Simple Measuring Method of Thermal Conductivity of Silicone Grease and Effect of Carbon Nanomaterials on Its Thermal Conductivity

2007 ◽  
Author(s):  
Toshio Tomimura ◽  
Seiji Nomura ◽  
Masaaki Okuyama
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanomaterials ◽  
Cooling System ◽  
Thermal Contact ◽  
Conductivity Measurement ◽  
Measuring Method ◽  
Heat Fluxes ◽  
Quantitative Relation ◽  
Silicone Grease ◽  
Simple Method

In the electronic equipment like personal computers with high heat fluxes for instance, the thermal contact resistance plays an important role in its cooling system. To attain high cooling performance, some kind of grease is often introduced between a heat source and a heat sink. In the present study, a simple method for thermal conductivity measurement of grease has been proposed and confirmed its validity by using greases with known thermal conductivity. From a series of measurements, the validity of the present measuring method has been confirmed. Further, the effect of the addition of carbon nanomaterials on the thermal conductivity of silicone grease has been investigated, and its quantitative relation has been clarified.

Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method

2000 ◽  
Vol 122 (4) ◽  
pp. 808-816 ◽  
Author(s):  
K. R. Cheruparambil ◽  
B. Farouk ◽  
J. E. Yehoda ◽  
N. A. Macken
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Calibration Curve ◽  
Thermal Contact ◽  
Diamond Films ◽  
Conductivity Measurement ◽  
Cvd Diamond ◽  
Conductive Heat ◽  
Comparator Method

Results from an experimental study on the rapid measurement of thermal conductivity of chemical vapor deposited (CVD) diamond films are presented. The classical thermal comparator method has been used successfully in the past for the measurement of thermal conductivity of bulk materials having high values of thermal resistance. Using samples of known thermal conductivity, a calibration curve is prepared. With this calibration curve, the comparator can be used to determine thermal conductivity of unknown samples. We have significantly modified and extended this technique for the measurement of materials with very low thermal resistance, i.e., CVD diamond films with high thermal conductivity. In addition to the heated probe, the modified comparator employs a thermoelectric cooling element of increase conductive heat transfer through the film. The thermal conductivity measurements are sensitive to many other factors such as the thermal contact resistances, anisotropic material properties, surrounding air currents and temperature, and ambient humidity. A comprehensive numerical model was also developed to simulate the heat transfer process for the modified comparator. The simulations were used to develop a “numerical” calibration curve that agreed well with the calibration curve obtained from our measurements. The modified method has been found to successfully measure the thermal conductivity of CVD diamond films. [S0022-1481(00)00804-5]

A simple method for the absolute measurement of thermal conductivity of drill cuttings

Geophysics ◽  
1986 ◽  
Vol 51 (8) ◽  
pp. 1580-1584 ◽  
Author(s):  
Tien‐Chang Lee ◽  
Thomas L. Henyey ◽  
Brian N. Damiata
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact ◽  
Absolute Measurement ◽  
Element Model ◽  
Simple Method ◽  
Drill Cuttings ◽  
Good Thermal Contact ◽  
Needle Probe ◽  
Radial Heat ◽  
Electric Heat

We present a method for absolute measurement of thermal conductivity of drill cuttings. The simplicity of the apparatus makes it suitable for nondestructive use of cuttings and for sample sizes too small to be measured with a needle probe. Because the measurement is absolute, no calibration standards are required. Samples are placed in a Plexiglas cup with a lid containing an electric heat source. The base of the cup is placed in good thermal contact with an aluminum‐block heat sink. Upward and radial heat losses are minimized with styrofoam insulation surrounding the cup. The accuracy of the method was estimated by cross‐measurement of selected samples with a well‐calibrated needle probe. Results indicate that errors in measurement are less than 5 percent for sample conductivities greater than 0.8 W/m ⋅ K if the heat loss through the styrofoam insulation is accounted for. Reproducibility is typically within 3 percent. An axisymmetric finite‐element model which simulates the temperature distribution of the measurement apparatus further demonstrates its viability.

Melt-processed P3HT and PE Polymer Nanofiber Thermal Conductivity

MRS Advances ◽  
2017 ◽  
Vol 2 (58-59) ◽  
pp. 3619-3626 ◽  
Author(s):  
Matthew K. Smith ◽  
Thomas L. Bougher ◽  
Kyriaki Kalaitzidou ◽  
Baratunde A. Cola
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact ◽  
Heat Fluxes ◽  
High Thermal Conductivity ◽  
Chain Elongation ◽  
Large Area ◽  
Thermal Interface ◽  
Molecular Weights ◽  
Polymer Nanofiber ◽  
Polarized Raman

ABSTRACT Thermal management is a growing challenge for electronics packaging because of increased heat fluxes and device miniaturization. Thermal interface materials (TIMs) are used in electronic devices to transfer heat between two adjacent surfaces. TIMs need to exhibit high thermal conductivity and must be soft to minimize thermal contact resistance. Polymers, despite their relative softness, suffer from low thermal conductivity (∼0.2 W/m-K). To overcome this challenge, we infiltrate nanoporous anodic aluminum oxide (AAO) templates with molten polymer to fabricate large area arrays of vertically aligned polymer nanofibers. Nanoscale confinement effects and flow induced chain elongation improve polymer chain alignment (measured using polarized Raman spectroscopy) and thermal conductivity (measured using the photoacoustic method) along the fiber’s long axis. Conjugated poly(3-hexylthiophene-2,5-diyl) (P3HT) and non- conjugated polyethylene (PE) of various molecular weights are explored to establish a relationship between polymer structure, nanofiber diameter, and the resulting thermal conductivity. In general, thermal conductivity improves with decreasing fiber diameter and increasing polymer molecular weight. Thermal conductivity of approximately 7 W/m-K was achieved for both the ∼200 nm diameter HDPE fibers and the 100 nm diameter P3HT fibers. These results pave the way for optimization of the processing conditions to produce high thermal conductivity fiber arrays using different polymers, which could potentially be used in thermal interface applications.

Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method

1999 ◽  
Author(s):  
Kumar R. Cheruparambil ◽  
Bakhtier Farouk ◽  
Joseph E. Yehoda ◽  
Nelson A. Macken
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Calibration Curve ◽  
Thermal Contact ◽  
Diamond Films ◽  
Conductivity Measurement ◽  
Cvd Diamond ◽  
Conductive Heat ◽  
Comparator Method

Abstract Results from an experimental study on the rapid measurement of thermal conductivity of chemical-vapor-deposited (CVD) diamond films are presented. The classical thermal comparator method has been used successfully for the measurement of thermal conductivity of bulk materials having high values of thermal resistance. Using samples of known thermal conductivity, a calibration curve is prepared. With this calibration curve, the comparator can be used to determine thermal conductivity of unknown samples. We have significantly modified and extended this technique for the measurement of materials with very low thermal resistance, i.e., CVD films with high thermal conductivity. In addition to the heated probe, the modified comparator employs a thermo-electric cooling element to increase conductive heat transfer through the film. The thermal conductivity measurements are sensitive to many other factors such as the thermal contact resistances, anisotropic material properties, surrounding air currents and temperature, and ambient humidity. A comprehensive numerical model was also developed to simulate the heat transfer process for the modified comparator. The simulations were used to develop a ‘numerical’ calibration curve that agreed well with the calibration curve obtained from our measurements. The modified method has been found to successfully measure the thermal conductivity of CVD diamond films.

High Performance Thermal Conductive Sheets Made of Carbon Fibers

2011 ◽  
Author(s):  
Keisuke Aramaki ◽  
Hiroyuki Ryoson ◽  
Yuichi Ishida
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fibers ◽  
High Performance ◽  
Large Scale ◽  
Cooling System ◽  
Thermal Contact ◽  
Thickness Direction ◽  
High Quality ◽  
Process Step

Today, the quality of LCD (Liquid Crystal Display) TVs has improved along with the quality of the installed LSI (Large Scale Integration) Thus, the cooling system needs to have high performance. However, LCD TV requires a large area but thin cooling system, so the TIM in which used in LCD TV requires highly softness. Thus we have developed high-quality yet soft thermal conductive sheets in which carbon fibers are directed in the thickness direction. The thermal conductivity of the 2-mm-thick sheets is more than 23 W/mK, and the compressibility is more than 10%. In this case the thermal conductivity was measured in accordance with ASTM D5470. The compressibility means the ratio of the difference between the initial thickness and the thickness when the sheets were loaded. The carbon fibers are more than 100 μm long and about 10 μm in diameter. This sheet contains alumina and aluminum nitride particles. The manufacturing process for the sheet is as follows. Step 1: The mixing process. Step 2: The resin including the carbon fibers and the particles is pressed into a long rectangular cast. Step 3: The resin is heated to harden it. Step 4: The resin is sliced into sheets. In step 1, because the carbon fibers are long, the fibers are likely affected by shear stress. Thus, the fibers are aligned in a lengthwise direction. In Step 4, we used a supersonic wave cutter to achieve ideal slicing, thereby reducing the thermal contact resistance. These processes produced high-quality yet soft thermal conductive sheets. In these processes, the carbon fibers aligned in the thickness direction, which was determined in an SEM observation. Moreover, we found that, by slicing in the orientation direction at inclining angles, only the softness improved, without any deterioration in the thermal conductivity.

Analysis of significant measures for thermal conductivity

2020 ◽  
pp. 35-42
Author(s):  
Yuri P. Zarichnyak ◽  
Vyacheslav P. Khodunkov
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Surface Heat Flux ◽  
Heat Flux Density ◽  
Measurement Method ◽  
Conductivity Measurement ◽  
Surface Heat ◽  
Measuring Instrument ◽  
New Class ◽  
Achievable Accuracy

The analysis of a new class of measuring instrument for heat quantities based on the use of multi-valued measures of heat conductivity of solids. For example, measuring thermal conductivity of solids shown the fallacy of the proposed approach and the illegality of the use of the principle of ambiguity to intensive thermal quantities. As a proof of the error of the approach, the relations for the thermal conductivities of the component elements of a heat pump that implements a multi-valued measure of thermal conductivity are given, and the limiting cases are considered. In two ways, it is established that the thermal conductivity of the specified measure does not depend on the value of the supplied heat flow. It is shown that the declared accuracy of the thermal conductivity measurement method does not correspond to the actual achievable accuracy values and the standard for the unit of surface heat flux density GET 172-2016. The estimation of the currently achievable accuracy of measuring the thermal conductivity of solids is given. The directions of further research and possible solutions to the problem are given.

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