The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages

2009 ◽  
Author(s):  
Chih-Kuang Yu ◽  
Ming-Che Hsieh ◽  
Chun-Kai Liu ◽  
Ming-Ji Dai ◽  
Ra-Min Tain
Keyword(s):  
Numerical Study ◽  
Thermal Characteristics ◽  
Junction Temperature ◽  
Geometrical Parameters ◽  
Heat Transfer Mechanism ◽  
3 Dimensional ◽  
Material Parameters ◽  
Silicon Vias ◽  
Thermal Simulations ◽  
Volume Method

In this study, the thermal simulations of 3 dimensional IC packages base on 4-layer vertical stacked die (bare die on bare die) with TSV (through silicon vias) and micro-bumps structure are conducted. The thermal models by finite volume method are developed for different geometrical parameters (TSV, micro-bumps distribution arrangement and spacer thickness) and material property (thermal conductivity of spacer). The thermal performance and the heat transfer mechanism for the stacked die package are analyzed for optimizing the geometrical and material parameters. Not only the temperature distributions but also the junction temperature and thermal resistances in 4-layer stacked die package with different multi-die power configurations are shown and discussed.

Cloud Computing Applied for Numerical Study of Thermal Characteristics of SIP

2013 ◽  
pp. 166-175
Author(s):  
S. K. Maharana ◽  
Praveen B. Mali ◽  
Ganesh Prabhakar ◽  
Sunil J ◽  
Vignesh Kumar
Keyword(s):  
Cloud Computing ◽  
Thermal Management ◽  
Integrated Circuit ◽  
Heat Dissipation ◽  
Numerical Study ◽  
Control Volume ◽  
Thermal Characteristics ◽  
Thermal Dissipation ◽  
Volume Method ◽  
Power And Energy

Thermal management of integrated circuit (IC) and system-in-package (SIP) has gained importance as the power density and requirement for IC design have increased and need exists to analyse the heat dissipation performance characteristics of IC under use. In this paper, the authors examine the thermal characteristics of materials of IC. The authors leverage Cloud Computing architecture to remotely compute the dissipation performance parameters. Understanding thermal dissipation performance, which explains the thermal management of IC, is important for chip performance, as well as power and energy consumption in a chip or SIP. Using architectural understanding of Software as a Service (SaaS), the authors develop an efficient, fast, and secure simulation technique by leveraging control volume method (CVM) of linearization of relevant equations. Three chips are kept in tandem to make it a multi-chip module (MCM) to realise it as a smaller and lighter package. The findings of the study are presented for different dimensions of chips inside the package.

Experimental and Numerical Study on Thermal Characteristics of High-Power LED Street Lamp

2013 ◽  
Vol 732-733 ◽  
pp. 161-164 ◽  
Author(s):  
Ai Chun Ma ◽  
Ya Hui Wang ◽  
Jian Ping Ou ◽  
Cheng Jian Zhou
Keyword(s):  
Experimental Data ◽  
Heat Dissipation ◽  
Numerical Study ◽  
Thermal Characteristics ◽  
Junction Temperature ◽  
Structure Parameters ◽  
Voltage Measurement ◽  
Street Lamp ◽  
Fin Thickness ◽  
Fin Length

Based on the forward voltage measurement principle, a test device was designed for junction temperature measurement. The voltage temperature coefficient is-1.49mV/°C according to the experimental data, and a series of junction temperatures were obtained on various ambient temperature. A numerical model was built by using the CFD software Flent, which was verified with the experimental data. The influence of the different structure parameters of the heat sink on heat dissipation performance was studied numerically. The results show that the optimal structure parameters were as following: Fin number is within 8~12. Fin height is within 170mm~190mm. Fin length is within 35mm~55mm. Fin thickness is within 1mm~3mm. Bases radius is within 33mm~40mm. With the chip junction temperature and the radiator weight as optimizing object, the optimal parameters were obtained as following: Fin number is 12. Fin height is 190mm. Fin length is 55mm. Fin thickness is 1.5mm. Bases radius is 33 mm.

PCB thermal reliability characteristics analysis under ambient temperature

2020 ◽  
Vol 20 (3) ◽  
pp. 853-858
Author(s):  
Hailong Huang ◽  
Yi Wan ◽  
Kai Zhou
Keyword(s):  
Flow Analysis ◽  
Thermal Characteristics ◽  
Thermal Design ◽  
Junction Temperature ◽  
Electrical Transmission ◽  
Thermal Reliability ◽  
Ambient Temperatures ◽  
Reliability Characteristics ◽  
Characteristics Analysis ◽  
Volume Method

PCB is an important component for electronic devices – Mechanical connections and electrical transmission, thermal failure is its main failure mode, the heat flow analysis and thermal design is the basis and premise to improve thermal characteristics of PCBs. In this paper, based on the principles of fluid mechanics, using the finite volume method, the thermal characteristics of the PCB is modeled, and we obtain the maximum junction temperature of the PCB, PCB’s thermal distribution and effect of different ambient temperatures on the PCB thermal characteristics. The study provides a theoretical basis for the PCB thermal design.

scholarly journals Numerical Study of Natural Convection in a Vertical Cylindrical Partially Annular

2020 ◽  
Vol 22 (1) ◽  
pp. 77-92
Author(s):  
Mohamed A. Medebber ◽  
Noureddine Retiel
Keyword(s):  
Numerical Study ◽  
Vertical Wall ◽  
Vertical Cylinder ◽  
Geometrical Parameters ◽  
Uniform Temperature ◽  
Governing Equations ◽  
Simpler Algorithm ◽  
Prandtl Numbers ◽  
Volume Method ◽  
Rayleigh Numbers

AbstractA study of free convection in a vertical cylinder partially annulus is conducted numerically. Uniform temperature is imposed cross a vertical wall, while the top and bottom walls are adiabatic. The governing equations are solved numerically by using a finite volume method. The coupling between the continuity and momentum equations is effected using the SIMPLER algorithm. Solutions have been obtained for Prandtl numbers equal to 7.0, Rayleigh numbers of 103 to 106 and height ratios of 0 to 1. The influence of physical and geometrical parameters on the streamlines, isotherms, average Nusselt has been numerically investigated.

Investigating the Potential Drag Reduction and Thermal Transport Improvement in Textured Microchannels

2021 ◽  
Author(s):  
Nastaran Rabiei ◽  
Grace McDonough ◽  
Carlos H. Hidrovo
Keyword(s):  
Heat Transfer ◽  
Drag Reduction ◽  
Thermal Transport ◽  
Numerical Study ◽  
Thermal Characteristics ◽  
Geometrical Parameters ◽  
Microchannel Flow ◽  
Duct Flow ◽  
Pressure Drag ◽  
Surface Microstructures

Abstract Over the past few decades, microscale duct flow has been the key element for many applications, such as drug delivery and microelectronics cooling. To enhance the performance of such systems and to save more energy, looking for new ways to control the hydrodynamic and thermal characteristics of the microchannel flow has been of great interest lately. The aim of this research is to gain a better understanding of the flow physics within microchannels with microtextured walls. Therefore, a set of numerical study has been conducted on the combined effect of flow and heat transfer for spanwise rectangular trenches. The surface microstructures increase the wetting surface area, which is supposed to increase friction (skin drag). Recirculation produced inside the grooves, on the other hand, aids in increasing main flow slippage and lowering pressure drop along the microchannel. It is also worth noting that recirculation creates a negative pressure difference in the opposite direction of the flow (pressure drag). The geometrical parameters of the trenches have a significant impact on the trade-off between the drag reducing and drag increasing factors in textured microchannel flow, which is addressed in this research. Furthermore, the textures disrupt the thermal boundary layer, which can boost thermal transport through recirculation mixing. However, the stagnant fluid trapped within the grooves has weak convective heat transfer. So far, the results have been promising and a drag reduction of about 25% has been reported for wide trenches at low Reynolds numbers. Thermal transport enhancement is also possible for some tested geometries when the flow has not achieved the thermally fully development.

Cloud Computing Applied for Numerical Study of Thermal Characteristics of SIP

2011 ◽  
Vol 1 (3) ◽  
pp. 12-21
Author(s):  
S. K. Maharana ◽  
Praveen B. Mali ◽  
Ganesh Prabhakar ◽  
Sunil J ◽  
Vignesh Kumar
Keyword(s):  
Cloud Computing ◽  
Thermal Management ◽  
Integrated Circuit ◽  
Heat Dissipation ◽  
Numerical Study ◽  
Control Volume ◽  
Thermal Characteristics ◽  
Thermal Dissipation ◽  
Volume Method ◽  
Power And Energy

Thermal management of integrated circuit (IC) and system-in-package (SIP) has gained importance as the power density and requirement for IC design have increased and need exists to analyse the heat dissipation performance characteristics of IC under use. In this paper, the authors examine the thermal characteristics of materials of IC. The authors leverage Cloud Computing architecture to remotely compute the dissipation performance parameters. Understanding thermal dissipation performance, which explains the thermal management of IC, is important for chip performance, as well as power and energy consumption in a chip or SIP. Using architectural understanding of Software as a Service (SaaS), the authors develop an efficient, fast, and secure simulation technique by leveraging control volume method (CVM) of linearization of relevant equations. Three chips are kept in tandem to make it a multi-chip module (MCM) to realise it as a smaller and lighter package. The findings of the study are presented for different dimensions of chips inside the package.

scholarly journals Dynamics of Single Droplet Splashing on Liquid Film by Coupling FVM with VOF

Processes ◽  
2021 ◽  
Vol 9 (5) ◽  
pp. 841
Author(s):  
Yuzhen Jin ◽  
Huang Zhou ◽  
Linhang Zhu ◽  
Zeqing Li
Keyword(s):  
Liquid Film ◽  
Weber Number ◽  
Stokes Equations ◽  
Numerical Study ◽  
Three Dimensional ◽  
Navier Stokes ◽  
Single Droplet ◽  
Navier Stokes Equations ◽  
Volume Method ◽  
The Relationship

A three-dimensional numerical study of a single droplet splashing vertically on a liquid film is presented. The numerical method is based on the finite volume method (FVM) of Navier–Stokes equations coupled with the volume of fluid (VOF) method, and the adaptive local mesh refinement technology is adopted. It enables the liquid–gas interface to be tracked more accurately, and to be less computationally expensive. The relationship between the diameter of the free rim, the height of the crown with different numbers of collision Weber, and the thickness of the liquid film is explored. The results indicate that the crown height increases as the Weber number increases, and the diameter of the crown rim is inversely proportional to the collision Weber number. It can also be concluded that the dimensionless height of the crown decreases with the increase in the thickness of the dimensionless liquid film, which has little effect on the diameter of the crown rim during its growth.

scholarly journals Effects of operating and material parameters on the thermal characteristics of a wet clutch

2021 ◽  
Vol 13 (7) ◽  
pp. 168781402110341
Author(s):  
Zhigang Zhang ◽  
Ling Zou ◽  
Hang Liu ◽  
Yonglong Chen ◽  
Benzhu Zhang
Keyword(s):  
Heat Flux ◽  
Applied Pressure ◽  
Thermal Characteristics ◽  
Thermal Models ◽  
Material Parameters ◽  
Heat Transfer Theory ◽  
Friction Disk ◽  
Viscous Shear ◽  
Wet Clutch ◽  
Transient Thermal

Based on the frictional mechanism of a wet clutch, frictional models of wet clutch engagement were established using the modified Reynolds equation and the elastic contact model between frictional pairs. Then, the heat flux models for the viscous shear and asperity friction were built, and the two-dimensional transient thermal models for the separator plate, friction disk, and ATF heat convection model were deduced based on the heat transfer theory and conservation law of energy. Finally, the Runge–Kutta numerical method was used to solve the frictional and thermal models. The average temperature of the separator plate, friction disk, and ATF were calculated. The effects of operating and material parameters, such as applied pressure, initial angular velocity, friction lining permeability, surface combined roughness RMS, equivalent elastic modulus, and ATF flow, on the thermal characteristics of friction pairs and ATF during engagement, were studied. The simulation results show that the temperature characteristics of the separator plate, friction disk, and ATF depend mainly on the viscous shear and asperity friction heat flux, and that the operating and material parameters of the wet clutch also have significant impacts on the overall variation trend of the thermal characteristics of the separator plate, friction disk, and ATF.

Numerical study of the geometrical parameters on CH4/air premixed combustion in heat recirculation micro-combustor

Fuel ◽  
2015 ◽  
Vol 159 ◽  
pp. 45-51 ◽  
Author(s):  
Yunfei Yan ◽  
Wenli Pan ◽  
Li Zhang ◽  
Weimin Tang ◽  
Yanrong Chen ◽  
...  
Keyword(s):  
Numerical Study ◽  
Premixed Combustion ◽  
Geometrical Parameters ◽  
Heat Recirculation ◽  
Micro Combustor
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