Effects of Clearance Between Heating Walls on Natural Cooling in a Channel Model of Electronic Equipment

2007 ◽  
Author(s):  
Yasushi Nishino ◽  
Ryoji Imai ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Temperature Rise ◽  
Printed Circuit Boards ◽  
Channel Model ◽  
Maximum Velocity ◽  
Vertical Channel ◽  
Cooling Capacity ◽  
Electronic Equipment ◽  
Heated Wall ◽  
Parallel Plates ◽  
The Relationship

Making electronic products smaller in size requires air passages in the products to be narrow. For effective thermal management with natural convection, the relationship between cooling performance and a space for the air passages must be clarified. In this study, the natural cooling capacity and flow field in relatively small electronic equipment have been investigated. A channel model was used as an experimental model of electronic equipments. The channel model has two vertical copper walls modeling the printed circuit boards and two transparent walls modeling the casing walls. The walls constitute a vertical channel with the height of 120mm, the depth of 56mm, and the variable width. The width of the channel is called “a wall clearance” here and it is varied from 5mm to 15mm. The copper walls were heated using electric heaters. Temperatures in the model were measured with thermo-couples. In addition, velocity distributions in the channel were quantitatively measured using a particle image velocimetry (PIV). The natural cooling capacity was obtained as functions of the wall clearance and heating power. Temperature rise of the heated wall showed small differences with the clearances of 10 mm and 15mm. However, when the clearance was decreased to 5mm, temperature rise increased. The relationship between Nusselt number and Rayleigh number obtained in this study agrees with those obtained for the parallel plates without side walls. The results of the velocity measurement revealed that the velocity showed a 33% decrease when the wall clearance decreased from 10mm to 5mm. On the other hand, the maximum velocity in the channel showed a 10% increase when the clearance decreased from 15mm to 10mm. The changes in the velocity profiles depending on the heating conditions are clarified.

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

2009 ◽  
Author(s):  
Yasushi Nishino ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa
Keyword(s):  
Channel Model ◽  
Vertical Channel ◽  
Velocity Profiles ◽  
Electronic Equipment ◽  
Air Cooling ◽  
Cooling Flow ◽  
Image Velocimetry ◽  
Air Passage ◽  
The Relationship ◽  
Vertical Duct

The cooling capability in compact electronic equipment in natural convective flow fields has been investigated. The relationship between air passage width in the channel and natural cooling capability was obtained. Temperature and velocity measurements were carried out using a channel model of electronic equipment comprising a vertical duct of rectangular section. The channel model had two copper walls and two transparent acrylic walls. The clearance between the copper walls was used as a parameter for the channel model. Velocity profiles of natural cooling flow in the channel were quantitatively measured using particle image velocimetry (PIV). The temperature and velocity results demonstrated that changes in the velocity profiles closely depend on the wall clearances. It is clarified that the clearance from 8 mm to 10 mm is the best size for natural cooling in the channel.

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

2010 ◽  
Author(s):  
Yasushi Nishino ◽  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa
Keyword(s):  
Numerical Simulation ◽  
Channel Model ◽  
Vertical Channel ◽  
Electronic Equipment ◽  
Air Cooling ◽  
Measured Temperature ◽  
Model Following ◽  
Image Velocimetry ◽  
Convection Cooling ◽  
Copper Wall

The natural convection cooling capability in a compact item of electronic equipment was investigated quantitatively by experiment and numerical simulation with a simple channel model. The optimization of the channel sizes, especially the clearance between heated walls, was discussed. The channel model, which consists of a vertical duct of rectangular section, was applied as the experimental model of electronic equipment in this study. The channel model consists of two heated copper walls and two transparent acrylic walls. The clearance between the copper walls of the channel was varied from 5 mm to 15 mm. Temperature measurement on the copper wall surfaces and velocity measurement of natural air flow in the channel by using a particle image velocimetry (PIV) were conducted for a few clearances of the channel. Numerical simulation was also carried out, with a model following the experimental setup, for more detailed discussion of various clearances of the channel. The relationship between the clearance and the temperature rise of the walls or velocity profile was investigated. The correlation between the Rayleigh number and the Nusselt number was obtained from measured temperature. The natural cooling capability and the velocity profiles depend on the clearance between the copper walls. When the wall clearances are more than 15 mm, the cooling is not enhanced. On the other hand, in the case that the clearance becomes less than 7 mm, the cooling capability becomes significantly lower. Consequently, it is clarified that the clearance from 8 mm to 10 mm is the best size for natural cooling from the view point of the space and the capability.

High Rayleigh Number Laminar Natural Convection in an Asymmetrically Heated Vertical Channel

1989 ◽  
Vol 111 (3) ◽  
pp. 649-656 ◽  
Author(s):  
B. W. Webb ◽  
D. P. Hill
Keyword(s):  
Nusselt Number ◽  
Natural Convection ◽  
Rayleigh Number ◽  
Vertical Channel ◽  
Local Heat Transfer ◽  
Heated Wall ◽  
Uniform Heat Flux ◽  
Parallel Plates ◽  
Heating Rates ◽  
Wide Range

Experiments have been performed to determine local heat transfer data for the natural convective flow of air between vertical parallel plates heated asymmetrically. A uniform heat flux was imposed along one heated wall, with the opposing wall of the channel being thermally insulated. Local temperature data along both walls were collected for a wide range of heating rates and channel wall spacings corresponding to the high modified Rayleigh number natural convection regime. Laminar flow prevailed in all experiments. Correlations are presented for the local Nusselt number as a function of local Grashof number along the channel. The dependence of both average Nusselt number and the maximum heated wall temperature on the modified Rayleigh number is also explored. Results are compared to previous analytical and experimental work with good agreement.

J0103-5-3 Study on the enhancement of natural air cooling capability in the vertical channel model of electronic equipment

2009 ◽  
Vol 2009.6 (0) ◽  
pp. 83-84
Author(s):  
Yasushi NISHINO ◽  
Masaru ISHIZUKA ◽  
Shinji NAKAGAWA ◽  
Tomoyuki HATAKEYAMA
Keyword(s):  
Channel Model ◽  
Vertical Channel ◽  
Electronic Equipment ◽  
Air Cooling

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

2010 ◽  
Author(s):  
Yasushi Nishino ◽  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa
Keyword(s):  
Numerical Simulation ◽  
Channel Model ◽  
Vertical Channel ◽  
Electronic Equipment ◽  
Air Cooling ◽  
Measured Temperature ◽  
Model Following ◽  
Image Velocimetry ◽  
Convection Cooling ◽  
Copper Wall

The natural convection cooling capability in a compact item of electronic equipment was investigated quantitatively by experiment and numerical simulation with a simple channel model. The optimization of the channel sizes, especially the clearance between heated walls, was discussed. The channel model, which consists of a vertical duct of rectangular section, was applied as the experimental model of electronic equipment in this study. The channel model consists of two heated copper walls and two transparent acrylic walls. The clearance between the copper walls of the channel was varied from 5 mm to 15 mm. Temperature measurement on the copper wall surfaces and velocity measurement of natural air flow in the channel by using a particle image velocimetry (PIV) were conducted for a few clearances of the channel. Numerical simulation was also carried out, with a model following the experimental setup, for more detailed discussion of various clearances of the channel. The relationship between the clearance and the temperature rise of the walls or velocity profile was investigated. The correlation between the Rayleigh number and the Nusselt number was obtained from measured temperature. The natural cooling capability and the velocity profiles depend on the clearance between the copper walls. When the wall clearances are more than 15 mm, the cooling is not enhanced. On the other hand, in the case that the clearance becomes less than 7 mm, the cooling capability becomes significantly lower. Consequently, it is clarified that the clearance from 8 mm to 10 mm is the best size for natural cooling from the view point of the space and the capability.

Stability of buoyancy-driven flow in a vertical channel with one heated wall

2021 ◽  
Vol 33 (8) ◽  
pp. 084103
Author(s):  
S. Zeraati Dizjeh ◽  
J. Brinkerhoff
Keyword(s):  
Vertical Channel ◽  
Heated Wall

scholarly journals Estimating Recycling Return of Integrated Circuits Using Computer Vision on Printed Circuit Boards

2021 ◽  
Vol 11 (6) ◽  
pp. 2808
Author(s):  
Leandro H. de S. Silva ◽  
Agostinho A. F. Júnior ◽  
George O. A. Azevedo ◽  
Sergio C. Oliveira ◽  
Bruno J. T. Fernandes
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Electronic Waste ◽  
Decision Criterion ◽  
Economic Feasibility ◽  
Electronic Equipment ◽  
Circuit Board ◽  
Mechanical Recycling ◽  
Printed Circuit

The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC’s weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB’s ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs’ ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.

On Combined Free and Forced Convection in Channels

1960 ◽  
Vol 82 (3) ◽  
pp. 233-238 ◽  
Author(s):  
L. N. Tao
Keyword(s):  
Forced Convection ◽  
Rectangular Channel ◽  
Complex Function ◽  
Vertical Channel ◽  
Temperature Fields ◽  
Parallel Plates ◽  
Free And Forced Convection ◽  
Energy Equations ◽  
Helmholtz Wave Equation ◽  
Transfer Problems

The heat-transfer problems of combined free and forced convection by a fully developed laminar flow in a vertical channel of constant axial wall temperature gradient with or without heat generations are approached by a new method. By introducing a complex function which is directly related to the velocity and temperature fields, the coupled momentum and energy equations are readily combinable to a Helmholtz wave equation in the complex domain. This greatly reduces the complexities of the problems. For illustrations, the cases of flows between parallel plates and in a rectangular channel are treated. It shows that this method is more direct and powerful than those of previous investigations.

Turbulent Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources

1994 ◽  
Vol 116 (3) ◽  
pp. 577-587 ◽  
Author(s):  
S. H. Kim ◽  
N. K. Anand
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Electronic Equipment ◽  
Turbulent Heat Transfer ◽  
Turbulent Heat ◽  
Computational Domain ◽  
Heat Sources ◽  
Parallel Plates ◽  
Wide Range ◽  
Independent Parameters

Two-dimensional turbulent heat transfer between a series of parallel plates with surface mounted discrete block heat sources was studied numerically. The computational domain was subjected to periodic conditions in the streamwise direction and repeated conditions in the cross-stream direction (Double Cyclic). The second source term was included in the energy equation to facilitate the correct prediction of a periodically fully developed temperature field. These channels resemble cooling passages in electronic equipment. The k–ε model was used for turbulent closure and calculations were made for a wide range of independent parameters (Re, Ks/Kf, s/w, d/w, and h/w). The governing equations were solved by using a finite volume technique. The numerical procedure and implementation of the k–ε model was validated by comparing numerical predictions with published experimental data (Wirtz and Chen, 1991; Sparrow et al., 1982) for a single channel with several surface mounted blocks. Computations were performed for a wide range of Reynolds numbers (5 × 104–4 × 105) and geometric parameters and for Pr = 0.7. Substrate conduction was found to reduce the block temperature by redistributing the heat flux and to reduce the overall thermal resistance of the module. It was also found that the increase in the Reynolds number decreased the thermal resistance. The study showed that the substrate conduction can be an important parameter in the design and analysis of cooling channels of electronic equipment. Finally, correlations for the friction factor (f) and average thermal resistance (R) in terms of independent parameters were developed.

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