Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

2000 ◽  
Author(s):  
Timothy P. Ferguson ◽  
Jianmin Qu
Keyword(s):  
Interfacial Adhesion ◽  
Bending Test ◽  
Primary Concern ◽  
Polymer Interfaces ◽  
Interfacial Toughness ◽  
Four Point Bending ◽  
Four Point Bending Test ◽  
Effect Of Moisture ◽  
Package Reliability

Abstract A primary concern in microelectronic packaging is the role of moisture induced failure mechanisms. Moisture is a multidimensional concern in packaging, having an adverse effect on package reliability by introducing corrosion, development of hygro-stresses, and deterioration of polymer interfaces within the package. In this paper the effect of moisture on the interfacial adhesion of two no flow underfill materials with a commercially available soldermask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four point bending test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85°C/85%RH for 725 hours. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture.

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

2002 ◽  
Vol 124 (2) ◽  
pp. 106-110 ◽  
Author(s):  
Timothy Ferguson ◽  
Jianmin Qu
Keyword(s):  
Fracture Toughness ◽  
Interfacial Adhesion ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Interfacial Toughness ◽  
Solder Mask ◽  
Effect Of Moisture ◽  
Point Bend ◽  
Four Point Bend Test

Moisture poses a significant threat to the reliability of microelectronic assemblies and can be attributed as being the principal cause of many premature package failures. Of particular concern is characterizing the role of moisture with respect to the acceleration of the onset of package delamination. In this paper the effect of moisture on the interfacial fracture toughness of two no-flow underfill materials with a commercially available solder mask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four-point bend test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85°C/85%RH for 725 hours. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture.

Aluminum Thermo Compression Bonding Characterization

2009 ◽  
Vol 1222 ◽  
Author(s):  
Erkan Cakmak ◽  
Viorel Dragoi ◽  
Eric Pabo ◽  
Thorsten Matthias ◽  
T. L. Alford
Keyword(s):  
Interfacial Adhesion ◽  
Microelectromechanical Systems ◽  
Bonding Temperature ◽  
Acoustic Microscopy ◽  
Bending Test ◽  
Wafer Level ◽  
Bond Quality ◽  
Four Point Bending ◽  
Bond Strengths ◽  
Four Point Bending Test

AbstractWafer level bonding is an important technology for the manufacturing of numerous Microelectromechanical Systems. In this work the aluminum thermo-compression wafer bonding is characterized. The effects and significance of various bond process parameters and surface treatment methods are reported on the final bond interfaces integrity and strength. Experimental variables include the bonding temperature, bonding time, and bonding atmosphere (forming gas and inert gas). Bonded wafer samples were investigated with scanning acoustic microscopy, scanning electron microscopy, and four point bending test. Interfacial adhesion energy and bond quality were found to be positively correlated with bonding temperature. A bonding temperature of 500 °C or greater is necessary to obtain bond strengths of 8-10 J/m2.

scholarly journals Structural behaviour of PSCC slab panel under four-point bending test

2021 ◽  
Vol 1144 (1) ◽  
pp. 012039
Author(s):  
M A Iman ◽  
N Mohamad ◽  
A A A Samad ◽  
Steafenie George ◽  
M A Tambichik ◽  
...  
Keyword(s):  
Bending Test ◽  
Structural Behaviour ◽  
Four Point Bending ◽  
Four Point Bending Test

Manufacturing a carbon/epoxy NACA 23018 airfoil skin using a circular braiding machine: experimental and numerical study

2021 ◽  
pp. 152808372199377
Author(s):  
Jalil Hajrasouliha ◽  
Mohammad Sheikhzadeh
Keyword(s):  
Numerical Study ◽  
Filament Winding ◽  
Bending Test ◽  
Elastic Response ◽  
Manufacturing Processes ◽  
Fiber Reinforced Composite ◽  
Four Point Bending ◽  
Reinforced Composite ◽  
Four Point Bending Test ◽  
Meso Scale

In the interest of reducing the weight and also cost of blade skins, various automatic preform manufacturing processes were developed including tape laying, filament winding and braiding. Among them, the circular braiding process was found to be an efficient method in producing seamless preforms on mandrels with various geometries. In this regard, an attempt was made to produce a carbon fiber reinforced composite with the shape of NACA 23018 airfoil using a circular braiding machine. Thus, suitable wooden mandrels were manufactured using NACA 23018 airfoil coordinates, which were obtained by assuming the perimeter of 20 cm. Furthermore, both biaxially and triaxially braided preforms were produced and subsequently impregnated with epoxy resin through an appropriate fabrication method. To assess their performance, four-point bending test was carried out on samples. Ultimately, the elastic response of braided composite airfoils was predicted using a meso-scale finite element modeling and was validated with experimental results.

Sign in / Sign up

Export Citation Format

Share Document