scholarly journals Development of a Compensation Chamber for Use in a Multiple Condenser Loop Heat Pipe

2013 ◽  
Author(s):  
Nicholas A. Roche ◽  
Martin Cleary ◽  
Teresa B. Peters ◽  
Evelyn N. Wang ◽  
John G. Brisson
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Computational Simulation ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Operating Characteristics ◽  
Side Pressure ◽  
Compensation Chamber ◽  
Dry Out

We report the design and analysis of a novel compensation chamber for use in PHUMP, a multiple condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The compensation chamber is integrated into the evaporator of the device and provides a region for volumetric expansion of the working fluid over a range of operating temperatures. Additionally, the compensation chamber serves to set the liquid side pressure of the device, preventing both flooding of the condensers and dry out of the evaporator. The compensation chamber design was achieved through a combination of computational simulation using COMSOL Multiphysics and models developed based on experimental work of previous designs. The compensation chamber was fabricated as part of the evaporator using Copper and Monel sintered wicks with various particle sizes to achieve the desired operating characteristics. Currently, the compensation chamber is being incorporated into a multiple condenser LHP for a high performance air-cooled heat sink.

Experimental Investigation of Heat Transfer Performance of a Miniature Loop Heat Pipe with Flat Evaporator

2011 ◽  
Vol 71-78 ◽  
pp. 3806-3809
Author(s):  
Xian Feng Zhang ◽  
Shuang Feng Wang
Keyword(s):  
Heat Pipe ◽  
Heat Load ◽  
Temperature Oscillation ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Operating Characteristics ◽  
Maximum Heat ◽  
Power Cycle ◽  
Flat Evaporator ◽  
Compensation Chamber

The present work experimentally investigated the operating characteristics of a miniature loop heat pipe (LHP) under different power cycle. The miniature LHP with flat evaporator of 8mm thick is made of copper. The evaporator with sintered copper power wick is in series structure with compensation chamber. Water is working fluid. It is found that the LHP can start up at heat load of 15W with temperature oscillation and the maximum heat load is 160W with Rl=0.068°C/W. The LHP operates unstably under low heat load. The oscillating frequency of temperature rises with heat load increased. The operating performance of the LHP is affected by the power cycle.

scholarly journals Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink

2013 ◽  
Author(s):  
H. Arthur Kariya ◽  
Daniel F. Hanks ◽  
Wayne L. Staats ◽  
Nicholas A. Roche ◽  
Martin Cleary ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Ambient Air ◽  
Optimal Operation ◽  
Working Fluid ◽  
Air Cooling ◽  
Loop Heat Pipe ◽  
Total Thermal Resistance

We present the characterization of a compact, high performance air-cooled heat sink with an integrated loop heat pipe. In this configuration, heat enters the heat sink at the evaporator base and is transferred within the heat pipe by the latent heat of vaporization of a working fluid. From the condensers, the heat is transferred to the ambient air by an integrated fan. Multiple condensers are used to increase the surface area available for air-cooling, and to ensure the equal and optimal operation of the individual condensers, an additional wick is incorporated into the condensers. We demonstrated with this design (10.2 cm × 10.2 cm × 9 cm), a total thermal resistance of less than 0.1 °C/W while dissipating a heat load of 500 W from a source at 75 °C. Furthermore, constant thermal resistance was observed in the upright as well as sideways orientations. This prototype is a proof-of-concept demonstration of a high performance and efficient air-cooled heat sink design that can be readily integrated for various electronics packaging and data center applications.

Nucleate Boiling Inside the Evaporator of the Planar Loop Heat Pipe

2004 ◽  
Author(s):  
Junwoo Suh ◽  
Ahmed Shuja ◽  
Frank M. Gerner ◽  
H. Thurman Henderson
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Nucleate Boiling ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Input Energy ◽  
Cooling Devices ◽  
Compensation Chamber ◽  
Dry Out ◽  
Transfer Device

The Loop Heat Pipe (LHP) under development is a next generation micro heat transfer device that utilizes the latent heat of a working fluid and has excellent transfer capacity compared with that of standard metallic cooling devices. A typical LHP consists of an evaporator, a reservoir (also called the compensation chamber), vapor and liquid lines, a subcooler, and a condenser. As heat is applied to the evaporator, all of the input energy goes into the evaporation of the liquid in the pores of the primary CPS wick or leak to the bottom. The nucleate boiling, which occurs beneath the primary wick in the evaporator, is a very significant phenomena. It affects critical operating issues, such as dry out of the primary wick. Using a clear evaporator machined from Pyrex glass, the nucleation, which occurred in the evaporator, was studied. De-ionized water was utilized as the working fluid.

Investigation of Loop Heat Pipe Startup Using Liquid Core Visualization

2008 ◽  
Author(s):  
B. P. d’Entremont ◽  
J. M. Ochterbeck
Keyword(s):  
Heat Pipe ◽  
Liquid Core ◽  
High Heat ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Two Phase ◽  
Buoyancy Driven Flows ◽  
Compensation Chamber ◽  
Fill Level ◽  
Heat Loads

In this investigation, a Loop Heat Pipe (LHP) evaporator has been studied using a borescope inserted through the compensation chamber into the liquid core. This minimally intrusive technique allows liquid/vapor interactions to be observed throughout the liquid core and compensation chamber. A low conductivity ceramic was used for the wick and ammonia as the working fluid. Results indicate that buoyancy driven flows, both two-phase and single-phase, play essential roles in evacuating excess heat from the core, which explains the several differences in performance between horizontal and vertical orientations of the evaporator. This study also found no discernable effect of the pre-start fill level of the compensation chamber on thermal performance during startup at moderate and high heat loads.

Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks

2009 ◽  
Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Structural Integrity ◽  
Heat Pipes ◽  
Electronic Cooling ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Trade Offs ◽  
Pipe Heat

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.

Steady-State Operation of a Loop Heat Pipe: Network Thermofluid Model and Results

2003 ◽  
Author(s):  
Nima Atabaki ◽  
B. Rabi Baliga
Keyword(s):  
Steady State ◽  
Heat Pipe ◽  
Horizontal Tube ◽  
Operating Conditions ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Sintered Metal ◽  
Steady State Operation ◽  
Transport Line ◽  
Compensation Chamber

A network thermofluid model of a loop heat pipe (LHP) operating under steady-state conditions is presented. Attention is focused on a simple LHP, with one evaporator, a vapor transport line, a single condenser, a liquid transport line, and a compensation chamber. The evaporator is an internally grooved circular pipe, with a cylindrical wick installed on its inner surface. The wick is made of a sintered metal. The condenser is a horizontal tube covered with a high-thermal-conductivity sleeve, and the outer temperature of the sleeve is maintained at a constant sink temperature. Quasi one-dimensional mathematical models of the fluid flow and heat transfer in each of the elements of the LHP, and collectively of the entire LHP, are proposed and discussed. The working fluid considered in this work is ammonia, but the proposed model can work with any suitable fluid. Results pertaining to the LHP performance for a range of operating conditions are presented, compared (qualitatively) to corresponding results of an earlier experimental investigation in the literature, and discussed.

scholarly journals Investigation of Loop Heat Pipe Survival and Restart After Extreme Cold Environment Exposure

2009 ◽  
Author(s):  
Eric Golliher ◽  
Jentung Ku ◽  
Anthony Licari ◽  
James Sanzi
Keyword(s):  
Heat Pipe ◽  
Freezing Point ◽  
Thermal Control ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
The Moon ◽  
Novel Approach ◽  
Condenser Temperature ◽  
Extreme Cold ◽  
Compensation Chamber

NASA plans human exploration near the South Pole of the Moon, and other locations where the environment is extremely cold. This paper reports on the heat transfer performance of a loop heat pipe exposed to extreme cold under the simulated reduced gravitational environment of the Moon. A common method of spacecraft thermal control is to use a loop heat pipe with ammonia working fluid. Typically, a small amount of heat is provided either by electrical heaters or by environmental design, such that the loop heat pipe condenser temperature never drops below the freezing point of ammonia. The concern is that a liquid-filled, frozen condenser would not re-start, or that a thawing condenser would damage the tubing due to the expansion of ammonia upon thawing. This paper reports the results of an experimental investigation of a novel approach to avoid these problems. The loop heat pipe compensation chamber is conditioned such that all the ammonia liquid is removed from the condenser and the loop heat pipe is non-operating. The condenser temperature is then reduced to below that of the ammonia freezing point. The loop heat pipe is then successfully re-started.

Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design

2011 ◽  
Author(s):  
Navdeep S. Dhillon ◽  
Jim C. Cheng ◽  
Albert P. Pisano
Keyword(s):  
Heat Flow ◽  
Heat Pipe ◽  
Thermal Characteristics ◽  
Heat Pipes ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Two Phase ◽  
Loop Heat Pipes ◽  
Evaporator Section ◽  
Compensation Chamber

Theoretical and numerical thermodynamic analysis of the evaporator section of a planar microscale loop heat pipe is presented, to minimize the permissible wick thickness in such a device. In conventional cylindrical loop heat pipes, a minimum wick thickness is required in order to reduce parasitic heat flow, and prevent vapor leakage, into the compensation chamber. By taking advantage of the possibilities allowed by microfabrication techniques, a planar evaporator/compensation chamber design topology is proposed to overcome this limitation, which will enable wafer-based loop heat pipes with device thicknesses on the order of a millimeter or less. Thermodynamic principles governing two-phase flow of the working fluid in a loop heat pipe are analyzed to elucidate the fundamental requirements that would characterize the startup and steady state operation of a planar phase-change device. A three dimensional finite element thermal-fluid solver is implemented to study the thermal characteristics of the evaporator section and compensation chamber regions of a planar vertically wicking micro-columnated loop heat pipe. The use of in-plane thermal conduction barriers to reduce parasitic heat flow into the compensation chamber is demonstrated.

A Flow Visualization Study on the Temperature Oscillations Inside a Loop Heat Pipe With Flat Evaporator

2013 ◽  
Author(s):  
Dongchuan Mo ◽  
Guansheng Zou ◽  
Shushen Lu ◽  
L. Winston Zhang
Keyword(s):  
Flow Visualization ◽  
Heat Pipe ◽  
Temperature Oscillation ◽  
Heating Power ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Interface Motion ◽  
Temperature Oscillations ◽  
Flat Evaporator ◽  
Compensation Chamber

This paper presents a flow visualization study on the temperature oscillations inside a loop heat pipe in order to gain a better understanding of its heat transfer characteristics. A flat loop heat pipe (FLHP) with a flat evaporator instead of a typical cylindrical evaporator was built using copper as the shell and water as the working fluid. An experimental setup was designed by using the transparent material instead of copper in some parts of the FLHP. The experiment results showed that there were at least three different flow patterns in the vapor line as the heating power increased. The temperatures in different locations of the loop oscillated even when the heating power was kept constant. The largest amplitude of the temperature oscillation in the loop was located at the condenser outlet. It was found that the temperature oscillation at the condenser outlet could be divided into two types, one with smaller amplitudes and the other with larger amplitudes. The smaller amplitude temperature oscillations were always there when the heating power was increased step by step, while the larger amplitude temperature oscillations would disappear initially and show up later. Finally, the location of the vapor/liquid interface inside the condenser varied with the temperature oscillations, resulting in liquid/vapor interface motion in the compensation chamber.

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