Through-Hole Drilling Condition of FR-4 Printed Wiring Boards Based on Preventing Ion Migration

2003 ◽  
Author(s):  
Eiichi Aoyama ◽  
Hiromichi Nobe ◽  
Tadayuki Ikuta ◽  
Tsutao Katayama ◽  
Toshiki Hirogaki ◽  
...  
Keyword(s):  
Feed Rate ◽  
Manufacturing Sector ◽  
Present Report ◽  
Hole Drilling ◽  
Glass Cloth ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Ion Migration ◽  
Hole Wall ◽  
Through Hole

In the printed wiring board manufacturing sector, methods have been developed to improve the circuit packaging density. A problem has emerged in that the quality of drilled through hole is deteriorating in the smaller diameter drilling of printed wiring boards (PWBs) with high packaging density, because the insulation is insufficient among through-holes after plating in finer circuit pattern. Thus, we have attracted attention to occurrence of delamination in the glass cloth around the drilled hole of FR-4 type PWBs, because it is considered that the poor insulation among through holes is caused by ion migration along the delamination of glass cloth. In the drilling hole to GFRP, Damage occurs from the drilled hole wall to the inside of material by peeling off between layers, it is defined as delamination in this study. In the present report, we describe the influence of drilling conditions on the width of delamination of glass cloth around the drilled hole. First, we made the FR-4 type PWBs (thickness 0.2 mm) reinforced by five kinds of glass cloths. We carried out the drilling experiments (spindle speed 33000rpm and feed rate 0.01–0.06 mm/rev) for these PWBs with diameter 0.4 mm drill tools. Second, we researched the relationship between delamination width and relative hole position for the glass cloth thickness by image processing method. As a result, we demonstrate two important factors (the feed rate conditions in drilling and the thickness of glass cloth at drilled hole wall) to prevent the delamination of glass cloth. The practical formula is proposed to predict the delamination width around the drilled hole by a multivariate analysis method.

Quality Control of Micro-Drilled Hole Wall of PWBs Using Data-Mining

2005 ◽  
Author(s):  
Eiichi Aoyama ◽  
Toshiki Hirogaki ◽  
Keiji Ogawa ◽  
Tsuyoshi Otsuka ◽  
Katsutoshi Yamauchi
Keyword(s):  
Data Mining ◽  
Surface Roughness ◽  
Present Report ◽  
Weft Yarn ◽  
Hole Drilling ◽  
Printed Wiring Boards ◽  
Factors Affecting ◽  
Hole Wall ◽  
Using Data ◽  
Through Hole

In the manufacturing of printed wiring boards (PWBs), various methods have been developed in order to improve the circuit packaging density. Micro-drills are generally used to make smaller diameter through-holes in PWBs, which are desired for the miniaturization of equipment. However, a problem has emerged in that copper plating degraded by hole drilling can reduce the reliability of the electrical connection between layers. The surface roughness of drilled hole wall is one of the important factors affecting the plating quality. The purpose of the present report is to apply data-mining to the surface roughness data of drilled through-hole walls, and to elucidate the factors required to control the drilled hole quality. The following conclusions were obtained. (1) The data-mining aided by a computer was found to be effective to control the drilled hole wall quality in the PWBs manufacturing. (2) It was clear that the surface roughness of drilled hole walls depended on three factors: the drill temperature, cutting distance, and the width of the fiber bundle of weft yarn.

CAM System Based on Constant Drill Hole Temperature for Drilling in Printed Wiring Board

2007 ◽  
Author(s):  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Seita Sumida
Keyword(s):  
High Speed ◽  
Tool Path ◽  
Present Report ◽  
New Technology ◽  
Drill Hole ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Grid Pattern ◽  
High Speed Drilling ◽  
Wiring Board

Recently, printed wiring boards (PWBs) employed in electronic devices have been miniaturized, lightened, and made multifunctional. Therefore, a new technology is required to improve the mounting density of PWBs. In the present report, we study high-quality, high-speed drilling of through-holes in PWBs. Particularly, we investigate the tool path for drilling grid-pattern holes. We estimate the drill temperature and PWB temperature while drilling the PWBs. On the basis of the results, we propose a tool path decision method that considers heat damage on the PWBs for a drilling CAM system.

Hole Accuracy during Deep Hole Drilling for Hydraulic Cylinder Application

2014 ◽  
Vol 984-985 ◽  
pp. 67-72 ◽  
Author(s):  
R. Clifford Benjamin Raj ◽  
B. Anand Ronald ◽  
A. Velayudham ◽  
Prasmit Kumar Nayak
Keyword(s):  
Feed Rate ◽  
Drill Hole ◽  
Hydraulic Cylinder ◽  
High Accuracy ◽  
Diameter Ratio ◽  
Hole Drilling ◽  
Deep Hole ◽  
Deep Hole Drilling ◽  
Very High ◽  
Continuous Chip

Deep-hole drilling is a process in which the hole length will be very high when compared to diameter of the drill hole (i.e. length to diameter ratio will be greater than 5). Drilling a deep hole with very high accuracy is difficult process. The current project is about the production of deep hole with the aim to produce a chip which is not a continuous chip and also not a powdery chip. These conditions can be attained by varying the spindle speed and the tool feed rate.

scholarly journals Optimization of Surface Roughness in Deep Hole Drilling using Moth-Flame Optimization

2019 ◽  
Vol 18 (3-2) ◽  
pp. 62-68
Author(s):  
Anis Farhan Kamaruzaman ◽  
Azlan Mohd Zain ◽  
Razana Alwee ◽  
Noordin Md Yusof ◽  
Farhad Najarian
Keyword(s):  
Surface Roughness ◽  
Optimization Algorithm ◽  
Feed Rate ◽  
Spindle Speed ◽  
Hole Drilling ◽  
P Value ◽  
Machining Parameters ◽  
Deep Hole ◽  
Deep Hole Drilling ◽  
Moth Flame Optimization Algorithm

This study emphasizes on optimizing the value of machining parameters that will affect the value of surface roughness for the deep hole drilling process using moth-flame optimization algorithm. All experiments run on the basis of the design of experiment (DoE) which is two level factorial with four center point. Machining parameters involved are spindle speed, feed rate, depth of hole and minimum quantity lubricants (MQL) to obtain the minimum value for surface roughness. Results experiments are needed to go through the next process which is modeling to get objective function which will be inserted into the moth-flame optimization algorithm. The optimization results show that the moth-flame algorithm produced a minimum surface roughness value of 2.41µ compared to the experimental data. The value of machining parameters that lead to minimum value of surface roughness are 900 rpm of spindle speed, 50 mm/min of feed rate, 65 mm of depth of hole and 40 l/hr of MQL. The ANOVA has analysed that spindle speed, feed rate and MQL are significant parameters for surface roughness value with P-value <0.0001, 0.0219 and 0.0008 while depth of hole has P-value of 0.3522 which indicates that the parameter is not significant for surface roughness value. The analysis also shown that the machining parameter that has largest contribution to the surface roughness value is spindle speed with 65.54% while the smallest contribution is from depth of hole with 0.8%. As the conclusion, the application of artificial intelligence is very helpful in the industry for gaining good quality of products.

Optimization of Feed Speed and Stroke for Step Micro Hole Drilling of Printed Wiring Boards by Response Surface Method

2012 ◽  
Vol 523-524 ◽  
pp. 509-514 ◽  
Author(s):  
Naoya Noguchi ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Yutaka Takeda
Keyword(s):  
Response Surface ◽  
Response Surface Method ◽  
High Speed ◽  
Hole Drilling ◽  
Feed Speed ◽  
Printed Wiring Boards ◽  
Step Cycle ◽  
Stroke Length ◽  
Surface Method ◽  
Micro Drilling

There have been few reports dealing with the drilling of printed wiring boards (PWBs) with micro-drills that are smaller than 0.2 mm in diameter, and super-high-speed spindles that are higher than 160,000 rpm. In these cases, preventing the micro-drill from breaking and keeping the position accuracy of the drilled hole has been difficult. We therefore focus on the high-speed step-drilling method and short stroke as a novel way of resolving these problems. On the other hand, determining the complicated combination of feed speed, rapid feed speed, and stroke length is difficult. Under these backgrounds, in this report we propose a fast-feed step cycle that use fast-feed command without the processing feed. Thus, we attempted to apply the response surface method to optimize these parameters. As a result, a proposed method was found to be effective to improve the drilled hole quality and drilling efficiency in such kinds of micro-drilling of the PWBs.

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

2013 ◽  
Author(s):  
Adam Pearl ◽  
Michael Osterman
Keyword(s):  
Failure Mode ◽  
Surface Finish ◽  
Electroless Nickel ◽  
Primary Role ◽  
Mechanical Shock ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Bga Packages ◽  
Immersion Silver ◽  
Component Interface

Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG), which has been used in component packaging, has been gaining attention as a surface finish for printed wiring boards. The primary role of a printed wiring board surface finish is to provide a solderable surface for assembly, creating a reliable solder interconnect. With regards to reliability, the increased use of mobile electronics has resulted in the need to consider the ability of interconnects to withstand repeated mechanical shocks. This paper examines the drop reliability of both SnPb and SAC305 interconnects formed on ENEPIG finished printed wiring boards. For comparison, the drop reliability test results for similar boards with Immersion Silver (ImAg) board finish are included. Test boards include BGA and resistor packages. The boards are dropped 500 times to achieve failure across the components. Failure analysis revealed that the dominant failure mode for BGA packages on the ENEPIG finish was cracking in the solder balls at the component interface, while for the ImAg finish the dominant failure mode was cratering in the board laminate below the solder pad. For the resistor packages, cracking through the solder joint at the component interface was the dominant failure mode for both the ENEPIG and ImAg finishes. The drop results indicate that both finishes are suitable for systems that could experience mechanical shock due to drop, with components soldered onto ENEPIG with a SAC 305 solder having the highest survivability. The combination of SnPb and ImAg was found to be superior to SAC 305 and ImAg.

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