Vibration Fatigue Test of Surface Mount Electronic Components

2003 ◽  
Author(s):  
T. E. Wong ◽  
H. S. Fenger
Keyword(s):  
Solder Joint ◽  
Random Vibration ◽  
Flip Chip ◽  
Prediction Models ◽  
Physical Analysis ◽  
Test Results ◽  
Printed Wiring Board ◽  
Joint Stress ◽  
Vibration Fatigue ◽  
Vibration Tests

The objectives of the present studies are to design and test representative commercial off-the-shelf plastic encapsulated microcircuits, including various types of ball grid array (BGA) components, chip scale package, flip chip, lead flat pack, and leadless capacitor, over military random vibration levels. The approach is to demonstrate the solder joint reliability performance of these components through the design of an electrical daisy-chain pattern printed wiring board (PWB) assembly test vehicle (TV), in which the design and manufacturing variables are included. The three variables, including BGA underfilled materials, solder pad sizes on PWB, and BGA rework, with each having either two or three levels of variation are used to address test criteria and to construct 14 different types of TV configurations. All TV configurations are then subjected to random vibration tests while continuously monitoring solder joint integrity. Based on the measured results, a destructive physical analysis is then conducted to further isolate the failure locations and determine the failure mechanisms of the solder joints. Test results indicate that the 352-pin tape BGA and 600-pin super BGA are more susceptible to failure than plastic BGAs under the same conditions, and that the use of underfilled materials appears to improve the life expectancy of all the components. The stiffer packages of tape BGA and super BGA, which have copper heat spreaders, may account for higher BGA solder joint stress/strain during random vibration tests. Test data also shows that only a limited number of electrical opening are observed. This indicates that the test modules are robust enough to survive the random vibration inputs. One possible reason is that the test modules are very stiff, whose 1st mode of natural frequency is about 550 Hz. Therefore, the curvature changes of the test modules are minimal, which resulted in smaller relative motion between the package and the PWB, and less solder joint stresses. All these test results are recommended to be used for calibrating BGA solder joint vibration fatigue life prediction models, which will be presented in other publications.

COTS BGA Thermal Fatigue Test for Avionics Applications

2003 ◽  
Author(s):  
H. S. Fenger ◽  
T. E. Wong
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Prediction Models ◽  
Thermal Environment ◽  
Temperature Cycling ◽  
Physical Analysis ◽  
Test Results ◽  
Conformal Coating ◽  
Design And Manufacturing

The objectives of the present studies are to design and test representative commercial off-the-shelf plastic encapsulated microcircuits, including various types of ball grid array (BGA) components, chip scale package, and flip chip over military thermal environment. The approach is to demonstrate the solder joint reliability performance of these components through the design of an electrical daisy-chain pattern printed wiring board (PWB) assembly test vehicle (TV), in which the design and manufacturing variables are included. The variables, including the types of PWBs, conformal coating, and BGA underfilled materials, with each having either two or three levels of variation are used to address test criteria and to construct 12 different types of TV configurations. All TV configurations are then subjected to temperature cycling tests (−55°C to +125°C) while continuously monitoring solder joint integrity. Based on the measured results, a destructive physical analysis is then conducted to further isolate the failure locations and determine the failure mechanisms of the solder joints. Based on the lesson-learned from the above TV, a second TV (defined as TV2) has been designed, constructed and tested. The four selected parameters in TV2 are BGA under-fill materials, conformal coating, solder pad sizes on PWB, and BGA rework, with each also having either two or three levels of variation. Test results from these two groups of TVs indicate that the influence of these design and manufacturing parameters on fatigue life is dependent on the particular package, in some instances improving the fatigue life tenfold. All these test results are recommended to be used for calibrating BGA solder joint thermal fatigue life prediction models, which will be presented in other publications.

Force-Limiting Testing for the Small Explorer Satellite Program at NASA Goddard Space Flight Center

2000 ◽  
Vol 43 (1) ◽  
pp. 24-30 ◽  
Author(s):  
Daniel Kaufman
Keyword(s):  
Random Vibration ◽  
Force Feedback ◽  
Wide Field ◽  
Space Craft ◽  
Test Results ◽  
Force Measurements ◽  
Nasa Goddard Space ◽  
Trace Space ◽  
Goddard Space Flight Center ◽  
Vibration Tests

The Wide Field Infrared Explorer (WIRE) and Transition Region Coronal Explorer (TRACE) Space-craft underwent random vibration testing using force-limiting techniques as a means of controlling the vibration input motions. Interface force measurements were made for random vibration tests. Automatic force feedback notching was provided for the random vibration tests. This paper presents the methods employed to determine force spectrums. Test results are presented to show the effects of the force-limiting technique.

Effect of Filling with Adhesive on Solder Alloys Subjected to Random Vibration

2012 ◽  
Vol 163 ◽  
pp. 34-38
Author(s):  
Nuo Bao ◽  
Chun Jie Wang ◽  
Lin Zhu ◽  
Shun Guang Song
Keyword(s):  
Finite Element Analysis ◽  
Stress Distribution ◽  
Solder Joint ◽  
Random Vibration ◽  
Maximum Stress ◽  
Solder Joints ◽  
Peak Time ◽  
Element Analysis ◽  
Joint Stress ◽  
Maximum Value

In order to obtain a better filling way with suitable adhesive to enhance the reliability of 3D PLUS solder joints. Finite element analysis of random vibration method was carried out. By means of the method, the effect of filling way on the stress distribution in solder joints was investigated under the condition of two types adhesives 55/9 and GD414. Stress distribution and its maximum value of 3D PLUS solder joint at peak time were acquired. Comparative analysis of the maximum stress between under filled adhesive and side filled adhesive with 55/9 or GD414 respectively. The results showed that under filled adhesive 55/9 can effectively improve the solder joint stress.

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

2000 ◽  
Author(s):  
T. E. Wong ◽  
F. W. Palmieri ◽  
L. A. Kachatorian
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Life Prediction ◽  
Random Vibration ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Vibration Fatigue ◽  
Joint Vibration ◽  
Life Prediction Model

Abstract A newly developed methodology is used to support test validation of ball grid array (BGA) solder joint vibration fatigue life prediction model. This model is evolved from an empirical formula of universal slopes, which is derived from high-cycle fatigue test data using a curve fitting technique over 29 different materials of metals. To develop the BGA solder joint vibration fatigue life prediction model, a test vehicles (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed, fabricated and subjected to random vibration tests with continuously monitoring the solder joint integrity. Based on the measurement results, a destructive physical analysis is then conducted to further verify the failure locations and crack paths of the solder joints. Next, a method to determine the stresses/strains of BGA solder joints resulting from exposure of the TV to random vibration environments is developed. In this method, a 3-D modeling technique is used to simulate the vibration responses of the BGA packages. Linear static and dynamic finite element analyses with MSC/NASTRAN™ computer code, combined with a volume-weighted average technique, are conducted to calculate the effective strains of the solder joints. In the calculation process, several in-house developed Fortran programs, in conjunction with the outputs obtained from MSC/NASTRAN™ static and frequency response analyses, are used to perform the required computations. Finally, a vibration fatigue life model is established with two unknown parameters, which can be determined by correlating the derived solder effective strains to the test data. This test-calibrated model is then recommended to serve as an effective tool to determine the integrity of the BGA solder joints during vibration. Selecting more study cases with various package sizes, solder ball configurations, vibration profiles to further calibrate this model is also recommended. An example of a 313-pin plastic and 304-pin ceramic BGAs is illustrated in the present study.

Manufacturing In-Line Whole Wafer Focused Ion Beam (FIB) Memory Address Descramble Verification

2008 ◽  
Author(s):  
Steven B. Herschbein ◽  
Hyoung H. Kang ◽  
Scott L. Jansen ◽  
Andrew S. Dalton
Keyword(s):  
Flip Chip ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Random Access ◽  
Cell Counting ◽  
Test Results ◽  
Laboratory Procedure ◽  
Memory Array ◽  
Dual Beam ◽  
Process Level

Abstract Test engineers and failure analyst familiar with random access memory arrays have probably encountered the frustration of dealing with address descrambling. The resulting nonsequential internal bit cell counting scheme often means that the location of the failing cell under investigation is nowhere near where it is expected to be. A logical to physical algorithm for decoding the standard library block might have been provided with the design, but is it still correct now that the array has been halved and inverted to fit the available space in a new processor chip? Off-line labs have traditionally been tasked with array layout verification. In the past, hard and soft failures could be induced on the frontside of finished product, then bitmapped to see if the sites were in agreement. As density tightened, flip-chip FIB techniques to induce a pattern of hard fails on packaged devices came into practice. While the backside FIB edit method is effective, it is complex and expensive. The installation of an in-line Dual Beam FIB created new opportunities to move FA tasks out of the lab and into the FAB. Using a new edit procedure, selected wafers have an extensive pattern of defects 'written' directly into the memory array at an early process level. Bitmapping of the RAM blocks upon wafer completion is then used to verify correlation between the physical damaged cells and the logical sites called out in the test results. This early feedback in-line methodology has worked so well that it has almost entirely displaced the complex laboratory procedure of backside FIB memory array descramble verification.

scholarly journals Practical Prediction Models of Tensile Strength and Reinforcement-Concrete Bond Strength of Low-Calcium Fly Ash Geopolymer Concrete

Polymers ◽  
2021 ◽  
Vol 13 (6) ◽  
pp. 875
Author(s):  
Chenchen Luan ◽  
Qingyuan Wang ◽  
Fuhua Yang ◽  
Kuanyu Zhang ◽  
Nodir Utashev ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Fly Ash ◽  
Bond Strength ◽  
Prediction Models ◽  
Splitting Tensile Strength ◽  
Geopolymer Concrete ◽  
Structural Factors ◽  
Test Results ◽  
Portland Cement Concrete ◽  
Low Calcium

There have been a few attempts to develop prediction models of splitting tensile strength and reinforcement-concrete bond strength of FAGC (low-calcium fly ash geopolymer concrete), however, no model can be used as a design equation. Therefore, this paper aimed to provide practical prediction models. Using 115 test results for splitting tensile strength and 147 test results for bond strength from experiments and previous literature, considering the effect of size and shape on strength and structural factors on bond strength, this paper developed and verified updated prediction models and the 90% prediction intervals by regression analysis. The models can be used as design equations and applied for estimating the cracking behaviors and calculating the design anchorage length of reinforced FAGC beams. The strength models of PCC (Portland cement concrete) overestimate the splitting tensile strength and reinforcement-concrete bond strength of FAGC, so PCC’s models are not recommended as the design equations.

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability

scholarly journals Experimental Design and Validation of an Accelerated Random Vibration Fatigue Testing Methodology

2015 ◽  
Vol 2015 ◽  
pp. 1-13 ◽  
Author(s):  
Yu Jiang ◽  
Gun Jin Yun ◽  
Li Zhao ◽  
Junyong Tao
Keyword(s):  
Fatigue Life ◽  
Stress Responses ◽  
Life Prediction ◽  
Random Vibration ◽  
Fatigue Testing ◽  
Fatigue Tests ◽  
Fatigue Life Prediction ◽  
Power Spectral ◽  
Vibration Fatigue ◽  
Non Gaussian

Novel accelerated random vibration fatigue test methodology and strategy are proposed, which can generate a design of the experimental test plan significantly reducing the test time and the sample size. Based on theoretical analysis and fatigue damage model, several groups of random vibration fatigue tests were designed and conducted with the aim of investigating effects of both Gaussian and non-Gaussian random excitation on the vibration fatigue. First, stress responses at a weak point of a notched specimen structure were measured under different base random excitations. According to the measured stress responses, the structural fatigue lives corresponding to the different vibrational excitations were predicted by using the WAFO simulation technique. Second, a couple of destructive vibration fatigue tests were carried out to validate the accuracy of the WAFO fatigue life prediction method. After applying the proposed experimental and numerical simulation methods, various factors that affect the vibration fatigue life of structures were systematically studied, including root mean squares of acceleration, power spectral density, power spectral bandwidth, and kurtosis. The feasibility of WAFO for non-Gaussian vibration fatigue life prediction and the use of non-Gaussian vibration excitation for accelerated fatigue testing were experimentally verified.

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