An Investigation on Cutting Tool Temperatures in Composite Machining Assisted With Heat-Pipe Cooling

2005 ◽  
Author(s):  
Jie Liu ◽  
Y. Kevin Chou ◽  
Mark T. North ◽  
Kirk A. Bennett
Keyword(s):  
Heat Flux ◽  
Partition Coefficient ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Cutting Tool ◽  
Heat Pipes ◽  
Rake Face ◽  
Heat Partition ◽  
Coated Tools ◽  
Coating Failure

Metal matrix composites (MMC) are difficult to cut materials, and yet only diamond tools have been successfully utilized for such machining applications. Wear of diamond-coated tools is characterized by catastrophic coating failure (peeling off) due to the adhered work materials at the flank wear-land surface and the high stress developed at the coating-substrate interface, associated with high temperatures, because of very different thermal expansion coefficients. Temperature reductions, therefore, may delay the onset of the coating failure and offer tool life extension. A passive heat-dissipation device, heat-pipe, has been tested for cutting temperature reductions in MMC machining. Though it is intuitive that heat pipes may enhance heat transfer and plausibly reduce the tool temperatures, heat pipes may also increase heat partitioning into the tool, and complicate its effects on the heat removal and temperature reduction efficiency. This paper reports aluminum composite machining by diamond-coated tools and investigates the heat-pipe effects on tool temperature reductions. Numerical simulation of heat conduction in the cutting tool system was performed to evaluate cutting tool temperatures without and with a heat-pipe. A 3-D thermal model of the cutting tool system including coating, insert substrate, and tool holder was established. The heat source was characterized as a heat flux, a portion of the frictional heat flux at the rake face, over the chip-tool contact area. To determine the heat-partition coefficient, a separate 2-D chip model was established with a heat flux, balanced the total rake-face heat flux, over the contact and moving with the chip speed. With the tool and chip thermal models and by matching the average temperature at the tool-chip contact of the two models, the heat partition coefficient can be numerically determined. The model has been used to evaluate how the heat-pipe modifies the cutting tool temperatures. Applying heat-pipe cooling inevitably increases the heat partition into the tool despite the enhanced heat dissipation. However, the heat pipe still effectively reduces the tool-chip contact temperatures, depending upon machining conditions. Cutting tool temperatures have also been measured in machining using thermocouples. The simulation results reasonably agree with the experimental measurements.

Cutting Tool Temperature Analysis in Heat-Pipe Assisted Composite Machining

2007 ◽  
Vol 129 (5) ◽  
pp. 902-910 ◽  
Author(s):  
Jie Liu ◽  
Y. Kevin Chou
Keyword(s):  
Heat Flux ◽  
Finite Element ◽  
Heat Source ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Cutting Tool ◽  
Advanced Materials ◽  
Chemical Vapor Deposition Diamond ◽  
Rake Face ◽  
Coating Failure

Machining of advanced materials, such as composite, encounters high cutting temperatures and rapid tool wear because of the abrasive nature of the reinforcement phases in the workpiece materials. Ultrahard coatings, such as chemical vapor deposition diamond, have been used for machining such advanced materials. Wear of diamond-coated tools is characterized by catastrophic coating failure, plausibly due to the high stress developed at the coating-substrate interface at high temperatures because of very different elastic moduli and thermal expansion coefficients. Temperature reductions, therefore, may delay the onset of the coating failure and offer tool life extension. In this study, a passive heat-dissipation device, the heat pipe, has been incorporated in composite machining. Though it is intuitive that heat transfer enhanced by the heat pipe may reduce tool temperatures, the heat pipe will likely increase heat partitioning into the tool at the rake face, and complicate the temperature reduction effectiveness. A combined experimental, analytical, and numerical approach was used to investigate the heat-pipe effects on cutting tool temperatures. A machining experiment was conducted and the heat-source characteristics were analyzed using cutting mechanics. With the heat sources as input, cutting tool temperatures in machining, without or with a heat pipe, were analyzed using finite element simulations. The simulations encompass a 3-D model of a cutting tool system and a 2-D chip model. The heat flux over the rake-face contact area was used in both models with an unknown heat partition coefficient, determined by matching the average temperature at the tool-chip contact from the two models. Cutting tool temperatures were also measured in machining using thermocouples. The simulation results agree reasonably with the experiment. The model was used to evaluate how the heat pipe modifies the heat transport in a cutting tool system. Applying heat-pipe cooling inevitably increases the heat flux into the tool because of the enhanced heat dissipation. However, the heat pipe is still able to reduce the tool-chip contact temperatures, though not dramatically at current settings. The parametric study using the finite element analysis (FEA) models shows that the cooling efficiency decreases as the cutting speed and feed increase, because of the increased heat flux and heat-source area. In addition, increasing the heat-pipe volume and decreasing the heat-pipe distance to the heat source enhances the heat-pipe cooling effectiveness.

scholarly journals The effect of operating parameters on the heat transfer in the heat pipe

2021 ◽  
Vol 2119 (1) ◽  
pp. 012088
Author(s):  
A. A. Litvintceva ◽  
N. I. Volkov ◽  
N. I. Vorogushina ◽  
V. A. Moskovskikh ◽  
V. V. Cheverda
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Temperature Difference ◽  
Heat Pipes ◽  
Working Fluid ◽  
Operating Parameters ◽  
Temperature Stabilization ◽  
Ir Camera ◽  
Fluid Properties

Abstract Heat pipes are a good solution for temperature stabilization, for example, of microelectronics, because these kinds of systems are without any moving parts. Experimental research of the effect of operating parameters on the heat transfer in a cylindrical heat pipe has been conducted. The effect of the working fluid properties and the porous layer thickness on the heat flux and temperature difference in the heat pipe has been investigated. The temperature field of the heat pipe has been investigated using the IR-camera and K-type thermocouples. The data obtained by IR-camera and K-type thermocouples have been compared. It is demonstrated the power transferred from the evaporator to the condenser is a linear function of the temperature difference between them.

Effect of Fluid Loading on the Performance of Wicked Heat Pipes

Volume 3 ◽  
2004 ◽  
Author(s):  
R. Kempers ◽  
A. Robinson ◽  
C. Ching ◽  
D. Ewing
Keyword(s):  
Heat Flux ◽  
Heat Pipe ◽  
Heat Transport ◽  
Heat Pipes ◽  
Working Fluid ◽  
Fluid Loading ◽  
Maximum Heat ◽  
Horizontal Orientation ◽  
Maximum Heat Flux ◽  
Dry Out

A study was performed to experimentally characterize the effect of fluid loading on the heat transport performance of wicked heat pipes. In particular, experiments were performed to characterize the performance of heat pipes with insufficient fluid to saturate the wick and excess fluid for a variety of orientations. It was found that excess working fluid in the heat pipe increased the thermal resistance of the heat pipe, but increased maximum heat flux through the pipe in a horizontal orientation. The thermal performance of the heat pipe was reduced when the amount of working fluid was less than required to saturate the wick, but the maximum heat flux through the heat pipe was significantly reduced at all orientations. It was also found in this case the performance of this heat pipe deteriorated once dry-out occurred.

scholarly journals Transport in Flat Heat Pipes at High Heat Fluxes From Multiple Discrete Sources

2004 ◽  
Vol 126 (3) ◽  
pp. 347-354 ◽  
Author(s):  
Unnikrishnan Vadakkan ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Fluid Flow ◽  
Heat Pipe ◽  
Three Dimensional ◽  
Heat Pipes ◽  
Density Change ◽  
Heat Sources ◽  
Discrete Heat Sources ◽  
Energy Equations

A three-dimensional model has been developed to analyze the transient and steady-state performance of flat heat pipes subjected to heating with multiple discrete heat sources. Three-dimensional flow and energy equations are solved in the vapor and liquid regions, along with conduction in the wall. Saturated flow models are used for heat transfer and fluid flow through the wick. In the wick region, the analysis uses an equilibrium model for heat transfer and a Brinkman-Forchheimer extended Darcy model for fluid flow. Averaged properties weighted with the porosity are used for the wick analysis. The state equation is used in the vapor core to relate density change to the operating pressure. The density change due to pressurization of the vapor core is accounted for in the continuity equation. Vapor flow, temperature and hydrodynamic pressure fields are computed at each time step from coupled continuity/momentum and energy equations in the wick and vapor regions. The mass flow rate at the interface is obtained from the application of kinetic theory. Predictions are made for the magnitude of heat flux at which dryout would occur in a flat heat pipe. The input heat flux and the spacing between the discrete heat sources are studied as parameters. The location in the heat pipe at which dryout is initiated is found to be different from that of the maximum temperature. The location where the maximum capillary pressure head is realized also changes during the transient. Axial conduction through the wall and wick are seen to play a significant role in determining the axial temperature variation.

scholarly journals Fluid flow and heat transfer in a dual-wet micro heat pipe

2007 ◽  
Vol 589 ◽  
pp. 1-31 ◽  
Author(s):  
JIN ZHANG ◽  
STEPHEN J. WATSON ◽  
HARRIS WONG
Keyword(s):  
Heat Transfer ◽  
Boundary Layer ◽  
Heat Flux ◽  
Fluid Flow ◽  
Temperature Distribution ◽  
Heat Pipe ◽  
Contact Line ◽  
Heat Pipes ◽  
Dimensionless Parameters ◽  
Micro Heat Pipes

Micro heat pipes have been used to cool micro electronic devices, but their heat transfer coefficients are low compared with those of conventional heat pipes. In this work, a dual-wet pipe is proposed as a model to study heat transfer in micro heat pipes. The dual-wet pipe has a long and narrow cavity of rectangular cross-section. The bottom-half of the horizontal pipe is made of a wetting material, and the top-half of a non-wetting material. A wetting liquid fills the bottom half of the cavity, while its vapour fills the rest. This configuration ensures that the liquid–vapour interface is pinned at the contact line. As one end of the pipe is heated, the liquid evaporates and increases the vapour pressure. The higher pressure drives the vapour to the cold end where the vapour condenses and releases the latent heat. The condensate moves along the bottom half of the pipe back to the hot end to complete the cycle. We solve the steady-flow problem assuming a small imposed temperature difference between the two ends of the pipe. This leads to skew-symmetric fluid flow and temperature distribution along the pipe so that we only need to focus on the evaporative half of the pipe. Since the pipe is slender, the axial flow gradients are much smaller than the cross-stream gradients. Thus, we can treat the evaporative flow in a cross-sectional plane as two-dimensional. This evaporative motion is governed by two dimensionless parameters: an evaporation number E defined as the ratio of the evaporative heat flux at the interface to the conductive heat flux in the liquid, and a Marangoni number M. The motion is solved in the limit E→∞ and M→∞. It is found that evaporation occurs mainly near the contact line in a small region of size E−1W, where W is the half-width of the pipe. The non-dimensional evaporation rate Q* ~ E−1 ln E as determined by matched asymptotic expansions. We use this result to derive analytical solutions for the temperature distribution Tp and vapour and liquid flows along the pipe. The solutions depend on three dimensionless parameters: the heat-pipe number H, which is the ratio of heat transfer by vapour flow to that by conduction in the pipe wall and liquid, the ratio R of viscous resistance of vapour flow to interfacial evaporation resistance, and the aspect ratio S. If HR≫1, a thermal boundary layer appears near the pipe end, the width of which scales as (HR)−1/2L, where L is the half-length of the pipe. A similar boundary layer exists at the cold end. Outside the boundary layers, Tp varies linearly with a gradual slope. Thus, these regions correspond to the evaporative, adiabatic and condensing regions commonly observed in conventional heat pipes. This is the first time that the distinct regions have been captured by a single solution, without prior assumptions of their existence. If HR ~ 1 or less, then Tp is linear almost everywhere. This is the case found in most micro-heat-pipe experiments. Our analysis of the dual-wet pipe provides an explanation for the comparatively low effective thermal conductivity in micro heat pipes, and points to ways of improving their heat transfer capabilities.

scholarly journals Experimental Set up of Two Closed Loop Pulsating Heat Pipe (CLPHP) with Water base Fluids

2019 ◽  
Vol 8 (12S) ◽  
pp. 715-719
Keyword(s):  
Thermal Resistance ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Heat Pipes ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Water Mixture ◽  
Working Fluids ◽  
Pure Fluids ◽  
Acetone Water

Heat pipes are deliberated to be effective heat dissipation devices compared to other types of heat sinks due to their high effective thermal conductivity. Because of the flexibility in the design and layout of heat pipe turns along the heat source, pulsating heat pipes have gained popularity. One of the parameters that have the mainimpact on the presentation of CLPHP is the thermo physical properties of the working fluid. The properties of the working fluid affect the temperature difference between the evaporator and the condenser which in turn affect the thermal resistance of the CLPHP. In this connection, the influence of different working fluids is experimentally investigated on a two loop CLPHP, varying the evaporator heat flux. Pure fluids, viz., water, acetone, benzene and binary mixture, viz., Acetone-water and Benzene-water are utilized on working fluids. The heat input considered at the evaporator is 32W, 48W and 60W. The filling ratio is kept as 50 %. The results show that among the working fluids considered for the study, acetone exhibits least thermal resistance among the pure fluids at all heat fluxes considered in the analysis, while Acetone-water mixture has exhibited least thermal resistance among the water based mixtures.

A Mathematical Modeling Method for Capillary Limit of Micro Heat Pipe with Sintered Wick

2011 ◽  
Vol 175 ◽  
pp. 335-341
Author(s):  
Xi Bing Li ◽  
Chang Long Yang ◽  
Gong Di Xu ◽  
Wen Yuan ◽  
Shi Gang Wang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
High Heat ◽  
Experimental Investigations ◽  
High Heat Flux ◽  
Micro Heat Pipe ◽  
Copper Powders ◽  
Capillary Limit

With heat flux increasing and cooling space decreasing in microelectronic and chemical products, micro heat pipe has become an ideal heat dissipation device in high heat-flux products. Through the analysis of its working principle, the factors that affect its heat transfer limits and the patterns in which copper powders are arrayed in circular cavity, this paper first established a mathematical model for the crucial factors in affecting heat transfer limits in a circular micro heat pipe with a sintered wick, i.e. a theoretical model for capillary limit, and then verified its validity through experimental investigations. The study lays a powerful theoretical foundation for designing and manufacturing circular micro heat pipes with sintered wicks.

Towards a Durable Polymeric Internal Coating for Diabatic Sections in Wickless Heat Pipes

2019 ◽  
Vol 141 (9) ◽  
Author(s):  
Fabio Villa ◽  
Marco Marengo ◽  
Joël De Coninck
Keyword(s):  
Heat Flux ◽  
Heat Pipe ◽  
Surface Properties ◽  
Critical Heat Flux ◽  
Thermal Performance ◽  
Heat Pipes ◽  
Surface Wettability ◽  
Polymeric Coating ◽  
Stainless Steel Surface ◽  
Power Load

Heat pipe characteristics are linked to the surface properties of the diabatic surfaces, and, in the evaporator, surface properties influence both the onset boiling temperature (TONB) and the critical heat flux (CHF). In this work, the effect of surface wettability in pool boiling heat transfer is studied in order to understand if there could be a path to increment heat pipe thermal performance. This work analyzes the effects of surface wettability on boiling (tested fluid is pure water) and proposes a new super-hydrophobic polymeric coating (De Coninck et al., 2017, “Omniphobic Surface Coatings,” Patent No. WO/2017/220591), which can have a very important effect in improving the heat pipe start-up power load and increasing the thermal performance of heat pipes when the flux is lower than the critical heat flux. The polymeric coating is able to reduce the TONB (−11% from 117 °C to about 104 °C) compared with the uncoated surfaces, as it inhibits the formation of a vapor film on the solid–liquid interface, avoiding CHF conditions up to maximum wall temperature (125 °C). This is realized by the creation of a heterogeneous surface with superhydrophobic surface (SHS) zones dispersed on top of a hydrophilic surface (stainless steel surface). The proposed coating has an outstanding thermal resistance: No degradation of SH properties of the coating has been observed after more than 500 thermal cycles.

scholarly journals Heat partition effect on cutting tool morphology in orthogonal metal cutting using finite element method

Mechanika ◽  
2019 ◽  
Vol 25 (4) ◽  
pp. 326-334
Author(s):  
Kamuran Kamil YEŞİLKAYA ◽  
Kemal YAMAN
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Temperature Distribution ◽  
Metal Cutting ◽  
Cutting Tool ◽  
Thermal Analyses ◽  
Cutting Process ◽  
Heat Partition ◽  
Coated Tools ◽  
Element Method

It is widely accepted that heat partition and temperature distribution for metal cutting process have a significant effect on the morphological features of the cutting tool. Tool life and cutting accuracy are considerably affected by temperature distribution and heat transfer mechanisms on the tool. When a finite elements model is accurately generated, an understanding of heat partition into the cutting tool without performing experiments can be gained. This study has been completed with the use of uncoated and coated tools in order to predetermine heat partition value entering the cutting tool. In terms of coated tools, tool coating was investigated to assess its effects on heat partition. Finite Element Method was mainly used in combination with the previously generated experimental data in literature. Three-dimensional uncoated and coated models were created and made compatible with finite element modeling software to be able to perform thermal analyses of the cutting process. Finite element transient and steady-state temperature values were calculated and hence the heat intensity value for the cutting tool was determined.

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