Numerical Investigation of Electronic Liquid Cooling Based on the Thermomagnetic Effect

Author(s):  
Giti Karimi-Moghaddam ◽  
Richard D. Gould ◽  
Subhashish Bhattacharya

Liquid cooling for thermal management has been widely applied in high power electronic systems. Use of pumps may often introduce reliability and mechanical limitations such as vibration of moving parts, noise problems, leakage problems, and considerable power consumption. This paper presents a theoretical design of circulating a liquid coolant using magnetic and thermal fields which surround high power electronic systems by means of thermomagnetic effects of temperature sensitive magnetic fluids. Numerical simulation models of the heat transfer process from a magnetic liquid contained in a closed flow loop in the presence of an external magnetic field have been developed. These models include the coupling of three fundamental phenomena, i.e. magnetic, thermal, and fluid dynamic features. In this cooling device, the thermomagnetic convection is generated by a non-uniform magnetic field from a solenoid, which is placed close to the fluid loop. The device cooling load is calculated in the region near the solenoid. No energy is needed, other than the heat load (i.e. waste heat from actual electrical device), to drive the cooling system, and as such, the device can be considered completely self-powered. In effect, the heat added to the ferrofluid in the presence of a magnetic field is converted into useful flow work. In this numerical study, the effects of different factors such as input heat load, magnetic field strength and magnetic distribution (based on solenoid dimensions and the applied electrical current) along the loop, on the performance of the cooling system are analyzed and discussed. Finally, the variation of the local Nusselt number along the heated and cooled regions of the flow loop are calculated and compared with laminar entry length analytical solutions.

2020 ◽  
Vol 10 (5) ◽  
pp. 1660
Author(s):  
Aihua Chu ◽  
Yinnan Yuan ◽  
Jianxin Zhu ◽  
Xiao Lu ◽  
Chenquan Zhou

High power cylindrical Ni-MH battery cells have a heavy heat load because of their high discharge rate and large equivalent internal resistance. This heavy heat load, together with an imbalanced flow in parallel liquid cooling systems, can lead to variances in the temperature of each cell in the entire battery pack, thereby reducing the life cycle of the battery pack. In this paper, a parallel-series combined liquid cooling system for a 288V Ni-MH battery pack was designed, and several parameters that influence the flow balance of the system by heat transfer and fluid dynamics were calculated. Then, a thermal-fluid simulation was executed with different parameters using StarCCM+ software, and the simulation results were validated by a battery pack temperature experiment on a bench and in a vehicle. The results indicate that the cell’s temperature and temperature differences can be kept within an ideal range. We also determined that within the battery power requirements and structural spacing limits, the total flow rate of the cooling liquid, the cross-sectional area ratio of the main pipe to the branch pipes, and the number of internal supporting walls in each branch pipe need to be large enough to minimize the cell’s maximum temperature and temperature differences.


2005 ◽  
Vol 2005 (0) ◽  
pp. 219-220
Author(s):  
Woo-Suk SEO ◽  
Kazuhiro YOSHIDA ◽  
Shinichi YOKOTA ◽  
Kazuya EDAMURA

2010 ◽  
Vol 132 (5) ◽  
Author(s):  
R. Wälchli ◽  
T. Brunschwiler ◽  
B. Michel ◽  
D. Poulikakos

A self-contained, small-volume liquid cooling system for thin form-factor electronic equipment (e.g., blade server modules) is demonstrated experimentally in this paper. A reciprocating water flow loop absorbs heat using mesh-type microchannel cold plates and spreads it periodically to a larger area. From there, the thermal energy is interchanged via large area, low pressure drop cold plates with a secondary heat transfer loop (air or liquid). Four phase-shifted piston pumps create either a linearly or radially oscillating fluid flow in the frequency range of 0.5–3 Hz. The tidal displacement of the pumps covers 42–120% of the fluid volume, and, therefore, an average flow rate range of 100–800 ml/min is tested. Three different absorber mesh designs are tested. Thermal and fluidic characteristics are presented in a time-resolved and a time-averaged manner. For a fluid pump power of 1 W, a waste heat flux of 180 W/cm2(ΔT=67 K) could be dissipated from a 3.5 cm2 chip. A linear oscillation flow pattern is advantageous over a radial one because of the more efficient heat removal from the chip and lower hydraulic losses. The optimum microchannel mesh density is determined as a combination of low pump losses and high heat transfer rates.


Author(s):  
Andrei Blinov ◽  
Dmitri Vinnikov ◽  
Tõnu Lehtla

Cooling Methods for High-Power Electronic Systems Thermal management is a crucial step in the design of power electronic applications, especially railroad traction and automotive systems. Mass/size parameters, robustness and reliability of the power electronic system greatly depend on the cooling system type and performance. This paper presents an approximate parameter estimation of the thermal management system required as well as different commercially available cooling solutions. Advantages and drawbacks of different designs ranging from simple passive heatsinks to complex evaporative systems are discussed.


2005 ◽  
Vol 2005.7 (0) ◽  
pp. 103-104
Author(s):  
Woo-Suk SEO ◽  
Kazuhiro YOSHIDA ◽  
Shinichi YOKOTA ◽  
Kazuya EDAMURA

2021 ◽  
Author(s):  
Julian Weimer ◽  
Dominik Koch ◽  
Maximilian Nitzsche ◽  
Jorg Haarer ◽  
Ingmar Kallfass

2018 ◽  
Author(s):  
Seokkan Ki ◽  
Jooyoung Lee ◽  
Seunggeol Ryu ◽  
Youngsuk Nam

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