Evaluating the Assembly of Mirrored Large High-Density BGA Packages

The continued emphasis on higher-density (smaller) and better-performance (faster) on electronics system design makes the board (PCB layout) design become more complex and usually will challenge the DFM guidelines currently applied by the industry. For example, the design of mirrored BGAs on double-sided board, which is not recommended by current industry DFM guidelines, due to the real estate constraint. In fact, there are several successful design applying low pin count mirrored or staggered BGAs or CSPs for certain applications, such as memory modules.