Exact Solution of Two-Dimensional Hyperbolic Heat Conduction Equation With Combined Boundary Conditions and Arbitrary Initial Conditions

Author(s):  
Seyed Reza Mahmoudi ◽  
Nikola Toljic

Analytical solution of hyperbolic heat conduction equation has so far been limited only to one-dimensional frameworks. With the expanding of the application range for the fast heat sources in microelectronic industries, the two-dimensional solution of non-Fourier heat conduction becomes increasingly important. This paper presents an exact solution of hyperbolic heat conduction equation for a finite plane with sides subjected to combined boundary conditions. In the mathematical model, the heating on boundaries is treated as an apparent heat source whereas sides of the plane with the second kind boundaries are assumed to be insulated. The important characteristic of the proposed solution is its simplicity.

Author(s):  
Siddharth Saurav ◽  
Sandip Mazumder

Abstract The Fourier heat conduction and the hyperbolic heat conduction equations were solved numerically to simulate a frequency-domain thermoreflectance (FDTR) experimental setup. Numerical solutions enable use of realistic boundary conditions, such as convective cooling from the various surfaces of the substrate and transducer. The equations were solved in time domain and the phase lag between the temperature at the center of the transducer and the modulated pump laser signal were computed for a modulation frequency range of 200 kHz to 200 MHz. It was found that the numerical predictions fit the experimentally measured phase lag better than analytical frequency-domain solutions of the Fourier heat equation based on Hankel transforms. The effects of boundary conditions were investigated and it was found that if the substrate (computational domain) is sufficiently large, the far-field boundary conditions have no effect on the computed phase lag. The interface conductance between the transducer and the substrate was also treated as a parameter, and was found to have some effect on the predicted thermal conductivity, but only in certain regimes. The hyperbolic heat conduction equation yielded identical results as the Fourier heat conduction equation for the particular case studied. The thermal conductivity value (best fit) for the silicon substrate considered in this study was found to be 108 W/m/K, which is slightly different from previously reported values for the same experimental data.


2015 ◽  
Vol 7 (1) ◽  
pp. 31-42 ◽  
Author(s):  
Jingjun Zhao ◽  
Songshu Liu ◽  
Tao Liu

AbstractIn this paper, a Cauchy problem of two-dimensional heat conduction equation is investigated. This is a severely ill-posed problem. Based on the solution of Cauchy problem of two-dimensional heat conduction equation, we propose to solve this problem by modifying the kernel, which generates a well-posed problem. Error estimates between the exact solution and the regularized solution are given. We provide a numerical experiment to illustrate the main results.


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