Precision Gravure Printing of Conductive Ink on Flexible Substrate for Printed Electronics

2012 ◽  
Author(s):  
Deokkyun Yoon ◽  
Seung-Hyun Lee
Keyword(s):  
Printed Circuit Board ◽  
Printed Electronics ◽  
Flexible Substrate ◽  
Circuit Board ◽  
Rfid Tags ◽  
Gravure Printing ◽  
Printed Circuit ◽  
Roll To Roll ◽  
Conductive Line ◽  
Grid Mesh

In attempt to lower the production cost, roll-to-roll printing is gaining attention in electronics industries. Gravure printing, which has been the method of choice in the graphics industry for years thanks to its high resolution and process speed, is utilized to print conductive lines on flexible substrate. The main benefactors of such utilization are touch screen panel, RFID tags, thin film photovoltaics, and printed circuit board industries. The preferred substrate for conductive line printing is polymer. Due to its highly flexible nature, the printed electronics is highly flexible and is expected to create new markets where the rigid silicon and glass based electronics could not. In this work, the effect of gravure cell and trench on printing thin conductive lines as low as 20 μm line width on the polyethylene terephthalate (PET) substrate is presented. Various printing orientations including the machine direction, the cross direction, and the 45° grid mesh are used and the respective orientation’s printability is discussed.

scholarly journals Body-Implantable RFID Tags Based on Ormocer Printed Circuit Board Technology

2020 ◽  
Vol 4 (8) ◽  
pp. 1-4
Author(s):  
Gianmario Scotti ◽  
Sue-Yuan Fan ◽  
Chun-Hsiang Liao ◽  
Yi Chiu
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Rfid Tags ◽  
Printed Circuit

scholarly journals Current capabilities of prototyping technologies for multilayer printed circuit boards on a 3D printer

2021 ◽  
Vol 9 (4) ◽  
pp. 28-37
Author(s):  
D. S. Vorunichev ◽  
K. Yu. Vorunicheva
Keyword(s):  
3D Printing ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Printed Electronics ◽  
Circuit Board ◽  
3D Printer ◽  
Conductive Ink ◽  
Circuit Boards ◽  
Uv Curable ◽  
Printed Circuit

A new direction in 3D printing was investigated – prototyping of single-sided, double-sided and multilayer printed circuit boards. The current capabilities and limitations of 3D printed circuit board printing technology were identified. A comparative analysis of the characteristics of two desktop 3D printers presented in the industry for prototyping radio electronics, as well as the first professional machine DragonFly LDM 2020, which is a mini-factory for prototyping multilayer printed circuit boards, was carried out. The first practical experience of working and printing on DragonFly LDM 2020 supplied to the megalaboratory “3D prototyping and control of multilayer printed circuit boards” of the Institute of Radio Engineering and Telecommunication Systems MIREA – Russian Technological University is presented. The first samples of electronic boards printed on a 3D printer by the method of inkjet printing were obtained. An additive technology for the production of multilayer printed circuit boards is considered: printing with two printheads with conductive and dielectric nano-ink with two curing systems: an infrared sintering system for conductive ink and a UV curing system for dielectric ink. The LDM (Dragonfly Lights-out Digital Manufacturing) production method with the necessary maintenance is presented. The method allows the system to work roundthe-clock with minimal human intervention, significantly increasing the productivity of 3D printing and expanding the possibilities of prototyping. The materials used for 3D printing of multilayer printed circuit boards and their characteristics were investigated: dielectric acrylate nano-ink (Dielectric Ink 1092 – Dielectric UV Curable Acrylates Ink), conducting ink with silver nanoparticles (AgCite™ 90072 Silver Nanoparticle Conductive Ink). The research carried out allows us to compare the technological standards of printed electronics with traditional methods of manufacturing multilayer printed circuit boards for a number of parameters.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

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