Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC

2016 ◽  
Author(s):  
Leila Choobineh ◽  
Ankur Jain ◽  
Jared Jones
Keyword(s):  
Thermal Resistance ◽  
Experimental Measurement ◽  
High Speed ◽  
Thermal Design ◽  
Analytical Models ◽  
Physical Parameters ◽  
3D Ic ◽  
3D Ics ◽  
High Speed Data Acquisition ◽  
High Speed Data

Thermal modeling and temperature prediction in 3D ICs are important for improving performance and reliability. A number of numerical and analytical models have been developed for thermal analysis of 3D ICs. However, there is a relative lack of experimental work to determine key physical parameters in 3D IC thermal design. One such important key parameter is the inter-die thermal resistance between adjacent die bonded together. This paper describes a novel experimental method to measure the value of inter-die thermal resistance between two die in a 3D IC. The effect of heating one die on the temperature of the other die in a two-die stack is measured over a short time period using high speed data acquisition to negate the effect of boundary conditions. Numerical simulation is performed and based on a comparison between experimental data and the numerical model, the inter-die thermal resistance between two die is determined. There is good agreement between experimental measurement and theoretically estimated value of the inter-die thermal resistance. Results from this paper are expected to assist in thermal design and management of 3D ICs.

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

2017 ◽  
Vol 139 (2) ◽  
Author(s):  
Leila Choobineh ◽  
Jared Jones ◽  
Ankur Jain
Keyword(s):  
Integrated Circuits ◽  
Thermal Resistance ◽  
High Speed ◽  
Three Dimensional ◽  
Heat Removal ◽  
Thermal Design ◽  
Electrical Performance ◽  
Physical Parameters ◽  
Interconnect Delay ◽  
3D Ics

Three-dimensional integrated circuits (3D ICs) attract much interest due to several advantages over traditional microelectronics design, such as electrical performance improvement and reducing interconnect delay. While the power density of 3D ICs increases because of vertical integration, the available substrate area for heat removal does not change. Thermal modeling of 3D ICs is important for improving thermal and electrical performance. Experimental investigation on the thermal measurement of 3D ICs and determination of key physical parameters in 3D ICs thermal design are curtail. One such important parameter in thermal analysis is the interdie thermal resistance between adjacent die bonded together. This paper describes an experimental method to measure the value of interdie thermal resistance between two adjacent dies in a 3D IC. The effect of heating one die on the temperature of the other die in a two-die stack is measured over a short time period using high-speed data acquisition to negate the effect of boundary conditions. Numerical simulation is performed and based on a comparison between experimental data and the numerical model, the interdie thermal resistance between the two dies is determined. A theoretical model is also developed to estimate the value of the interdie thermal resistance. Results from this paper are expected to assist in thermal design and management of 3D ICs.

A Design of High Speed Data Acquisition and Storage System

2013 ◽  
Vol 367 ◽  
pp. 541-543
Author(s):  
Yun Peng Li
Keyword(s):  
Speech Recognition ◽  
High Speed ◽  
Storage System ◽  
Nand Flash ◽  
Flash Storage ◽  
Reading And Writing ◽  
Hardware Development ◽  
High Speed Data Acquisition ◽  
High Speed Data ◽  
And Storage

This article focuses on research and implementation of a kind of solid storage system that is based on NAND flash which can store the data with high speed and huge capacity. A design with quad 1.25Gsps ADC and flash storage array with 1TB is demonstrated in the paper. The design is applied widely in many fields such as radar, communication and speech recognition. The detail of hardware development is also introduced in the thesis. In addition, a method is discussed to approve the reading and writing bandwidth by parallel operations on multiple pieces of flash. By using the method, the data bandwidth is arrived 6GB/S.

Design of Data Transfer System Based on PCI Express Interface Applied in High-Speed Railway

2012 ◽  
Vol 229-231 ◽  
pp. 1543-1546
Author(s):  
Xiao Bo Zhou ◽  
Min Xia ◽  
Hai Long Cheng
Keyword(s):  
Data Acquisition ◽  
Data Transmission ◽  
High Speed ◽  
Data Transfer ◽  
Transmission Method ◽  
High Speed Railway ◽  
Pci Express ◽  
Data Acquisition Card ◽  
High Speed Data Acquisition ◽  
High Speed Data

To improve data transmission performance of the data acquisition card, a design of high-speed data transmission system is proposed in the thesis. Using FPGA of programmable logic devices, adopting Verilog HDL of hardware description language, the design of modularization and DMA transmission method is implemented in FPGA. Eventually the design implements the data transmission with high-speed through PCI Express interface. Through simulation and verification based on hardware system, this design is proved to be feasible and can satisfy the performance requirements of data transmission in the high-speed data acquisition card applied in high-speed railway communication. The design also has some value of application and reference for a universal data acquisition card.

scholarly journals Cloud shadow speed sensor

2014 ◽  
Vol 7 (6) ◽  
pp. 1693-1700 ◽  
Author(s):  
V. Fung ◽  
J. L. Bosch ◽  
S. W. Roberts ◽  
J. Kleissl
Keyword(s):  
High Speed ◽  
Sensor Data ◽  
Motion Vectors ◽  
Speed Sensor ◽  
Correlation Algorithm ◽  
High Speed Data Acquisition ◽  
Economical System ◽  
High Speed Data ◽  
Mean Square Difference ◽  
Artificial Shading

Abstract. Changing cloud cover is a major source of solar radiation variability and poses challenges for the integration of solar energy. A compact and economical system is presented that measures cloud shadow motion vectors to estimate power plant ramp rates and provide short-term solar irradiance forecasts. The cloud shadow speed sensor (CSS) is constructed using an array of luminance sensors and a high-speed data acquisition system to resolve the progression of cloud passages across the sensor footprint. An embedded microcontroller acquires the sensor data and uses a cross-correlation algorithm to determine cloud shadow motion vectors. The CSS was validated against an artificial shading test apparatus, an alternative method of cloud motion detection from ground-measured irradiance (linear cloud edge, LCE), and a UC San Diego sky imager (USI). The CSS detected artificial shadow directions and speeds to within 15° and 6% accuracy, respectively. The CSS detected (real) cloud shadow directions and speeds with average weighted root-mean-square difference of 22° and 1.9 m s−1 when compared to USI and 33° and 1.5 m s−1 when compared to LCE results.

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