of solid copper, while different fin materials of Aluminum and Copper are used. Several analytical methods for laminar flow from literature were reviewed in this study. A new heat transfer analytical method was proposed for both laminar and turbulent flows. The characterization data from these three parallel plate heat sinks were compared with the analytical methods. Finally, empirical heat transfer correlations were developed for both laminar and turbulent flows.

CFD Analysis of Flow and Heat Transfer in a Novel Heat Sink for Electronic Devices

2010 ◽  
Author(s):  
Bladimir Ramos-Alvarado ◽  
Peiwen Li ◽  
Hong Liu ◽  
Abel Hernandez-Guerrero
Keyword(s):  
Heat Transfer ◽  
Power Consumption ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Flow Channel ◽  
Heat Sinks ◽  
Temperature Fields ◽  
Pumping Power ◽  
Pressure Losses ◽  
Channel Configuration

Novel flow channel configurations in heat sinks for electronics cooling were proposed in this paper. Computational analyses were carried out to better understand the heat transfer performance, the uniformity of temperature fields of the heat sinking surface, as well as the pressure losses and pumping power in the operation of heat sinks. Comparison of the overall performance regarding to temperature uniformity on the heat sink surface and pumping power consumption was made for heat sinks having novel flow channel configurations and having traditional flow channel configurations. It has been found that the novel flow channel configuration dramatically reduces the pressure loss in the flow field. Giving the same pumping power consumption of an electronics cooling process, the temperature difference on surface of the heat sink which has novel flow channel configuration can be much lower than that of the heat sinks which have traditional flow channel configurations.

Thermal Performance of Microchannels With Dimples for Electronics Cooling

2013 ◽  
Author(s):  
Hui Lu ◽  
Liang Gong ◽  
Minghai Xu
Keyword(s):  
Heat Transfer ◽  
Laminar Flow ◽  
Integrated Circuits ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Cooling Capacity ◽  
Constant Heat Flux ◽  
Microchannel Heat Sink ◽  
Transfer Enhancement ◽  
Different Types

The thermal management of integrated circuits becomes more and more serious since the density of transistors grows gradually. Recently, a new cooling method is dedicated to develop microchannel heat sink with high integrated and high cooling efficiency. In view of above purpose, the heat transfer enhancement and pressure drop reduction in microchannel with dimples are investigated in this paper. A single module of 1mm×1mm×20mm with a microchannel was employed, which hydraulic diameter and aspect ratio are 500 μm and 2:1 respectively. For replacing the running integrated circuits, a constant heat flux of 1W/mm2 was arranged on the bottom of the heat sink. Six different types of microchannels with dimples were designed and numerically studied under the condition of laminar flow. The results show that dimple could enhance heat transfer and decrease flow resistance under the condition of laminar flow. Compared with traditional microchannel heat sink, dimple-microchannel heat sink has stronger cooling capacity, could be an attractive choice for cooling of future microelectronics.

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

2005 ◽  
Author(s):  
Felipe E. Ortega Gutierrez ◽  
Alfonso Ortega ◽  
Guoping Xu
Keyword(s):  
Heat Transfer ◽  
Excellent Agreement ◽  
Heat Sink ◽  
Parallel Plate ◽  
Ad Hoc ◽  
Static Pressure ◽  
Heat Sinks ◽  
Base Area ◽  
Fine Pitch ◽  
Made In

Detailed static pressure and temperature measurements were made in fine pitch parallel plate copper heat sinks with and without top bypass flow. A set of heat sinks with differing fin pitch and with and without anodized finish were tested in a 3rd generation cross-flow wind tunnel that provides zero to one top clearance ratio. Static pressure measurements were made in the vicinity of the heat sink in order to study the influence of the top bypass for approach velocities from 1 to 10 m/s. A comparison was made with existing ad hoc models that model the core flow with laminar theory and the inlet and exit losses with empirical correlations from the compact heat exchanger literature. In general, excellent agreement was found in the laminar regime. However, significant deviation was found for approach velocities exceeding 5 m/s, probably because the flow transitions to turbulent beyond this approach Reynolds number. In the case of flow bypass a non-iterative two-leg bypass model yielded excellent agreement for pressure drop, indicating that an ad-hoc approach such as this has value. Precise temperature measurements were taken at different stream-wise locations at the centerline of the heat sinks, under conditions where the heat sink base was heated uniformly and when the base area was heated with a smaller heat source with a 1-to-11 heater-to-base area ratio. The combined data allow the direct evaluation of base heat spreading effects. The experimental results were compared to well-known models that solve the conduction problem by assuming either an isothermal boundary condition on the top of the base of the heat sink or a specified uniform effective heat transfer coefficient. Excellent agreement was found with the latter model.

Effects of Channel Aspect Ratio on Convective Heat Transfer in an Electronics Cooling Heat Sink Having Agitation and Fan-Induced Throughflow

2013 ◽  
Author(s):  
Smita Agrawal ◽  
Longzhong Huang ◽  
Terrence Simon ◽  
Mark North ◽  
Tianhong Cui
Keyword(s):  
Heat Transfer ◽  
Aspect Ratio ◽  
Heat Sink ◽  
Single Channel ◽  
Electronics Cooling ◽  
Heat Sinks ◽  
Channel Width ◽  
Channel Height ◽  
Transfer Coefficients ◽  
Multiple Channel

Fan-driven throughflow is frequently used for convective cooling of electronics. Channels with walls behaving like fins are common. In the present study, the flow inside the channels is agitated by means of translationally oscillating plates called agitators. Effectiveness of agitation by oscillating blades is found to be dependent on the channel width, a parameter studied herein. Heat sinks having narrower channels have a greater number of channels in total for the fixed size of heat sink and therefore greater heat transfer area than heat sinks with wider channels. Thus, with the same channel height, as the aspect ratio increases, channel width decreases, and it is found that opportunities for agitation are reduced and the generated turbulence is more strongly damped, thus reducing heat transfer coefficients. A study was carried out to find direction toward an optimal number of channels for a given heat sink using the agitation strategy. As part of the study, fluid damping and power consumption to drive the agitator assembly were addressed. The study was done numerically using ANSYS FLUENT on a representative single channel of the heat sink and the results were extended to the full size, multiple-channel heat sink system. Recommendations for moving toward an optimum geometry, based on thermal performance and agitator power are made.

scholarly journals Nonlocal Modeling and Swarm-Based Design of Heat Sinks

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
David Geb ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Optimization Methods ◽  
Volume Averaging ◽  
Population Based ◽  
Design Tool ◽  
Heat Sinks ◽  
Optimal Designs ◽  
Traditional Approaches

Cooling electronic chips to satisfy the ever-increasing heat transfer demands of the electronics industry is a perpetual challenge. One approach to addressing this is through improving the heat rejection ability of air-cooled heat sinks, and nonlocal thermal-fluid-solid modeling based on volume averaging theory (VAT) has allowed for significant strides in this effort. A number of optimization methods for heat sink designers who model heat sinks with VAT can be envisioned due to VAT's singular ability to rapidly provide solutions, when compared to computational fluid dynamics (CFD) approaches. The particle swarm optimization (PSO) method appears to be an attractive multiparameter heat transfer device optimization tool; however, it has received very little attention in this field compared to its older population-based optimizer cousin, the genetic algorithm (GA). The PSO method is employed here to optimize smooth and scale-roughened straight-fin heat sinks modeled with VAT by minimizing heat sink thermal resistance for a specified pumping power. A new numerical design tool incorporates the PSO method with a VAT-based heat sink solver. Optimal designs are obtained with this new tool for both types of heat sinks, the performances of the heat sink types are compared, the performance of the PSO method is discussed with reference to the GA method, and it is observed that this new method yields optimal designs much quicker than traditional approaches. This study demonstrates, for the first time, the effectiveness of combining a VAT-based nonlocal thermal-fluid-solid model with population-based optimization methods, such as PSO, to design heat sinks for electronics cooling applications. The VAT-based nonlocal modeling method provides heat sink design capabilities, in terms of solution speed and model rigor, that existing modeling methods do not match.

Validation of Analytical Methods for Parallel Plate Fin Heat Sinks

2004 ◽  
Author(s):  
Guoping Xu ◽  
Henry Jung
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Pressure Drop ◽  
Test Data ◽  
Analytical Methods ◽  
Parallel Plate ◽  
Heat Sinks ◽  
Analytical Models ◽  
Experimental Investigations ◽  
Duct Flow

Several analytical models to predict heat transfer and pressure drop performance for parallel plate fin heat sinks are available in the literature. However, the experimental data to validate these models are very limited especially for high fin density heat sinks. In this paper, a new method is proposed to predict thermal performance in both laminar flow and turbulent flow. This method and other models selected from the literature have been compared to the test data. Experimental investigations were conducted with fully-duct flow for parallel plate fin heat sinks to measure overall thermal resistance and pressure drop. Three heat sinks with different fin materials and fin configurations are tested. We conclude by recommending some of the analytical methods for engineering applications by comparing the test data with predictions.

scholarly journals Experimental study on heat transfer performance of variable area straight fin heat sinks with PCM

2021 ◽  
pp. 299-299
Author(s):  
Rajasekaran Madhaiyan ◽  
Kannan Thannir Pandal Palayam Kandasamy ◽  
Kumaragurubaran Balasubramanian ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronics Cooling ◽  
Reynolds Numbers ◽  
Heat Sinks ◽  
Base Temperature ◽  
Pin Fin ◽  
Constant Area

The thermal performance of heat sinks with variable area straight fins with and without PCM is quantitatively explored in this article. The effects of diverse fin geometries (constant area straight fin, variable area straight fin, circular pin fin, hemispherical pin fin, and elliptical pin fin), varying Reynolds numbers, and fin densities on boosting electronics cooling performance were investigated. The goal of this research is to develop the best fin geometry for electronics cooling technologies. This research demonstrates that altering fin density can improve heat sink thermal performance while also reducing heat sink weight. The base temperature of the heat sink is found to be lower in variable area straight fins. In comparison to alternative configurations for heat transfer with PCM, the results show that variable area straight fin heat sinks are the most effective. The thermal resistance of the improved heat sink with variable fin density was reduced by 9%.

Performance of a Heat Sink With Interrupted and Staggered Elliptic Fins

2010 ◽  
Author(s):  
Suabsakul Gururatana ◽  
Xianchang Li
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Technology Development ◽  
Hot Spot ◽  
Flow Direction ◽  
Electronics Cooling ◽  
Heat Transfer Process ◽  
Heat Sinks ◽  
Temperature Fields ◽  
Base Surface

The power density of electronic devices has been increasing along with the rapid technology development. Cooling of electronic systems is therefore essential in controlling the component temperature and avoiding any hot spot. Heat sinks are commonly adopted in electronics cooling together with different technologies to enhance heat transfer process. Fin-based heat sinks are commonly designed so that coolants (gas or liquid) are forced to pass through the narrow straight channel. A driving fan is then needed to overcome the viscous pressure loss and maintain the coolant flow. As part of effort to improve the heat sink performance, this study simulated the details of the flow and temperature fields of heat sinks with interrupted and staggered elliptic fins cooled by forced convection. The focus of this study lies on three scenarios: Heat transfer before the flow reaches the periodic condition in the flow direction; effect of the heat sink base surface on flow and heat transfer; and conjugate heat transfer between convection and heat conduction inside the fins. In addition, studies were also conducted on the effect of the Reynolds number. The results of this paper can help design heat sinks for electronics cooling by employing the new concept of interrupted and staggered fins.

Simulation of Fluid Flow and Heat Transfer of Flat Plate Heat Sinks With Spiral Inserts

2010 ◽  
Author(s):  
Ganesh Subbuswamy ◽  
Xianchang Li
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Pressure Loss ◽  
High Performance ◽  
Electronics Cooling ◽  
Narrow Channel ◽  
Heat Sinks ◽  
Modern World ◽  
Net Benefit ◽  
Flow And Heat Transfer

High performance electronic chips are finding applications in almost all equipments in the modern world. However, these chips are coupled with potential overheating, which has been a serious concern for manufacturers as well as researchers ever. One of the best options for electronics cooling is to take advantage of heat sinks. Over years, many studies are focused on optimal designs of heat sinks, while some are also targeted at heat transfer enhancement. To explore how the heat sink performance can be further improved, this study integrates spiral tape inserts into the narrow channel of plate-finned heat sinks. Numerical simulation is carried out to examine the flow and heat transfer behavior of heat sinks with spiral inserts. Different parameters such as insert width, twist ratio, and the flow Reynolds number are investigated. It is observed that the inserts significantly increase the heat transfer rate with a penalty of higher pressure loss. In one of the cases studied, the heat transfer is increased by 368% with a rise of 810% in pressure drop. However, the inserts can produce a net benefit when the same pressure loss or fan power is considered. Therefore, the inserts can help make the heat sink more effective by reducing its size.

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