Nondestructive Inspection of Chip Size Package by Millimeter Waves
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Chip size package was inspected by millimeter waves. Millimeter wave image was created using the phase and amplitude of the reflection coefficient, measured by a network analyzer. To obtain a high spatial resolution, an open-ended coaxial line sensor was used. Solder bumps and delamination under the silicon chip of the package were observed effectively. It is shown that millimeter wave technique has a good prospect for integrity assessment of chip size package.
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2014 ◽
Vol 2014
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pp. 1-5
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