A Novel Embedded Root Method to Construct Thick Metal Microstructures Using SU-8 in UV-LIGA Process

2002 ◽  
Author(s):  
Chien-Hung Ho ◽  
Kan-Ping Chin
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrostatic Force ◽  
Low Cost ◽  
Three Dimensional ◽  
Mechanical Systems ◽  
Improved Method ◽  
Micro Electro Mechanical Systems ◽  
Novel Technique

To upgrade the electrostatic force, movable devices in micro-electro-mechanical systems may require three-dimensional microstructures with large capacitive areas and vertical sidewalls with several hundred micrometers in height. The photoresist, NANO™ XP SU–8, can be implemented in the fabrication of high-aspect-ratio microstructures in low-cost MEMS production. In this study, using SU-8 as an electroplating mold, an improved method for consolidating the adhesion of the plated microstructures to the substrate is utilized. By constructing an embedded root as the substructure, this novel technique can greatly increase the thickness of the metal components, and simultaneously, the hard-to-strip crosslinked SU-8 may be removed completely. The fabrication of stators and bearing post for an electrostatic micro motor is used here to demonstrate the effectiveness of the proposed method, where the structural height and the minimum gap of the stators are 300 μm and 50 μm, respectively. For comparison, some fabricated results of typical approaches by a heated remover to strip the cured SU-8 mold are also shown in this paper.

Laminated Photoresist Sacrificial Layer Process for 3-D Movable Suspension Microstructures in LIGA-Based Surface Micromachining

2010 ◽  
Vol 97-101 ◽  
pp. 2538-2541 ◽  
Author(s):  
Yi Bo Wu ◽  
Gui Fu Ding ◽  
Cong Chun Zhang ◽  
Hong Wang
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Sacrificial Layer ◽  
Low Cost ◽  
Three Dimensional ◽  
Mems Devices ◽  
Metal Structures ◽  
Positive Photoresist ◽  
Out Of Plane ◽  
Freely Moving

The fabrication process of three-dimensional (3D) high-aspect-ratio MEMS devices entirely made of electroplated metals with suspending multilayered microstructures is reported. The technology used is a LIGA-liked micromachining process, called the laminated positive photoresist sacrificial layer process (LPSLP). The LPSLP allows in UV-lithography not only for thick resist mould for electroplating of cascaded metal structures but also for the sacrificial layer for supporting mechanically the suspensions. So far the LPSLP procedure has incorporated with more than five sacrificial layers, which allows for the creation of overhanging structures and freely moving parts like out-of-plane cantilever stacks. A description of the underlying fabrication principle and processing details is discussed in this paper. Thus the proposed procedures open a low-cost route for fabricating micro-components such as cantilevers, bridges, movable electrodes, and freestanding parts.

Accelerating ion diffusion with unique three-dimensionally interconnected nanopores for self-membrane high-performance pseudocapacitors

Nanoscale ◽  
2017 ◽  
Vol 9 (46) ◽  
pp. 18311-18317 ◽  
Author(s):  
Yuan Gao ◽  
Yuanjing Lin ◽  
Zehua Peng ◽  
Qingfeng Zhou ◽  
Zhiyong Fan
Keyword(s):  
Aspect Ratio ◽  
Surface Area ◽  
Structural Stability ◽  
High Aspect Ratio ◽  
High Performance ◽  
Three Dimensional ◽  
Rate Capability ◽  
Large Surface Area ◽  
Nanoporous Structure ◽  
Ion Diffusion

Three-dimensional interconnected nanoporous structure (3-D INPOS) possesses high aspect ratio, large surface area, as well as good structural stability. Profiting from its unique interconnected architecture, the 3-D INPOS pseudocapacitor achieves a largely enhanced capacitance and rate capability.

scholarly journals Self-ordered nanospike porous alumina fabricated under a new regime by an anodizing process in alkaline media

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Mana Iwai ◽  
Tatsuya Kikuchi ◽  
Ryosuke O. Suzuki
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Porous Alumina ◽  
Three Dimensional ◽  
Alkaline Media ◽  
Alkaline Electrolyte ◽  
Subsequent Formation ◽  
Interpore Distance ◽  
Wide Range ◽  
Ordered Porous

AbstractHigh-aspect ratio ordered nanomaterial arrays exhibit several unique physicochemical and optical properties. Porous anodic aluminum oxide (AAO) is one of the most typical ordered porous structures and can be easily fabricated by applying an electrochemical anodizing process to Al. However, the dimensional and structural controllability of conventional porous AAOs is limited to a narrow range because there are only a few electrolytes that work in this process. Here, we provide a novel anodizing method using an alkaline electrolyte, sodium tetraborate (Na2B4O7), for the fabrication of a high-aspect ratio, self-ordered nanospike porous AAO structure. This self-ordered porous AAO structure possesses a wide range of the interpore distance under a new anodizing regime, and highly ordered porous AAO structures can be fabricated using pre-nanotexturing of Al. The vertical pore walls of porous AAOs have unique nanospikes measuring several tens of nanometers in periodicity, and we demonstrate that AAO can be used as a template for the fabrication of nanomaterials with a large surface area. We also reveal that stable anodizing without the occurrence of oxide burning and the subsequent formation of uniform self-ordered AAO structures can be achieved on complicated three-dimensional substrates.

scholarly journals A novel fabrication technique for high-aspect-ratio nanopillar arrays for SERS application

RSC Advances ◽  
2020 ◽  
Vol 10 (73) ◽  
pp. 45037-45041
Author(s):  
Tianli Duan ◽  
Chenjie Gu ◽  
Diing Shenp Ang ◽  
Kang Xu ◽  
Zhihong Liu
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Fabrication Technique ◽  
Novel Technique ◽  
Aspect Ratios ◽  
Nanopillar Arrays

A novel technique is demonstrated for the fabrication of silicon nanopillar arrays with high aspect ratios.

A self-developed indoor three-dimensional pedestrian localization platform based on MEMS sensors

Sensor Review ◽  
2015 ◽  
Vol 35 (2) ◽  
pp. 157-167 ◽  
Author(s):  
Shengbo Sang ◽  
Ruiyong Zhai ◽  
Wendong Zhang ◽  
Qirui Sun ◽  
Zhaoying Zhou
Keyword(s):  
Low Cost ◽  
Angular Rate ◽  
Three Dimensional ◽  
Dead Reckoning ◽  
Rate Data ◽  
Mems Sensors ◽  
Micro Electro Mechanical Systems ◽  
Content Type ◽  
Position Errors ◽  
Low Performance

Purpose – This study aims to design a new low-cost localization platform for estimating the location and orientation of a pedestrian in a building. The micro-electro-mechanical systems (MEMS) sensor error compensation and the algorithm were improved to realize the localization and altitude accuracy. Design/methodology/approach – The platform hardware was designed with common low-performance and inexpensive MEMS sensors, and with a barometric altimeter employed to augment altitude measurement. The inertial navigation system (INS) – extended Kalman filter (EKF) – zero-velocity updating (ZUPT) (INS-EKF-ZUPT [IEZ])-extended methods and pedestrian dead reckoning (PDR) (IEZ + PDR) algorithm were modified and improved with altitude determined by acceleration integration height and pressure altitude. The “AND” logic with acceleration and angular rate data were presented to update the stance phases. Findings – The new platform was tested in real three-dimensional (3D) in-building scenarios, achieved with position errors below 0.5 m for 50-m-long route in corridor and below 0.1 m on stairs. The algorithm is robust enough for both the walking motion and the fast dynamic motion. Originality/value – The paper presents a new self-developed, integrated platform. The IEZ-extended methods, the modified PDR (IEZ + PDR) algorithm and “AND” logic with acceleration and angular rate data can improve the high localization and altitude accuracy. It is a great support for the increasing 3D location demand in indoor cases for universal application with ordinary sensors.

scholarly journals Micro-electro-mechanical systems (MEMS): Technology for the 21st century

2014 ◽  
Vol 68 (5) ◽  
pp. 629-641 ◽  
Author(s):  
Tatjana Djakov ◽  
Ivanka Popovic ◽  
Ljubinka Rajakovic
Keyword(s):  
21St Century ◽  
Low Cost ◽  
Mechanical Systems ◽  
Modern Society ◽  
Global Scale ◽  
Thermal Constant ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Industrial Sectors ◽  
Mems Technology

Micro-electro-mechanical systems (MEMS) are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process

1999 ◽  
Author(s):  
Fan-Gang Tseng ◽  
Gang Zhang ◽  
Uri Frodis ◽  
Adam Cohen ◽  
Florian Mansfeld ◽  
...  
Keyword(s):  
Low Temperature ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Low Cost ◽  
Batch Process ◽  
Unlimited Number ◽  
Metal Layers ◽  
Electrochemical Fabrication ◽  
Low Temperature Process

Abstract EFAB (“Electrochemical FABrication”) is a new micromachining process utilizing an innovative “Instant Masking” (IM) technique to electrochemically deposit an unlimited number of metal layers for microfabrication. Through this approach, high-aspect-ratio microstructures with arbitrary 3-D geometry can be rapidly and automatically batch-fabricated at low temperature (< 60 °C) using an inexpensive desktop machine. IC-MEMS integration can also be carried out by this low temperature process.

Technology chain for production of low-cost high aspect ratio optical structures

2007 ◽  
pp. 658-662
Author(s):  
R. Krajewski ◽  
J. Krezel ◽  
M. Kujawinska ◽  
O. Parriaux ◽  
S. Tonchev ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Low Cost
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