Modeling of Disc Shaped FGM Piezoelectric Actuator

2000 ◽  
Author(s):  
Abdulhakim Almajid ◽  
Minoru Taya
Keyword(s):  
Stress Field ◽  
Piezoelectric Actuator ◽  
Piezoelectric Actuators ◽  
Piezoelectric Layers ◽  
Different Types ◽  
Out Of Plane ◽  
Piezoelectric Coupling ◽  
Lamination Theory ◽  
Coupling Terms ◽  
Plane Displacement

Abstract The mechanical behavior of a disk shaped piezoelectric actuator was studied using modified classical lamination theory (CLT) for circular plate. The modified CLT accounts for piezoelectric coupling terms. CLT is capable of predicting the stress field and out of plane displacement of disk shaped laminated piezoelectric layers under applied electric field. The analysis was applied to different types of piezoelectric actuators.

Preparation of Lead-Free Multi-Layered Piezoelectric Actuator

2006 ◽  
Vol 320 ◽  
pp. 11-14 ◽  
Author(s):  
Tomoaki Futakuchi ◽  
Tatsunori Kakuda ◽  
Yuichi Sakai ◽  
Masatoshi Adachi
Keyword(s):  
Piezoelectric Actuator ◽  
Screen Printing ◽  
Remanent Polarization ◽  
Piezoelectric Properties ◽  
Tape Casting ◽  
Piezoelectric Actuators ◽  
Lead Free ◽  
N2 Atmosphere ◽  
Piezoelectric Layers ◽  
Ferroelectric And Piezoelectric Properties

[BaO]m(Ti0.975Zr0.025)O2 ceramics with Ni electrodes were prepared by a firing in N2 atmosphere. The dielectric, ferroelectric and piezoelectric properties were examined in terms of the composition. The remanent polarization of 9.5μC/cm2 was obtained for m=1.01 by the addition of 0.5wt% SiO2. The longitudinal piezoelectric constant d33 calculated from a unipolar signal (8kV/cm,10Hz) was 430pC/N. Lead-free multi-layered piezoelectric actuators were fabricated using this material by the tape casting, screen-printing of Ni electrodes, laminating under heat and pressure, and firing in N2 atmosphere. The displacement of the actuator with 75μm x 9 active piezoelectric layers was 0.17μm at an applied voltage of 75V and a frequency of 10Hz.

scholarly journals Sensor Integrated Load-Bearing Structures: Measuring Axis Extension with DIC-Based Transducers

Sensors ◽  
2021 ◽  
Vol 21 (12) ◽  
pp. 4104
Author(s):  
Nassr Al-Baradoni ◽  
Peter Groche
Keyword(s):  
Cost Effective ◽  
Image Correlation ◽  
Maximum Deviation ◽  
Single Image ◽  
Eccentric Load ◽  
Load Bearing ◽  
Out Of Plane ◽  
Axis Extension ◽  
Plane Displacement ◽  
Imaging Sensor

In this paper we present a novel, cost-effective camera-based multi-axis force/torque sensor concept for integration into metallic load-bearing structures. A two-part pattern consisting of a directly incident and mirrored light beam is projected onto the imaging sensor surface. This allows the capturing of 3D displacements, occurring due to structure deformation under load in a single image. The displacement of defined features in size and position can be accurately analyzed and determined through digital image correlation (DIC). Validation on a prototype shows good accuracy of the measurement and a unique identification of all in- and out-of-plane displacement components under multiaxial load. Measurements show a maximum deviation related to the maximum measured values between 2.5% and 4.8% for uniaxial loads ( and between 2.5% and 10.43% for combined bending, torsion and axial load. In the course of the investigations, the measurement inaccuracy was partly attributed to the joint used between the sensor parts and the structure as well as to eccentric load.

scholarly journals Locally Corroded Stiffener Effect on Shear Buckling Behaviors of Web Panel in the Plate Girder

2015 ◽  
Vol 2015 ◽  
pp. 1-19 ◽  
Author(s):  
Jungwon Huh ◽  
In-Tae Kim ◽  
Jin-Hee Ahn
Keyword(s):  
Corrosion Damage ◽  
Element Analysis ◽  
Buckling Strength ◽  
Lower Shear ◽  
Out Of Plane ◽  
Shear Buckling ◽  
Buckling Failure ◽  
Plane Displacement ◽  
The Web ◽  
Plate Girder

The shear buckling failure and strength of a web panel stiffened by stiffeners with corrosion damage were examined according to the degree of corrosion of the stiffeners, using the finite element analysis method. For this purpose, a plate girder with a four-panel web girder stiffened by vertical and longitudinal stiffeners was selected, and its deformable behaviors and the principal stress distribution of the web panel at the shear buckling strength of the web were compared after their post-shear buckling behaviors, as well as their out-of-plane displacement, to evaluate the effect of the stiffener in the web panel on the shear buckling failure. Their critical shear buckling load and shear buckling strength were also examined. The FE analyses showed that their typical shear buckling failures were affected by the structural relationship between the web panel and each stiffener in the plate girder, to resist shear buckling of the web panel. Their critical shear buckling loads decreased from 82% to 59%, and their shear buckling strength decreased from 88% to 76%, due to the effect of corrosion of the stiffeners on their shear buckling behavior. Thus, especially in cases with over 40% corrosion damage of the vertical stiffener, they can have lower shear buckling strength than their design level.

Mechanism of the Transition From In-Plane Buckling to Helical Buckling for a Stiff Nanowire on an Elastomeric Substrate

2016 ◽  
Vol 83 (4) ◽  
Author(s):  
Youlong Chen ◽  
Yong Zhu ◽  
Xi Chen ◽  
Yilun Liu
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Stretchable Electronics ◽  
Buckling Mode ◽  
Design And Optimization ◽  
Out Of Plane ◽  
Plane Direction ◽  
Plane Displacement ◽  
Helical Buckling ◽  
Selection Of

In this work, the compressive buckling of a nanowire partially bonded to an elastomeric substrate is studied via finite-element method (FEM) simulations and experiments. The buckling profile of the nanowire can be divided into three regimes, i.e., the in-plane buckling, the disordered buckling in the out-of-plane direction, and the helical buckling, depending on the constraint density between the nanowire and the substrate. The selection of the buckling mode depends on the ratio d/h, where d is the distance between adjacent constraint points and h is the helical buckling spacing of a perfectly bonded nanowire. For d/h > 0.5, buckling is in-plane with wavelength λ = 2d. For 0.27 < d/h < 0.5, buckling is disordered with irregular out-of-plane displacement. While, for d/h < 0.27, buckling is helical and the buckling spacing gradually approaches to the theoretical value of a perfectly bonded nanowire. Generally, the in-plane buckling induces smaller strain in the nanowire, but consumes the largest space. Whereas the helical mode induces moderate strain in the nanowire, but takes the smallest space. The study may shed useful insights on the design and optimization of high-performance stretchable electronics and three-dimensional complex nanostructures.

Compact Drive Electronics for Solid-State Actuators

2000 ◽  
Author(s):  
Jeffrey S. N. Paine ◽  
David S. Bennett ◽  
Carlos E. Cuadros
Keyword(s):  
Solid State ◽  
Power Electronics ◽  
Piezoelectric Material ◽  
Piezoelectric Actuator ◽  
Power Dissipation ◽  
Piezoelectric Materials ◽  
Piezoelectric Actuators ◽  
Linear Amplifier ◽  
Overall Efficiency ◽  
Electronics Packages

Abstract As piezoelectric actuators are developed for high strokes and/or high force applications, the amount of piezoelectric material used in the actuator must also increase. Reducing the size of drive electronics becomes difficult using traditional linear power electronics packages when applications require as much as 40 μF of piezoelectric load. In order to efficiently drive piezoelectric actuator systems, bi-directional systems (drivers that recover the energy put into the piezoelectric capacitor) must be used. Since less than 10% of the power going into the piezoelectric actuator is real versus the large reactive load used to power the piezoelectric materials, bidirectional systems have a much higher efficiency. A comparison is made between traditional linear and PWM amplifier systems and tailored piezoelectric bi-directional driver systems. Bi-directional systems have power dissipation levels up to 1/8th those of traditional linear amplifier systems. In the course of the research both linear and PWM concepts were investigated. A rationale for comparing the overall efficiency of drive electronics systems is presented. Some innovative efficient concepts for piezoelectric system drivers are presented and discussed.

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