Effect of Manufacturing Process Parameters on Property Evolution of Printed Circuit Board Laminates

2012 ◽  
Author(s):  
Pradeep Lall ◽  
Vikalp Narayan ◽  
Jim Blanche ◽  
Mark Strickland
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Statistical Significance ◽  
Circuit Board ◽  
Effect Of Temperature ◽  
Process Variables ◽  
Printed Circuit

The effect of temperature exposure encountered both during assembly and in fielded products, has a known influence on glass transition temperature of printed-circuit board (PCB) laminate materials. Printed circuit board laminates such as FR4 are composites of epoxy resin with woven fiberglass reinforcement. Interaction between manufacturing process variables that impact the changes in glass transition temperature (Tg) has been studied. The laminates studied have been broadly classified into high-Tg, and mid-Tg laminates. Different sets of reflow profiles were created by varying the process variables including, time above liquidus, peak temperature, ramp rate and cooling rate. The effect of multiple reflows encountered in normal assembly or board re-work has been studied by exposing the assemblies to multiple reflows between 2x–6x. Changes to the glass transition temperature have been classified by measurement of the glass transition temperature were measured via Thermo Mechanical Analysis (TMA). Statistical analysis of the variables has been used to determine the statistical significance of the measured changes for large populations.

scholarly journals Buckling and vibration analysis of shape memory laminated composite beams under axially heterogeneous in-plane loads in the glass transition temperature region

2021 ◽  
Vol 3 (4) ◽  
Author(s):  
Nilesh Tiwari ◽  
A. A. Shaikh
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Boundary Conditions ◽  
Shape Memory ◽  
Transition Region ◽  
Shape Memory Polymer ◽  
Shear Deformation Theory ◽  
Effect Of Temperature ◽  
Glass Transition Region

AbstractBuckling and vibration study of the shape memory polymer composites (SMPC) across the glass transition temperature under heterogeneous loading conditions are presented. Finite element analysis based on C° continuity equation through the higher order shear deformation theory (HSDT) is employed considering non linear Von Karman approach to estimate critical buckling and vibration for the temperature span from 273 to 373 K. Extensive numerical investigations are presented to understand the effect of temperature, boundary conditions, aspect ratio, fiber orientations, laminate stacking and modes of phenomenon on the buckling and vibration behavior of SMPC beam along with the validation and convergence study. Effect of thermal conditions, particularly in the glass transition region of the shape memory polymer, is considerable and presents cohesive relation between dynamic modulus properties with magnitude of critical buckling and vibration. Moreover, it has also been inferred that type of axial loading condition along with the corresponding boundary conditions significantly affect the buckling and vibration load across the glass transition region.

Process Improvement Using Design by Experiments

1994 ◽  
Author(s):  
Hsien-chen Li ◽  
Fuyau Lin
Keyword(s):  
Process Improvement ◽  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Fractional Factorial Design ◽  
Time Budget ◽  
Fractional Factorial ◽  
Circuit Board ◽  
Printed Circuit ◽  
Printed Circuit Board Manufacturing

Abstract This paper present an approach to apply Design by Experiments for process improvement with the objectives to minimize cost and shorten investigation time. A case study of PCB (Printed Circuit Board) manufacturing process is chosen to illustrate this approach. A Fractional Factorial Design by Experiment was performed due to the constraints of the time, budget, and resources.

The Effects of Variations in Manufacturing on PCB Thermal Properties

2011 ◽  
Author(s):  
John F. Maddox ◽  
Roy W. Knight ◽  
Sushil H. Bhavnani
Keyword(s):  
Thermal Properties ◽  
Steady State ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Electronic Device ◽  
Circuit Board ◽  
Printed Circuit

The thermal performance of an electronic device is heavily dependent on the properties of the printed circuit board (PCB) to which it is attached. However, even small variations in the process used to fabricate a PCB can have drastic effects on its thermal properties. Therefore, it is necessary to experimentally verify that each stage in the manufacturing process is producing the desired result. Steady state thermal resistance measurements, taken with a comparative cut bar apparatus based on ASTM D 5470-06, were used to compare PCBs manufactured from the same design by different vendors and the effects of vias filled with epoxy versus unfilled vias on the thermal resistance of a PCB. It was found that the thermal resistance of the PCBs varied by as much as 30% between vendors and that the PCBs with epoxy filled vias had a higher thermal resistance than those with unfilled vias, possibly due to the order in which the manufacturing steps were taken.

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