Microgap Cooling Technique Based on Evaporation of Thin Liquid Films

2009 ◽  
Author(s):  
D. V. Zaitsev ◽  
O. A. Kabov
Keyword(s):  
Heat Flux ◽  
Liquid Film ◽  
Gas Flow ◽  
Liquid Films ◽  
Vapor Flow ◽  
High Heat Flux ◽  
Film Rupture ◽  
Space Applications ◽  
Flow Rates ◽  
Wide Range

Thin and very thin (less than 10 μm) liquid films driven by a forced gas/vapor flow (stratified or annular flows), i.e. shear-driven liquid films in a narrow channel is a promising candidate for the thermal management of advanced semiconductor devices in earth and space applications. Development of such technology requires significant advances in fundamental research, since the stability of joint flow of locally heated liquid film and gas is a rather complex problem. The paper focuses on the recent progress that has been achieved by the authors through conducting experiments. Experiments with water in flat channels with height of H = 1.2–2.0 mm show that a liquid film driven by the action of a gas flow is stable in a wide range of liquid/gas flow rates. Map of isothermal flow regime was plotted and the length of smooth region was measured. Even for sufficiently high gas flow rates an important thermocapillary effect on film dynamics occurs. Scenario of film rupture differs widely for different flow regimes. It is found that the critical heat flux for a shear driven film can be 10 times higher than that for a falling liquid film, and exceeds 400 W/cm2 in experiments with water for moderate liquid flow rates. This fact makes use of shear-driven liquid films promising in high heat flux chip cooling applications.

Flow Patterns and CHF in a Locally Heated Liquid Film Shear-Driven in a Minichannel

2010 ◽  
Author(s):  
D. V. Zaitsev ◽  
O. A. Kabov
Keyword(s):  
Heat Flux ◽  
Liquid Film ◽  
Gas Flow ◽  
Liquid Films ◽  
Vapor Flow ◽  
High Heat Flux ◽  
Film Rupture ◽  
Space Applications ◽  
Flow Rates ◽  
Wide Range

Thin and very thin (less than 10 μm) liquid films driven by a forced gas/vapor flow (stratified or annular flows), i.e. shear-driven liquid films in a narrow channel is a promising candidate for the thermal management of advanced semiconductor devices in earth and space applications. Development of such technology requires significant advances in fundamental research, since the stability of joint flow of locally heated liquid film and gas is a rather complex problem. The paper focuses on the recent progress that has been achieved by the authors through conducting experiments. Experiments with water in flat channels with height of H = 1.2–2.0 mm (mini-scale) show that a liquid film driven by the action of a gas flow is stable in a wide range of liquid/gas flow rates. Map of isothermal flow regime was plotted and the length of smooth region was measured. Even for sufficiently high gas flow rates an important thermocapillary effect on film dynamics occurs. Scenario of film rupture differs widely for different flow regimes. It is found that the critical heat flux for a shear driven film can be 10 times higher than that for a falling liquid film, and exceeds 400 W/cm2 in experiments with water for moderate liquid flow rates. This fact makes use of shear-driven liquid films promising in high heat flux chip cooling applications.

Interfacial Thermal Fluid Phenomena in Thin Liquid Films

2010 ◽  
Author(s):  
Oleg A. Kabov
Keyword(s):  
Heat Flux ◽  
Liquid Film ◽  
Parabolic Flight ◽  
European Space Agency ◽  
Regular Structure ◽  
Liquid Films ◽  
Thin Liquid Films ◽  
Vapor Flow ◽  
Inclined Plate ◽  
Space Applications

Films are ubiquitous in nature and play an important role in our daily life. The paper focuses on the recent progress that has been achieved in the interfacial thermal fluid phenomena in thin liquid films and rivulets through conducting experiments and theory. Phase shift schlieren technique, fluorescence method and infrared thermography have been used. A spanwise regular structures formation was discovered for films falling down an inclined plate with a built-in local rectangular heater. If the heating is low enough, a stable 2D flow with a bump at the front edge of the heater is observed. For lager heat flux this primary flow becomes unstable, and the instability leads to another steady 3D flow, which looks like a regular structure with a periodically bent leading bump and an array of longitudinal rolls or rivulets descending from it downstream. The heat flux needed for the onset of instability grows almost linearly with the increase of Re number. Strong surface temperature gradients up to 10–15 K/mm, both in the streamwise and spanwise directions have been measured. For a wavy film it was found that heating may increase the wave amplitude because thermocapillary forces are directed from the valley to the crest of the wave. Thin and very thin (less than 10 μm) liquid films driven by a forced gas/vapor flow (stratified or annular flows), i.e. shear-driven liquid films in a narrow channel are a promising candidate for the thermal management of advanced semiconductor devices in earth and space applications. Development of such technology requires significant advances in fundamental research, since the stability of joint flow of locally heated liquid film and gas is a rather complex problem. Experiments with water and FC-72 in flat channels (height 0.2–2 mm) have been conducted. Maps of flow regimes were plotted. It was found that stratified flow exists and stable in the channels with 0.2 mm height and 40 mm width. The critical heat flux for a shear driven film may be up to 10 times higher than that for a falling liquid film, and reaches 400 W/cm2 in experiments with water at atmospheric pressure. Some experiments have been done during parabolic flight campaigns of the European Space Agency under microgravity conditions. It was found that decreasing of gravity leads to a flow destabilization.

Viscosity Effect on Thermocapillary Rupture of Falling Liquid Films

2010 ◽  
Author(s):  
Dmitry Zaitsev ◽  
Andrey Semenov ◽  
Oleg Kabov
Keyword(s):  
Heat Flux ◽  
Film Thickness ◽  
Inclination Angle ◽  
Theoretical Models ◽  
Liquid Films ◽  
Liquid Viscosity ◽  
Inclined Plate ◽  
Film Rupture ◽  
Generalize Data ◽  
Wide Range

Rupture of a subcooled liquid film flowing over an inclined plate with a 150×150 mm heater is studied for a wide range of liquid viscosity (dynamic viscosity μ = (0.91–17.2)x10−3 Pa·s) and plate inclination angle with respect to the horizon (Θ = 3–90 deg). The main governing parameters of the experiment and their respective values are: Reynolds number Re = 0.15–54, heat flux q = 0–224 W/cm2. The effect of the heat flux on the film flow leads to the formation of periodically flowing rivulets and thin film between them. As the heat flux grows the film thickness between rivulets gradually decreases, and, upon reaching a certain threshold heat flux, qidp, the film ruptures in the area between the rivulets. The threshold heat flux increases with the flow rate of liquid and with the liquid viscosity, while the plate inclination angle has little effect on qidp. Criterion Kp, which is traditionally used in the literature to predict thermocapillary film rupture, was found to poorly generalize data for high viscous liquids (ethylene glycol, and aqueous solutions of glycerol) and also data for Θ≤45 deg. The criterion Kp was modified by taking into account characteristic critical film thickness for film rupture under isothermal conditions (no heating), deduced from existing theoretical models. The modified criterion has allowed to successfully generalize data for whole ranges of μ, Re, Θ and q, studied.

Breakdown of a Locally Heated Liquid Film Shear-Driven in a Minichannel

2006 ◽  
Author(s):  
D. V. Zaitsev ◽  
O. A. Kabov
Keyword(s):  
Heat Flux ◽  
Liquid Film ◽  
High Speed ◽  
Cooling System ◽  
Flow Regimes ◽  
High Heat ◽  
Liquid Films ◽  
High Heat Flux ◽  
Film Breakdown ◽  
High Heat Transfer

The paper focuses upon shear-driven liquid film evaporative cooling of high-speed computer chips. Thin liquid films may provide very high heat transfer rates, however development of cooling system based on thin film technology requires significant advances in fundamental research. The paper presents new experimental data on flow and breakdown of a liquid film driven by the action of a forced gas flow in a horizontal minichannel (2 mm high), heated from a 22×6.55 mm heater. A map of isothermal flow regimes is plotted and the lengths of smooth region and region of 2D/3D wave occurrence are measured. The scenario of liquid film breakdown under heating is found to differ widely for different flow regimes. It is revealed that the critical heat flux at which film breakdown occurs for a shear-driven liquid film can be several times higher than that for a gravitationally-driven liquid film. This fact makes shear-driven liquid films very promising in high heat flux cooling applications.

Evaluation of Boiling Expectation Time in Falling Wavy Liquid Films on Nonsteady Heat Release

2013 ◽  
Vol 8 (3) ◽  
pp. 71-81
Author(s):  
Andrey Chernyavskiy ◽  
Aleksandr Pavlenko
Keyword(s):  
Heat Flux ◽  
Heat Release ◽  
Flux Density ◽  
Heat Flux Density ◽  
Reynolds Numbers ◽  
Liquid Films ◽  
Time Dependency ◽  
Flow Rates ◽  
Nonsteady Heat ◽  
Wide Range

Mathematical model which allows to calculate the boiling expectation times in falling wavy liquid films on nonsteady heat release has been developed. The process of wave formation in the falling films of liquid nitrogen has been simulated numerically for different inlet Reynolds numbers. The calculation of boiling expectation time dependency on heat flux density and heater surface inertia rate in conditions of fast heat growing has been done. The satisfactory agreement of numerical simulation results with experimental data in the wide range of heat flux density and different flow rates has been shown

Thermohydraulic Behavior of the Liquid–Vapor Flow in the Receiver Tube of a Solar Parabolic Trough Collector

2020 ◽  
Vol 142 (10) ◽  
Author(s):  
Sara Sallam ◽  
Mohamed Taqi
Keyword(s):  
Heat Flux ◽  
Pressure Drop ◽  
Vapor Flow ◽  
High Heat Flux ◽  
Parabolic Trough ◽  
Convective Boiling ◽  
Flow Rates ◽  
Pressure Drops ◽  
Inlet Conditions ◽  
Liquid Vapor

Abstract Liquid–vapor flows are present in many industrial applications. In particular, in the solar field, these flows are encountered in the new generations of solar parabolic trough collectors with direct steam generation (PTCs-DSG). In this technical brief, we compare the two-phase convective transfer and the pressure drop models in the PTC-DSG. The results show that the heat exchange coefficients estimated by Chen–Cooper, Shah, Gungor–Winterton, and Kandlikar models have same trend with difference between them. However, the models of Liu–Winterton and Steiner–Taborek seem inappropriate due to the decrease in the exchange coefficient for moderate and high steam qualities. In addition, a comparison of the models describing pressure drops with experimental data of literature was carried out. The results show that the pressure decreases as the steam quality increases and the differences between these models remain small. Friedel's model is the closest to the experiment for high inlet pressures and flow rates, while Chisholm's model gives the best prediction of the pressure drop for low inlet conditions. Effect analysis of inlet conditions shows that the increase in inlet water mass flow and decrease in pressure favor convective heat transfer. The variation of heat flux on tube wall does not affect the convective boiling heat coefficient evaluated by the Chen–Copper model, whereas it influences the calculating coefficient by Gungor–Winterton model for high heat flux and particularly for low steam qualities. Pressure drops are higher at high flow rates and low pressures.

Cooling of Microelectronics by Shear-Driven Liquid Films

2006 ◽  
Author(s):  
Oleg Kabov
Keyword(s):  
Heat Transfer ◽  
Liquid Film ◽  
High Speed ◽  
Liquid Films ◽  
Vapor Flow ◽  
Air Cooling ◽  
Film Rupture ◽  
Computer Chips ◽  
Speed Computer ◽  
Very High

The recent development of microelectronics is closely linked to the problem of thermal regulation. The levels of heat generation in high-speed computer chips are now approaching very high values and they are on the edge of exceeding the capabilities of today’s air-cooling techniques. Thin liquid films may provide very high heat transfer intensity and may be used for cooling of microelectronics. A particularly promising technological solution is a set-up where heat is transferred to a very thin liquid film driven by a forced gas or vapor flow in a micro-channel. However, development such a cooling system requires significant advances in fundamental research, since the stability of joint flow of liquid film and gas is rather complex problem. Flow patterns, heat transfer laws and film rupture mechanisms for shear-driven locally heated liquid film flows remain only partially understood. The paper focuses upon shear-driven liquid film evaporative cooling of high-speed computer chips. The recent progress that has been achieved through conducting theoretical and numerical modeling as well as new experimental data has been discussed.

On the Nature of Critical Heat Flux in Microchannels

2005 ◽  
Vol 127 (1) ◽  
pp. 101-107 ◽  
Author(s):  
A. E. Bergles ◽  
S. G. Kandlikar
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Flow Boiling ◽  
Flow Distribution ◽  
High Heat ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Clear Understanding ◽  
Wide Range ◽  
Parallel Microchannels

The critical heat flux (CHF) limit is an important consideration in the design of most flow boiling systems. Before the use of microchannels under saturated flow boiling conditions becomes widely accepted in cooling of high-heat-flux devices, such as electronics and laser diodes, it is essential to have a clear understanding of the CHF mechanism. This must be coupled with an extensive database covering a wide range of fluids, channel configurations, and operating conditions. The experiments required to obtain this information pose unique challenges. Among other issues, flow distribution among parallel channels, conjugate effects, and instrumentation need to be considered. An examination of the limited CHF data indicates that CHF in parallel microchannels seems to be the result of either an upstream compressible volume instability or an excursive instability rather than the conventional dryout mechanism. It is expected that the CHF in parallel microchannels would be higher if the flow is stabilized by an orifice at the entrance of each channel. The nature of CHF in microchannels is thus different than anticipated, but recent advances in microelectronic fabrication may make it possible to realize the higher power levels.

Mass Nature of Heat and Its Applications I: Motion of Thermomass Fluid and General Heat Conduction Law

2010 ◽  
Author(s):  
Zeng-Yuan Guo ◽  
Bing-Yang Cao
Keyword(s):  
Heat Flux ◽  
Heat Conduction ◽  
Gas Flow ◽  
Short Pulse ◽  
Rest Mass ◽  
Inertial Force ◽  
High Heat Flux ◽  
Phase Lag ◽  
Energy Relation ◽  
Inertial Terms

The concept of thermomass is defined as the equivalent mass of thermal energy according to the Einstein’s mass-energy relation. Hence, the phonon gas in dielectrics can be regarded a weighty, compressible fluid. Heat conduction in the medium, where the rest mass lattices or molecules acts the porous framework, resembles the gas flow through the porous medium. Newton mechanics has been applied to establish the equation of state and the equation of motion for the phonon gas as in fluid mechanics, since the drift velocity of a phonon gas is normally much less than the speed of light. The momentum equation of the thermomass gas, including the driving, inertial and resistant forces, is a damped wave equation, which is in fact the general conduction law. This is because it reduces to the CV (Cattaneo-Vernotte) model or the single phase-lag model as the heat flux related inertial terms are neglected, and reduces to Fourier’s heat conduction law as all inertial terms are neglected. Therefore, the underlying physics of Fourier’s heat conduction law is the balance between the driving force and the resistant force of the heat motion, and Fourier’s law will break down when the inertial force is comparable to the resistant force, for instance, in the case of ultra-short pulse laser heating or heat conduction in carbon nanotubes at ultra-high heat flux.

Thick-Film Phenomenon in High-Heat-Flux Evaporation From Cylindrical Pores

1997 ◽  
Vol 119 (2) ◽  
pp. 272-278 ◽  
Author(s):  
D. Khrustalev ◽  
A. Faghri
Keyword(s):  
Thick Film ◽  
High Heat ◽  
Liquid Films ◽  
Momentum Conservation ◽  
Vapor Flow ◽  
High Heat Flux ◽  
Operational Conditions ◽  
Flux Evaporation ◽  
Cylindrical Pores ◽  
Liquid Vapor

A physical and mathematical model of the evaporating thick liquid film, attached to the liquid-vapor meniscus in a circular micropore, has been developed. The liquid flow has been coupled with the vapor flow along the liquid-vapor interface. The model includes quasi-one-dimensional compressible steady-state momentum conservation for the vapor and also a simplified description of the microfilm at the end of the thick film. The numerical results, obtained for water, demonstrate that formation of extended thick liquid films in micropores can take place due to high-velocity vapor flow under high rates of vaporization. The model has also predicted that the available capillary pressure significantly changes with the wall-vapor superheat and other operational conditions.

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