Wire Flexure Fatigue Model for Asymmetric Bond Height

2003 ◽  
Author(s):  
Karumbu Nathan Meyyappan ◽  
Peter Hansen ◽  
Patrick McCluskey
Keyword(s):  
Prediction Model ◽  
Life Prediction ◽  
Damage Model ◽  
Cyclic Strain ◽  
Design Guidelines ◽  
Temperature Cycling ◽  
Transformation Model ◽  
Test Results ◽  
The Wire ◽  
Life Prediction Model

This paper presents the first physics-of-failure based life prediction model for flexural failure of wires ultrasonically wedge bonded to pads at different heights. The life prediction model consists of a load transformation model and a damage model. The load transformation model determines the cyclic strain at the heel of the wire during temperature cycling. This cyclic strain is created by a change in wire curvature at the heel of the wire resulting from expansion of the wire and displacement of the frame. The damage model calculates the life based on the strain cycle magnitude and the elastic-plastic fatigue response of the wire. The model supports virtual qualification of power modules where wire flexural fatigue is a dominant failure mechanism. The model has been validated using temperature cycling test results, and can be used to derive design guidelines and establish a relation between accelerated test results and field life.

Wire Fatigue Models for Power Electronic Modules

2003 ◽  
Author(s):  
Karumbu Nathan Meyyappan ◽  
Peter Hansen ◽  
Patrick McCluskey
Keyword(s):  
Prediction Model ◽  
Life Prediction ◽  
Damage Model ◽  
Cyclic Strain ◽  
Temperature Cycling ◽  
Transformation Model ◽  
Time To Failure ◽  
Flexural Failure ◽  
The Wire ◽  
Life Prediction Model

This paper presents two, semi-analytical, physics-of-failure based life prediction model formulations for flexural failure of wires ultrasonically wedge bonded to pads at different heights. The life prediction model consists of a load transformation model and a damage model. The load transformation model determines the cyclic strain is created by a change in wire curvature at the heel of the wire resulting from expansion of the wire and displacement of the frame. The damage model calculates the life based on the strain cycle magnitude and the elastic-plastic fatigue response of the wire. The first formulation provides quick calculation of the time to failure for a wire of known geometry. The second formulation optimizes the wire geometry for maximum time to failure. These model formulations support virtual qualification of power modules where wire flexural fatigue is a dominant failure mechanism. The model has been validated using temperature cycling test results.

Thermal Fatigue Life Determination of CCGA Interconnect Using a Simple Method

2007 ◽  
Author(s):  
T. E. Wong ◽  
C. Chu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Temperature Cycling ◽  
Test Results ◽  
Electronic Package ◽  
Thermal Fatigue Life ◽  
Life Prediction Model

A simplified method was developed to determine the fatigue life of a ceramic column grid array (CCGA) solder joint when exposed to thermal environments. The CCGA package with 90Pb/10Sn solder columns is soldered onto the printed circuit board with a tin-lead solder paste. Failure of the solder joint occurs at the CCGA solder column. A closed-form solution with the equilibrium of displacements of electronic package assembly was first derived to calculate the solder joint strains during the temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution in the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials, which used elastic-plastic properties. A fatigue life prediction model, evolved from an empirically derived formula based upon a modified Coffin-Manson fatigue theory, was then established. CCGA test results, obtained from various sources, combined with the derived solder strains were used to calibrate the proposed life prediction model. In the model calibration process, the 625- and 1657-pin CCGA test results, which were cycled between 20°C/90°C, 0°C/100°C, −55°C/110°C, or −55°C/125°C, were reasonably well correlated to the calculated values of solder strains. In addition, this calibrated model is remarkably simple compared to the model used in an evaluation by a finite element analysis. Therefore, this model could be used and is recommended to serve as an effective tool to make a preliminarily estimate at the CCGA solder joint thermal fatigue life. It is also recommended to 1) select more study cases with various solder joint configurations, package sizes, environmental profiles, etc. to further calibrate this life prediction model, 2) use this model to conduct parametric studies to identify critical factors impacting solder joint fatigue life and then seeking an optimum design, and 3) develop a similar life prediction model for lead-free solder materials.

CBGA Solder Joint Thermal Fatigue Life Estimation by a Simple Method

2003 ◽  
Author(s):  
T. E. Wong ◽  
C. Y. Lau ◽  
H. S. Fenger
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Test Results ◽  
Electronic Package ◽  
Eutectic Solder ◽  
Thermal Fatigue Life ◽  
Life Prediction Model

A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic solder on both top and bottom of the ball. Failure of the solder joint occurs at the eutectic solder. A closed-form solution with the equilibrium of displacements of electronic package assembly was first developed to calculate the solder joint strains during the temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution in the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials, which used elastic-plastic properties. A fatigue life prediction model, evolved from an empirically derived formula based upon a modified Coffin-Manson fatigue theory, was then established. CBGA test results, obtained from Motorola, combined with the derived solder strains were used to calibrate the proposed life prediction model. In the model calibration process, the 255- and 304-pin CBGA test results, which were cycled between 0°C and 100°C or −40°C and 125°C, were reasonably well correlated to the calculated values of solder strains. In addition, this calibrated model is remarkably simple compared to the model used in an evaluation by finite element analysis. Therefore, this model could be used and is recommended to serve as an effective tool to preliminarily estimate the CBGA solder joint thermal fatigue life.

scholarly journals Fatigue Life Prediction of Reinforced Concrete Beams Strengthened with CFRP: Study Based on an Accumulative Damage Model

Polymers ◽  
2019 ◽  
Vol 11 (1) ◽  
pp. 130 ◽  
Author(s):  
Xin-Yan Guo ◽  
Yi-Lin Wang ◽  
Pei-Yan Huang ◽  
Xiao-Hong Zheng ◽  
Yi Yang
Keyword(s):  
Reinforced Concrete ◽  
Fatigue Life ◽  
Carbon Fiber ◽  
Prediction Model ◽  
Life Prediction ◽  
Damage Model ◽  
Fatigue Life Prediction ◽  
Rc Beams ◽  
Rc Structures ◽  
Life Prediction Model

With the prestressed carbon fiber reinforced polymer (CFRP) strengthening technique widely used in reinforced concrete (RC) structures, it is more and more important to study the fatigue performance of RC structures. Since the fracture of a tensile steel bar at the main cracked section is the leading reason for the failure of RC beams reinforced by prestressed CFRP, a fatigue life prediction model of RC beams reinforced by prestressed CFRP was developed based on an accumulative damage model. Moreover, gradual degradation of the performance of the concrete was considered in the fatigue life prediction model. An experimental study was also conducted to research the fatigue behavior of RC beams reinforced by prestressed or non-prestressed carbon fiber laminate (CFL). During the tests, fatigue crack patterns were captured using a digital image correlation (DIC) technique, and the fatigue lives of a total of 30 beams were recorded. The results showed that the predicted main crack propagation curves and the fatigue lives were close to the experimental data. This study also exhibited that the prestressed CFRP could reduce the stress of main steel bars in RC beams and effectively improve the fatigue performance of the RC beams.

scholarly journals Life Prediction Model of Mineral Admixture Cement Based-Materials under Early Age CO2-Erosion

Coatings ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 413
Author(s):  
Saisai Wang ◽  
Jian Chen ◽  
Xiaodong Wen
Keyword(s):  
Prediction Model ◽  
Life Prediction ◽  
Experimental Tests ◽  
Mineral Admixture ◽  
Model Parameters ◽  
Influence Coefficient ◽  
Test Pieces ◽  
Cement Based Materials ◽  
Particle Group ◽  
Life Prediction Model

Most of the existing models of structural life prediction in early carbonized environment are based on accelerated erosion after standard 28 days of cement-based materials, while cement-based materials in actual engineering are often exposed to air too early. These result in large predictions of the life expectancy of mineral-admixture cement-based materials under early CO2-erosion and affecting the safe use of structures. To this end, different types of mineral doped cement-based material test pieces are formed, and early CO2-erosion experimental tests are carried out. On the basis of the analysis of the existing model, the influence coefficient of CO2-erosion of the mineral admixture Km is introduced, the relevant function is given, and the life prediction model of the mineral admixture cement-based material under the early CO2-erosion is established and the model parameters are determined by using the particle group algorithm (PSO). It has good engineering applicability and guiding significance.

The construction of the life prediction model of 1N and 4N monopropellant thrusters

2013 ◽  
Author(s):  
Go Fujii ◽  
Daisuke Goto ◽  
Hideshi Kagawa ◽  
Shingo Murayama ◽  
Kenichi Kajiwara ◽  
...  
Keyword(s):  
Prediction Model ◽  
Life Prediction ◽  
Life Prediction Model
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