Evaluation of Backstitch Tool Path Strategy for Stability and Productivity in Micro-Drilling

Author(s):  
Jong-Seol Moon ◽  
Hae-Sung Yoon ◽  
Gyu-Bong Lee ◽  
Sung-Hoon Ahn

Micro-drilling with spacing intervals in the hundred micrometer range is an essential process, however suitable methods are lacking despite efforts to develop useful strategies for precision micro-drilling. For efficiency, printed circuit boards are stacked in several layers and drilled through simultaneously but the process results in misalignment of holes as observed between consecutive layers from top to bottom. The work herein proposes a new tool path strategy in comparison with conventional methods. Hole positioning, drilling thrust force, and duration time were measured and evaluated. This strategy can be utilized in micro-manufacturing process for improving machining stability and productivity.

2014 ◽  
Vol 77 (5-8) ◽  
pp. 1305-1314 ◽  
Author(s):  
Li Juan Zheng ◽  
Cheng Yong Wang ◽  
Yun Peng Qu ◽  
Yue Xian Song ◽  
Lian Yu Fu

2004 ◽  
Vol 126 (4) ◽  
pp. 719-726 ◽  
Author(s):  
Bo-Wun Huang

The dynamic characteristics of a microdrill in the drilling process were investigated in this study. The trend toward higher density printed circuit boards requires smaller holes, down to 0.3 mm in diameter, to be drilled through the board layers. To improve quality, produce a higher production rate, and avoid drill breakage, the dynamic characteristics of the microdrilling process must be studied. A stepped pretwisted beam is used to simulate the microdrill. A moving Winkler-Type elastic foundation is used to approximate the drilling process. A time-dependent vibration model for drilling is presented. The rotating speed, pretwisted angle, and thrust force effects of the microdrill are considered. The numerical analysis indicates that the natural frequency is reduced suddenly as the microdrill moves into a workpiece.


2012 ◽  
Vol 565 ◽  
pp. 442-447 ◽  
Author(s):  
Taiji Funabiki ◽  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Hiroyuki Kodama

This paper describes micro-drilling processes for printed circuit boards (PCBs) containing fillers with high hardness and high thermal conductivity. Inspired primarily by devices such as digital cameras, laptop computers, and wireless communications devices, the electronics field today is continuously demanding smaller, lighter, and more technologically advanced high performance devices. However, that the increase in semiconductor-generated heat tends to affect such devices negatively. Additionally, from the viewpoint of environmental problems, electric vehicles and LEDs are being developed actively. PCBs are one of the principal components for building such devices. In recent years, PCBs containing alumina fillers with high thermal conductivity have been developed and begun to be widely used. However, when processing these PCBs, the drill tools become severely worn because of the filler’s high hardness. We therefore examined the drill wear characteristics. The results show the filler is the main factor that causes drill wear, while the increase in cutting force does not affect it. The cutting force increases with the drill wear linearly. Moreover, the characteristic of PCBs with higher filler content rates is close to that of inorganic material like ceramics.


2009 ◽  
Vol 75 (12) ◽  
pp. 1428-1433 ◽  
Author(s):  
Hidehito WATANABE ◽  
Hideo TSUZAKA ◽  
Masami MASUDA

1994 ◽  
Vol 60 (12) ◽  
pp. 1796-1800 ◽  
Author(s):  
Youichi DAIKOH ◽  
Takao TERABAYASHI ◽  
Masami MASUDA

1997 ◽  
Vol 63 (3) ◽  
pp. 431-435 ◽  
Author(s):  
Kyoko AMEMIYA ◽  
Takao TERABAYASHI ◽  
Youichi DAIKOH ◽  
Nobuhiko FUKUOKA ◽  
Masami MASUDA

2008 ◽  
Vol 74 (11) ◽  
pp. 1204-1209 ◽  
Author(s):  
Hidehito WATANABE ◽  
Hideo TSUZAKA ◽  
Masami MASUDA

2013 ◽  
Vol 79 (12) ◽  
pp. 1229-1234 ◽  
Author(s):  
Takahiro SATO ◽  
Hisataka TANAKA ◽  
Masahiko SATO ◽  
Takao KOIDE ◽  
Yoshinori NAKAJIMA ◽  
...  

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