Removing the Hot-Spots in High Power Devices Using the Thermoelectric Cooler and Micro Heat Pipe

2012 ◽  
Author(s):  
Agat Hirachan ◽  
Dereje Agonafer
Keyword(s):  
Heat Pipe ◽  
Integrated Circuit ◽  
Hot Spots ◽  
Hot Spot ◽  
The United States ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermoelectric Cooler ◽  
Silicon Chips ◽  
Micro Heat Pipe

Due to localized high heat fluxes, hot-spots are created in silicon chips. Cooling of the hot-spots is one of the major thermal challenges in today’s integrated circuit (IC) industry. Many researches have been conducted to find ways to cool hot-spots using different techniques as uniform heating is highly desired. This paper focuses on cooling of hot-spot using conventional thermoelectric cooler (Melcor_CP1.0-31-05L.1) and a micro heat pipe. A chip package with conventional integrated heat spreader and heat sink was designed. Hot-spot was created at the center of the silicon die with background heat at rest of the area. The heat flux on the hot-spot was much greater than rest of the area. Forced convection was used to cool IC package, temperature was observed at active side of the silicon die. After that a copper conductor was used to take away heat directly from the hot-spot of the silicon die to the other end of the conductor which was cooled using the thermoelectric cooler. Finally the conductor was replaced by a heat pipe and a comparison between three cases was done to study the cooling performance using the commercial software, ANSYS Icepak. The effect of trench on silicon die was also studied. In this paper the United States Patent, Patent No. US 6,581,388 B2, Jun. 24 2000 [8] as shown in Fig. 1 (b) was modified by replacing the conductor with a micro heat pipe to solve the hot-spots problem in electronic packaging.

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement

2013 ◽  
Author(s):  
Enes Tamdogan ◽  
Mehmet Arik ◽  
M. Baris Dogruoz
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Light Extraction ◽  
Junction Temperature ◽  
System Level ◽  
Design Parameters ◽  
Liquid Cooling ◽  
Wide Range

With the recent advances in wide band gap device technology, solid-state lighting (SSL) has become favorable for many lighting applications due to energy savings, long life, green nature for environment, and exceptional color performance. Light emitting diodes (LED) as SSL devices have recently offered unique advantages for a wide range of commercial and residential applications. However, LED operation is strictly limited by temperature as its preferred chip junction temperature is below 100 °C. This is very similar to advanced electronics components with continuously increasing heat fluxes due to the expanding microprocessor power dissipation coupled with reduction in feature sizes. While in some of the applications standard cooling techniques cannot achieve an effective cooling performance due to physical limitations or poor heat transfer capabilities, development of novel cooling techniques is necessary. The emergence of LED hot spots has also turned attention to the cooling with dielectric liquids intimately in contact with the heat and photon dissipating surfaces, where elevated LED temperatures will adversely affect light extraction and reliability. In the interest of highly effective heat removal from LEDs with direct liquid cooling, the current paper starts with explaining the increasing thermal problems in electronics and also in lighting technologies followed by a brief overview of the state of the art for liquid cooling technologies. Then, attention will be turned into thermal consideration of approximately a 60W replacement LED light engine. A conjugate CFD model is deployed to determine local hot spots and to optimize the thermal resistance by varying multiple design parameters, boundary conditions, and the type of fluid. Detailed system level simulations also point out possible abatement techniques for local hot spots while keeping light extraction at maximum.

Sector Rotating Heat Pipe With Interconnected Branches and Reservoir for Turbomachinery Cooling

2016 ◽  
Vol 139 (1) ◽  
Author(s):  
Brian Reding ◽  
Yiding Cao
Keyword(s):  
Experimental Study ◽  
Heat Pipe ◽  
Heat Pipes ◽  
High Heat ◽  
Heat Fluxes ◽  
Practical Solution ◽  
Pipe System ◽  
Current Configuration ◽  
Cooling Technique

Heat pipe technology offers a possible cooling technique for structures exposed to high heat fluxes, as in turbomachinery such as compressors and turbines. However, in its current configuration as single heat pipes, implementation of the technology is limited due to the difficulties in manufacturability and costs. Hence, a study to develop a new radially rotating (RR) heat pipe system was undertaken, which integrates multiple RR heat pipes with a common reservoir and interconnected braches for a more effective and practical solution to turbomachinery cooling. Experimental study has shown that the integration of multiple heat pipe branches with a reservoir at the top is feasible.

Analysis of Parallel Microchannels for Flow Control and Hot Spot Cooling

2013 ◽  
Vol 5 (4) ◽  
Author(s):  
Stephen A. Solovitz
Keyword(s):  
Heat Transfer ◽  
Power Law ◽  
Hot Spots ◽  
Hot Spot ◽  
Electronics Cooling ◽  
Flow Distribution ◽  
Reynolds Numbers ◽  
Heat Fluxes ◽  
Cooling Devices ◽  
Parallel Microchannels

Microchannel heat transfer is commonly applied in the thermal management of high-power electronics. Most designs involve a series of parallel microchannels, which are typically analyzed by assuming a uniform flow distribution. However, many devices have a nonuniform thermal distribution, with hot spots producing much higher heat fluxes and temperatures than the baseline. Although solutions have been developed to improve local heat transfer, these are advanced methods using embedded cooling devices. As an alternative, a passive solution is developed here using analytical methods to optimize the channel geometry for a desired, nonuniform flow distribution. This results in a simple power law for the passage diameter, which may be useful for many microfluidic systems, including electronics cooling devices. Computational simulations are then applied to demonstrate the effectiveness of the power law for laminar conditions. At low Reynolds numbers, the flow distribution can be controlled to good accuracy, matching the desired distribution to within less than 1%. Further simulations consider the control of hot spots in laminar developing flow. Under these circumstances, temperatures can be made uniform to within 2 °C over a range of Reynolds numbers (60 to 300), demonstrating the capability of this power law solution.

Thermal Management of a Heat-Pipe Drill: A FEM Analysis

2003 ◽  
Author(s):  
Tien-Chien Jen ◽  
Rajendra Jadhav
Keyword(s):  
Finite Element ◽  
Heat Pipe ◽  
Thermal Management ◽  
Heat Pipes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Drilling Process ◽  
Generation Process ◽  
Finite Element Software

Thermal management using heat pipes is gaining significant attention in past decades. This is because of the fact that it can be used as an effective heat sink in very intricate and space constrained applications such as in electronics cooling or turbine blade cooling where high heat fluxes are involved. Extensive research has been done in exploring various possible applications for the use of heat pipes as well as understanding and modeling the behavior of heat pipe under those applications. One of the possible applications of heat pipe technology is in machining operations, which involves a very high heat flux being generated during the chip generation process. Present study focuses on the thermal management of using a heat pipe in a drill for a drilling process. To check the feasibility and effectiveness of the heat pipe drill, structural and thermal analyses are performed using Finite Element Analysis. Finite Element Software ANSYS was used for this purpose. It is important for any conceptual design to be made practical and hence a parametric study was carried out to determine the optimum geometry size for the heat pipe for a specific standard drill.

Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions

2008 ◽  
Vol 130 (12) ◽  
Author(s):  
Je-Young Chang ◽  
Ravi S. Prasher ◽  
Suzana Prstic ◽  
P. Cheng ◽  
H. B. Ma
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Hot Spots ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Experimental Results ◽  
Nonuniform Heating ◽  
Test Results ◽  
Uniform Heating

This paper reports the test results of vapor chambers using copper post heaters and silicon die heaters. Experiments were conducted to understand the effects of nonuniform heating conditions (hot spots) on the evaporative thermal performance of vapor chambers. In contrast to the copper post heater, which provides ideal heating, a silicon chip package was developed to replicate more realistic heat source boundary conditions of microprocessors. The vapor chambers were tested for hot spot heat fluxes as high as 746 W/cm2. The experimental results show that evaporator thermal resistance is not sensitive to nonuniform heat conditions, i.e., it is the same as in the uniform heating case. In addition, a model was developed to predict the effective thickness of a sintered-wick layer saturated with water at the evaporator. The model assumes that the pore sizes in the sintered particle wick layer are distributed nonuniformly. With an increase of heat flux, liquid in the larger size pores are dried out first, followed by drying of smaller size pores. Statistical analysis of the pore size distribution is used to calculate the fraction of the pores that remain saturated with liquid at a given heat flux condition. The model successfully predicts the experimental results of evaporative thermal resistance of vapor chambers for both uniform and nonuniform heat fluxes.

A Mathematical Modeling Method for Capillary Limit of Micro Heat Pipe with Sintered Wick

2011 ◽  
Vol 175 ◽  
pp. 335-341
Author(s):  
Xi Bing Li ◽  
Chang Long Yang ◽  
Gong Di Xu ◽  
Wen Yuan ◽  
Shi Gang Wang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
High Heat ◽  
Experimental Investigations ◽  
High Heat Flux ◽  
Micro Heat Pipe ◽  
Copper Powders ◽  
Capillary Limit

With heat flux increasing and cooling space decreasing in microelectronic and chemical products, micro heat pipe has become an ideal heat dissipation device in high heat-flux products. Through the analysis of its working principle, the factors that affect its heat transfer limits and the patterns in which copper powders are arrayed in circular cavity, this paper first established a mathematical model for the crucial factors in affecting heat transfer limits in a circular micro heat pipe with a sintered wick, i.e. a theoretical model for capillary limit, and then verified its validity through experimental investigations. The study lays a powerful theoretical foundation for designing and manufacturing circular micro heat pipes with sintered wicks.

Transient Multidimensional Analysis of Nonconventional Heat Pipes With Uniform and Nonuniform Heat Distributions

1991 ◽  
Vol 113 (4) ◽  
pp. 995-1002 ◽  
Author(s):  
Y. Cao ◽  
A. Faghri
Keyword(s):  
Heat Pipe ◽  
Three Dimensional ◽  
Leading Edge ◽  
Heat Pipes ◽  
High Heat ◽  
Heat Fluxes ◽  
Multidimensional Analysis ◽  
Vapor Flow ◽  
Operating Limits ◽  
Good Agreement

A numerical analysis of transient heat pipe performance including nonconventional heat pipes with nonuniform heat distributions is presented. A body-fitted grid system was applied to a three-dimensional wall and wick model, which was coupled with a transient compressible quasi-one-dimensional vapor flow model. The numerical results were first compared with experimental data from cylindrical heat pipes with good agreement. Numerical calculations were then made for a leading edge heat pipe with localized high heat fluxes. Performance characteristics different from conventional heat pipes are illustrated and some operating limits concerning heat pipe design are discussed.

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

2014 ◽  
Vol 136 (2) ◽  
Author(s):  
Yassir Madhour ◽  
Brian P. d'Entremont ◽  
Jackson Braz Marcinichen ◽  
Bruno Michel ◽  
John Richard Thome
Keyword(s):  
Integrated Circuit ◽  
Hot Spots ◽  
High Performance ◽  
Three Dimensional ◽  
Flow Distribution ◽  
Simulation Method ◽  
Heat Fluxes ◽  
Signal Delay ◽  
Two Phase ◽  
Signal Delay Time

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and the signal delay time and allows improvements in energy efficiency. However, the accumulation of heat fluxes and thermal interface resistances is a major limitation of vertically integrated packages. Scalable cooling solutions, such as two-phase interlayer cooling, will be required to extend 3D stacks beyond the most modest numbers of dies. This paper introduces a realistic 3D chip stack along with a simulation method for the heat spreading and flow distribution among the channels of the evaporators. The model includes the significant sensitivity of each channel's friction factor to vapor quality, and hence mass flow to heat flux, which characterizes parallel two-phase flows. Simulation cases explore various placements of hot spots within the stack and effects which are unique to two-phase interlayer cooling. The results show that the effect of hot spots on individual dies can be mitigated by strong interlayer heat conduction if the relative position of the hot spots is selected carefully to result in a heat load and flow which are well balanced laterally.

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