A System Level Thermal Analysis of Large Telecommunication Racks

2003 ◽  
Author(s):  
L. T. Yeh
Keyword(s):  
Thermal Analysis ◽  
Flow Rate ◽  
Printed Circuit Boards ◽  
System Level ◽  
Circuit Boards ◽  
Air Flow Rate ◽  
Printed Circuit ◽  
Computational Fluid Dynamics Cfd ◽  
Cfd Method ◽  
Level Analysis

A system level thermal analysis is performed by employing the computational fluid dynamics (CFD) method on a large telecommunication rack. Each rack consists of two identical shelves located on the top-to-bottom orientation. Each shelf includes one fan tray with 6 fans, 3 card cages with a total of 50 printed circuit boards (PCBs). Air enters from the front of the shelf, and then makes a 90-degree turn upwards through PCBs, and finally turns another 90-degree to exit the system from the back of the shelf. The system level analysis is performed independently on each shelf. The main purpose of the analysis is to determine the air flow rate to individual printed circuit boards as well as the air temperature distribution in the system. The computed flow rate for individual PCBs is then used for a detailed board analysis to predict the component temperatures of individual boards.

Successful Practices for the Modeling of Printed Circuit Boards and Substrates Using Electromagnetic Field Solvers

2010 ◽  
Vol 2010 (1) ◽  
pp. 000413-000421 ◽  
Author(s):  
Steven G. Pytel ◽  
Scott C. McMorrow ◽  
Tom Dagostino ◽  
Sergey Polstyanko ◽  
Werner Thiel ◽  
...  
Keyword(s):  
Electromagnetic Field ◽  
High Speed ◽  
Printed Circuit Boards ◽  
Boundary Element Methods ◽  
System Level ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Circuit Simulator ◽  
Reference Design ◽  
Electromagnetic Field Solvers

The aim of this work is to provide strategies for creating highly accurate models of printed circuit boards (PCBs) and substrates using electromagnetic field solvers. It will examine how to choose the correct field solver for a particular application from among full-wave, modal decomposition, finite element and boundary element methods. Tradeoffs between time and accuracy of the different solvers will be discussed. The focus is on model creation for use in time domain circuit simulators, but analysis of the frequency domain data will be used to correlate measurement to simulation. The problem of correlating simulation results with measurements is also discussed. A physical layer reference design (PLRD) board has been constructed, measured and simulated with the various field solvers. The results are analyzed to understand why differences occur between simulation and measured data. The impacts of these differences on system-level simulations of high-speed serial links are studied using a circuit simulator.

A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

1993 ◽  
Vol 115 (3) ◽  
pp. 339-342
Author(s):  
A. Hadim
Keyword(s):  
Thermal Analysis ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Simplex Algorithm ◽  
Circuit Board ◽  
Circuit Boards ◽  
Analysis And Design ◽  
Printed Circuit ◽  
Squared Error ◽  
Downhill Simplex

A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental technique. In order to demonstrate its capabilities, this methodology is implemented to correlate natural convection on a printed circuit board oriented horizontally inside an enclosure. The empirical constants used in the correlation were determined through a numerical algorithm in which the sum of the squared error between calculated temperatures and experimental measurements is minimized using the downhill simplex algorithm.

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