Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead-Free Electronics Packaging

2012 ◽  
Author(s):  
Matthew J. Combs ◽  
S. Manian Ramkumar ◽  
Satish Kandlikar
Keyword(s):  
Thermal Conductivity ◽  
Base Material ◽  
Bond Line ◽  
Thermal Interface Material ◽  
The Novel ◽  
Conductive Adhesives ◽  
Curing Conditions ◽  
Bond Line Thickness ◽  
Significant Research ◽  
American Society

The continued desire to utilize an alternative to lead-based solder materials for electrical interconnections has led to significant research interest in Anisotropic Conductive Adhesives (ACAs). The use of ACAs in electrical connections creates bonds using a combination of metal particles and epoxies to replace solder. The novel ACA discussed in this paper allows for bonds to be created through aligning columns of conductive particles along the Z-axis. These columns are formed by the application of a magnetic field, during the curing process. The benefit of this novel ACA is that it does not require precise printing of the adhesive on pads and also enables the mass curing without creating shorts in the circuitry. This paper will present the findings of the thermal conductivity performance tests using the novel ACA and its applicability as a thermal interface material and for assembling bottom termination components, power devices, etc. The columns that act as electrical conduction paths also contribute towards the thermal conductivity. The thermal conductivity of the novel ACA was measured utilizing a system that is similar to that in ASTM (American Society of Testing Materials) D5470 standard. The goal was to examine the influence of Bond Line Thickness (BLT), particle loading densities, particle diameters and adhesive matrix curing conditions on the electrical and thermal performance of the novel ACA. This paper will also present a numerical model to describe the thermal behavior of the novel ACA. The novel ACA’s applicability for PCB-level assembly has also been successfully demonstrated by RIT, including base material characterization, effect of process parameters, failures, and long-term reliability. Reliability testing included the investigation of the assembly performance in temperature and humidity aging, thermal aging, air-to-air thermal cycling, and drop testing.

Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials

2005 ◽  
Author(s):  
Gary Lehmann ◽  
Hao Zhang ◽  
Arun Gowda ◽  
David Esler
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Thermal Resistance ◽  
Bond Line ◽  
Surface Conductance ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bond Line Thickness ◽  
Matrix Surface ◽  
Interface Materials

Measurements and modeling of the thermal resistance of thin (< 100 microns) bond-lines are reported for composite thermal interface materials (TIMs). The composite TIMs consist of alumina particles dispersed in a polymer matrix to form six different adhesive materials. These model TIMs have a common matrix material and are distinguished by their particle size distributions. Bond-lines are formed in a three-layer assembly consisting of a substrate-TIM-substrate structure. The thermal resistance of the bond-line is measured, as a function of bond-line thickness, using the laser flash-technique. A linear variation of resistance with bond-line thickness is observed; Rbl = β · Lbl + Ro. A model is presented that predicts the effective thermal conductivity of the composite as a function of the particle and matrix conductivity, the particle-matrix surface conductance, the particle volume fraction and the particle size distribution. Specifically a method is introduced to account for a broad, continuous size distribution. A particle-matrix surface conductance value of ∼10W/mm2K is found to give good agreement between the measured and predicted effective thermal conductivity values of the composite TIMs.

Bond Line Thickness of Thermal Interface Materials With Carbon Nanotubes

2005 ◽  
Author(s):  
Senthil A. G. Singaravelu ◽  
Xuejiao Hu ◽  
Kenneth E. Goodson
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Volume Fraction ◽  
Bond Line ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Line Thickness ◽  
Bond Line Thickness ◽  
The Impact ◽  
Interface Materials

Increasing power dissipation in today’s microprocessors demands thermal interface materials (TIMs) with lower thermal resistances. The TIM thermal resistance depends on the TIM thermal conductivity and the bond line thickness (BLT). Carbon Nanotubes (CNTs) have been proposed to improve the TIM thermal conductivity. However, the rheological properties of TIMs with CNT inclusions are not well understood. In this paper, the transient behavior of the BLT of the TIMs with CNT inclusions has been measured under controlled attachment pressures. The experimental results show that the impact of CNT inclusions on the BLT at low volume fractions (up to 2 vol%) is small; however, higher volume fraction of CNT inclusions (5 vol%) can cause huge increase in TIM thickness. Although thermal conductivities are higher for higher CNT fractions, a minimum TIM resistance exists at some optimum CNT fraction for a given attachment pressure.

Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

2012 ◽  
Author(s):  
Dustin D’Angelo ◽  
S. Manian Ramkumar ◽  
Luke Wentlent ◽  
Peter Borgesen
Keyword(s):  
Shear Stress ◽  
Thermal Cycling ◽  
Filler Particle ◽  
Base Material ◽  
Primary Objective ◽  
Shear Loading ◽  
Lead Free ◽  
The Novel ◽  
Conductive Adhesives ◽  
Pcb Assembly

The continued desire for an alternative to lead-based solder materials for electrical interconnections has led to significant research interest in Anisotropic Conductive Adhesives (ACAs). These create bonds using a combination of metal particles and epoxies to replace solder. The novel ACA discussed in this paper allows for bonds to be created through aligning columns of conductive particles along the Z-axis. These columns are formed by the application of a magnetic field, during the curing process. The benefit of this novel ACA is that it does not require precise printing of the adhesive on pads and also enables the mass curing without creating shorts in the circuitry. The novel ACA’s applicability for PCB-level assembly has been successfully demonstrated by RIT. The research at RIT has also characterized the base material properties, analyzed the effect of various process parameters, identified failures, and investigated the ACA’s long-term reliability for surface mount PCB assembly. Reliability testing included an investigation of the assembly performance in temperature and humidity aging, thermal aging, air-to-air thermal cycling, and drop testing conditions. For example, it has been shown that by modifying the filler particle size and coating, reliability of >1500 hours in high temperature, high humidity aging (HTHH), and 100 hours in highly accelerated stress testing (HAST) can be successfully achieved. This paper highlights research comparing the shear loading performance of the novel ACA to that of tin-lead and lead free solders. Samples assembled with the adhesive and the solders were subjected to multiple tin-lead and lead free reflow cycles. The primary objective was to understand the deterioration in shear loading as influenced by multiple reflow cycles. Published research materials have shown the influence of the change in solder joint performance with multiple reflows due to the increase in intermetallic thickness. The results of a DOE study show the influence of the various factors and levels. Shear stress calculations indicate higher stress experienced by the adhesive joints as compared to the solder joints due to the spreading of the solder during wetting. Empirical relationships will be derived from the experimental data to help determine the required contact area for a given level of shear loading. The experimental results also reveal the rapid decrease in Shear stress between the first and second reflow and the slow decline in strength up to five reflows. Findings from this work will be used to assess the use and reliability of this adhesive for attaching the top component of Package-on-Package (PoP) 3D stacked components, in thermal cycling, HAST and HTHH environments.

Effective thermal conductivity of open-pore metal foams as a function of the base material

2015 ◽  
Vol 57 (10) ◽  
pp. 825-836 ◽  
Author(s):  
Alexander Martin Matz ◽  
Bettina Stefanie Mocker ◽  
Norbert Jost ◽  
Peter Krug
Keyword(s):  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Base Material ◽  
Metal Foams

scholarly journals Effect of Bond-Line Thickness on Fatigue Crack Growth of Structural Acrylic Adhesive Joints

Materials ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1723
Author(s):  
Yu Sekiguchi ◽  
Chiaki Sato
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Fatigue Behavior ◽  
Adhesive Bond ◽  
Bond Line ◽  
Loading Conditions ◽  
Fatigue Crack Growth Resistance ◽  
Line Thickness ◽  
Bond Line Thickness

With an increasing demand for adhesives, the durability of joints has become highly important. The fatigue resistance of adhesives has been investigated mainly for epoxies, but in recent years many other resins have been adopted for structural adhesives. Therefore, understanding the fatigue characteristics of these resins is also important. In this study, the cyclic fatigue behavior of a two-part acrylic-based adhesive used for structural bonding was investigated using a fracture-mechanics approach. Fatigue tests for mode I loading were conducted under displacement control using double cantilever beam specimens with varying bond-line thicknesses. When the fatigue crack growth rate per cycle, da/dN, reached 10−5 mm/cycle, the fatigue toughness reduced to 1/10 of the critical fracture energy. In addition, significant changes in the characteristics of fatigue crack growth were observed varying the bond-line thickness and loading conditions. However, the predominance of the adhesive thickness on the fatigue crack growth resistance was confirmed regardless of the initial loading conditions. The thicker the adhesive bond line, the greater the fatigue toughness.

scholarly journals Design of Thermal Insulation Materials with Different Geometries of Channels

Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2217
Author(s):  
Daniela Șova ◽  
Mariana Domnica Stanciu ◽  
Sergiu Valeriu Georgescu
Keyword(s):  
Thermal Conductivity ◽  
Porous Structure ◽  
Base Material ◽  
Cost Effective ◽  
Heat Radiation ◽  
Average Temperature ◽  
Temperature Regimes ◽  
The Face ◽  
Inclined Channels ◽  
Air Channels

Investigating the large number of various materials now available, some materials scientists promoted a method of combining existing materials with geometric features. By studying natural materials, the performance of simple constituent materials is improved by manipulating their internal geometry; as such, any base material can be used by performing millimeter-scale air channels. The porous structure obtained utilizes the low thermal conductivity of the gas in the pores. At the same time, heat radiation and gas convection is hindered by the solid structure. The solution that was proposed in this research for obtaining a material with porous structure consisted in perforating extruded polystyrene (XPS) panels, as base material. Perforation was performed horizontally and at an angle of 45 degrees related to the face panel. The method is simple and cost-effective. Perforated and simple XPS panels were subjected to three different temperature regimes in order to measure the thermal conductivity. There was an increase in thermal conductivity with the increase in average temperature in all studied cases. The presence of air channels reduced the thermal conductivity of the perforated panels. The reduction was more significant at the panels with inclined channels. The differences between the thermal conductivity of simple XPS and perforated XPS panels are small, but the latter can be improved by increasing the number of channels and the air channels’ diameter. Additionally, the higher the thermal conductivity of the base material, the more significant is the presence of the channels, reducing the effective thermal conductivity. A base material with low emissivity may also reduce the thermal conductivity.

Sticky thermoelectric materials for flexible thermoelectric modules to capture low-temperature waste heat

MRS Advances ◽  
2020 ◽  
Vol 5 (10) ◽  
pp. 481-487 ◽  
Author(s):  
Norifusa Satoh ◽  
Masaji Otsuka ◽  
Yasuaki Sakurai ◽  
Takeshi Asami ◽  
Yoshitsugu Goto ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Low Temperature ◽  
Waste Heat ◽  
Air Cooling ◽  
Conductive Adhesives ◽  
Hot Plate ◽  
Low Thermal Conductivity ◽  
Te Modules ◽  
P Type ◽  
Flexible Thermoelectric

ABSTRACTWe examined a working hypothesis of sticky thermoelectric (TE) materials, which is inversely designed to mass-produce flexible TE sheets with lamination or roll-to-roll processes without electric conductive adhesives. Herein, we prepared p-type and n-type sticky TE materials via mixing antimony and bismuth powders with low-volatilizable organic solvents to achieve a low thermal conductivity. Since the sticky TE materials are additionally injected into punched polymer sheets to contact with the upper and bottom electrodes in the fabrication process, the sticky TE modules of ca. 2.4 mm in thickness maintained temperature differences of ca. 10°C and 40°C on a hot plate of 40 °C and 120°C under a natural-air cooling condition with a fin. In the single-cell resistance analysis, we found that 75∼150-µm bismuth powder shows lower resistance than the smaller-sized one due to the fewer number of particle-particle interfaces in the electric pass between the upper and bottom electrodes. After adjusting the printed wiring pattern for the upper and bottom electrodes, we achieved 42 mV on a hot plate (120°C) with the 6 x 6 module having 212 Ω in the total resistance. In addition to the possibility of mass production at a reasonable cost, the sticky TE materials provide a low thermal conductivity for flexible TE modules to capture low-temperature waste heat under natural-air cooling conditions with fins for the purpose of energy harvesting.

scholarly journals Estimations on Properties of Redox Reactions to Electrical Energy and Storage Device of Thermoelectric Pipe (TEP) Using Polymeric Nanofluids

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1812
Author(s):  
Qin Gang ◽  
Rong-Tsu Wang ◽  
Jung-Chang Wang
Keyword(s):  
Thermal Conductivity ◽  
Power Density ◽  
Heat Dissipation ◽  
Electrical Energy ◽  
Steel Tube ◽  
Storage Device ◽  
Stainless Steel Tube ◽  
The Novel ◽  
Empirical Formulas ◽  
Dissipative Heat

A thermoelectric pipe (TEP) is constructed by tubular graphite electrodes, Teflon material, and stainless-steel tube containing polymeric nanofluids as electrolytes in this study. Heat dissipation and power generation (generating capacity) are both fulfilled with temperature difference via the thermal-electrochemistry and redox reaction effects of polymeric nanofluids. The notion of TEP is to recover the dissipative heat from the heat capacity generated by the relevant machine systems. The thermal conductivity and power density empirical formulas of the novel TEP were derived through the intelligent dimensional analysis with thermoelectric experiments and evaluated at temperatures between 25 and 100 °C and vacuum pressures between 400 and 760 torr. The results revealed that the polymeric nanofluids composed of titanium dioxide (TiO2) nanoparticles with 0.2 wt.% sodium hydroxide (NaOH) of the novel TEP have the best thermoelectric performance among these electrolytes, including TiO2 nanofluid, TiO2 nanofluid with 0.2 wt.% NaOH, deionized water, and seawater. Furthermore, the thermal conductivity and power density of the novel TEP are 203.1 W/(m·K) and 21.16 W/m3, respectively.

Adhesive penetration of wood cell walls investigated by scanning thermal microscopy (SThM)

Holzforschung ◽  
2008 ◽  
Vol 62 (1) ◽  
pp. 91-98 ◽  
Author(s):  
Johannes Konnerth ◽  
David Harper ◽  
Seung-Hwan Lee ◽  
Timothy G. Rials ◽  
Wolfgang Gindl
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Surface Temperature ◽  
Cell Walls ◽  
Adhesive Contact ◽  
Wood Adhesive ◽  
Bond Line ◽  
Scanning Thermal Microscopy ◽  
Thermal Probe ◽  
Thermal Microscopy

Abstract Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.

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