Electroless Nickel Plating Process Optimization for Aluminum Terminals

2009 ◽  
Author(s):  
Philip Westby ◽  
Kevin Mattson ◽  
Fred Haring ◽  
Jacob Baer ◽  
Matt Steele ◽  
...  
Keyword(s):  
Process Optimization ◽  
Electroless Nickel ◽  
Process Time ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Effects Of Temperature ◽  
Electroless Ni

An Electroless Ni plating process for aluminum was evaluated and optimized, leading to smooth and uniform nickel growth approaching 28.2 μm/hr. The effects of temperature, and process time were investigated. Nickel bumping die for solder adhesion was performed and the quality of the adhesion between the nickel and aluminum layers was evaluated.

Fabrication and Research of Electroless Nickel Plating on Carbon Fiber with Palladium-Free Activation

2010 ◽  
Vol 148-149 ◽  
pp. 410-415
Author(s):  
Xiao Ping Luo ◽  
Ming Gang Zhang ◽  
Chun Xiang Lv
Keyword(s):  
Tensile Strength ◽  
Carbon Fiber ◽  
Fiber Surface ◽  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Adhesive Properties ◽  
Nickel Deposition ◽  
X Ray ◽  
Electroless Ni

A new procedure of surface activation without using palladium salt is proposed for electroless nickel plating (Ni-P) on carbon fiber. The optimal formula and technical conditions for palladium-free activated electroless Ni-P were obtained by orthogonal experiments. The effects of nitric acid processing time on the quality of nickel coating was investigated .The effects of varying concentrations of Ni2 + on the rate of weight gain during the Ni2 + complex adsorption process were also analyzed and the kinetic equation of the process was established. The theoretical values calculated by the equation were proven to be consistent with the experimental verification. The material characteristics of the deposited layers were analyzed by scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDX) and X-ray diffraction (XRD). The tensile strength of the carbon fibers was analyzed by the Weibull method, and this showed that when the thickness of the Ni-P coating reached 0.150μm, the tensile strength reached a maximum value. The experimental results showed that the nickel deposition on the carbon fiber surface obtained by this method, had the same uniformity, compactness and adhesive properties as the one by conventional electroless Ni-P.

Electroless Ni-P Plating on Mg-7Al Alloy by Chemical Conversion Pretreatment

2013 ◽  
Vol 652-654 ◽  
pp. 1908-1911
Author(s):  
Su Qiu Jia ◽  
Jing Xin Guan ◽  
Jing Dong Qiu ◽  
Hua Chen ◽  
Shu Yan Jia
Keyword(s):  
Corrosion Potential ◽  
Orthogonal Experiment ◽  
Orthogonal Design ◽  
Saturated Calomel Electrode ◽  
Nickel Sulfate ◽  
Electroless Nickel ◽  
Chemical Conversion ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Electroless Ni

Electroless Ni-P plating on Mg-7Al alloy by chemical conversion pretreatment was investigated. Morphology of electroless nickel plating coatings and phase compositions were measured by SEM, EDX and XRD. The optimized bath composition parameters were determined through orthogonal design. The morphology of electroless nickel plating coatings on Mg-7Al alloy exhibits a nodular structure and resembles the surface of a cauliflower and the coating is compact and consists of amorphous Ni-P coating. Potentiodynamic polarization curves of the Ni-P coatings in 3.5% NaCl show that the Ni-P coating extensively improves the corrosion resistance of Mg-7Al alloy and the highest corrosion potential reached to -0.54V vs. SCE(saturated calomel electrode). The results of the orthogonal experiment show that Nickel Sulfate of 25 g/L, Sodium Hypopho-sphate of 25 g/L and Citrate 7.5 g/L can be considered as the optimum bath content parameters for electroless Ni–P plating on Mg-7Al alloy and Nickel Sulfate has more effect on corrosion potential than Sodium Hypophosphate and Citrate..

EFFECT OF DIFFERENT PRETREATMENTS TO ELECTROLESS NICKEL OR COBALT PLATING ON HOLLOW MICROSPHERES

2010 ◽  
Vol 24 (15n16) ◽  
pp. 2706-2711
Author(s):  
YAN ZHAO ◽  
RUN ZHANG ◽  
TONG ZHANG ◽  
YUEXIN DUAN
Keyword(s):  
Electron Microscopy ◽  
Electroless Nickel ◽  
Single Step ◽  
Chemical Compositions ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
X Ray ◽  
Surface Morphologies ◽  
Electroless Ni ◽  
Scanning Electron

Different pretreatment methods for electroless nickel and cobalt plating are demonstrated and compared in the present investigation. The surface morphologies of the nickel or cobalt deposits are investigated by scanning electron microscopy (SEM), and the chemical compositions of the coatings are analyzed by energy-dispersive X-ray spectroscopy (EDX). Method of single-step pretreatment is selected as the optimized method for electroless nickel plating process, while improved two-step sensitization-activation and single-step pretreatment methods can be selected for electroless cobalt plating. It can be found that the content of free Co is much lower compared to electroless Ni plating.

Electroless Nickel Plating Technique for Depositing a Nano-Scale Layer

2012 ◽  
Vol 6 (5) ◽  
pp. 633-637 ◽  
Author(s):  
Tune-Hune Kao ◽  
◽  
Meng-Chi Huang ◽  
Ying-Tsun Su ◽  
Jian-Shian Lin
Keyword(s):  
Chelating Agents ◽  
Electroless Nickel ◽  
Nanometer Scale ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Sodium Tartrate ◽  
Plating Technique ◽  
Scale Layer ◽  
Potassium Sodium Tartrate

This paper discusses an electroless nickel plating technique. EDTA and potassium sodium tartrate are selected as chelating agents, and both are suitable for producing deposition layers of nanometer scale. The technique is applied to a copper roller mold, the deposition rate is measured at various operation temperatures, and layer thickness is measured by a surface contour meter. The quality of the deposition layer is characterized by SEM, and micrographs show that sharp angles can be reproduced by the deposition layer.

Selective Electroless Nickel Plating on Polyelectrolyte Multilayer Platforms

Langmuir ◽  
2001 ◽  
Vol 17 (21) ◽  
pp. 6610-6615 ◽  
Author(s):  
T. C. Wang ◽  
B. Chen ◽  
M. F. Rubner ◽  
R. E. Cohen
Keyword(s):  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Polyelectrolyte Multilayer

Optimising the Electroless Nickel Plating Process for Textile Application

2007 ◽  
Vol 11 (3) ◽  
pp. 60-70 ◽  
Author(s):  
C.W. Kan ◽  
C.W.M. Yuen ◽  
S.Q. Jiang ◽  
W.S. Tung
Keyword(s):  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating

Study on the Surface Metallization of Aramid Fibers

2012 ◽  
Vol 503-504 ◽  
pp. 1216-1219
Author(s):  
Long Li ◽  
Xue Yu Hu
Keyword(s):  
Surface Morphology ◽  
Fiber Surface ◽  
Electroless Nickel ◽  
Aramid Fiber ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Aramid Fibers ◽  
Surface Metallization

In this paper, aramid fiber surface metallization was investigated by electroless nickel plating technology. Acid nickel plating and alkaline nickel plating of aramid fiber was compared. Through experiment, it was shown that the temperature of alkaline nickel plating was lower compared with acid nickel plating, and resistance of metalized aramid fibers by alkaline nickel plating was 36.8Ω•cm, and the resistance by acid plating was 51.2Ω•cm. The surface morphology of fibers was observed using SEM

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