The Response of Portable Electronics to Transient Conditions of Temperature and Humidity

2005 ◽  
Author(s):  
Jeff Punch ◽  
Ronan Grimes ◽  
Greg Heaslip ◽  
Timo Galkin ◽  
Kyo¨sti Va¨keva¨inen ◽  
...  
Keyword(s):  
Technical Conference ◽  
Electronic Systems ◽  
Digital Cameras ◽  
Electronic Products ◽  
Humidity Response ◽  
Portable Electronics ◽  
Material Migration ◽  
Temperature And Humidity ◽  
And Migration ◽  
Transient Variations

The design of portable electronic systems for use in hot and humid conditions represents a significant design challenge for packaging engineers. Humidity drives a range of failure mechanisms: the alteration of material properties; hygro-mechanical stress phenomena; and the acceleration of corrosion and material migration. Moreover, portable electronic products such as mobile phones, CD players and digital cameras can experience rapidly varying conditions of temperature and humidity which, in certain conditions, can cause condensation to form on the internal and external surfaces of the product. Condensation — or even very high relative humidity — is a severe stimulus because it greatly accelerates corrosion and migration mechanisms. This paper considers the response of portable electronics to transient variations of temperature and humidity in order to assess the conditions under which condensation is likely to occur. A first-order coupled hygrothermal model is developed to represent the temperature and humidity response of a typical portable product using simple time constants. Experimental characterisation of a sample product is performed to evaluate the parameters of the model, and it is demonstrated how movement from one environment to another can precipitate condensation.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

Analysis and Mitigation of Sample Heating in Thermoreflectance Microscopy

2005 ◽  
Author(s):  
Andrew C. Miner ◽  
Uttam Ghoshal
Keyword(s):  
Heat Flux ◽  
Temperature Field ◽  
Temperature Rise ◽  
Technical Conference ◽  
Electronic Systems ◽  
Sample Heating ◽  
Large Measurement ◽  
Reflectance Microscopy ◽  
Analytical Expressions ◽  
Thermoreflectance Microscopy

The illumination of a sample when imaged by thermoreflectance thermal microscopy may cause significant heating of the surface. Nonlinearities in the performance of the system being imaged may lead to large measurement induced errors in the observed temperature field. Analytical expressions are presented to estimate the temperature rise and heat flux in a sample. Spatially filtered thermo-reflectance microscopy is introduced as a technique to significantly reduce the incident heat flux without loss of spatial resolution.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

scholarly journals Modeling of Failure Probability for Reliability and Component Reuse of Electric and Electronic Equipment

Energies ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2843
Author(s):  
Massimo Conti ◽  
Simone Orcioni
Keyword(s):  
End Of Life ◽  
Failure Probability ◽  
Circular Economy ◽  
Industrial Production ◽  
Electrical Equipment ◽  
Electronic Systems ◽  
International Electrotechnical Commission ◽  
Fault Models ◽  
Component Reuse ◽  
Electronic Products

Recently, the concept of “circular economy”, the design for end-of-life, the problem of reduction of waste of electronic and electrical equipment are becoming more and more important. The design of electronic systems for end-of-life considers the possibility of their repair, reuse and recycle, in order to reduce waste. This work proposes a new accurate model of failure probability density, that includes the failure probability of a used component in new equipment. The model has been tested, in conjunction with the International Electrotechnical Commission and Telcordia standard, in real industrial production. Eight years of historical faults have been analyzed and used to derive the fault models of the components. The model and analysis have been used for the analysis of real electronic products. The reuse of components could make an improvement to the reliability of the equipment.

Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications

2005 ◽  
Author(s):  
Y. Yang ◽  
Chun-Teh Li ◽  
S. M. Sadeghipour ◽  
M. Asheghi ◽  
H. Dieker ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Thermal Characterization ◽  
Technical Conference ◽  
Boundary Resistance ◽  
Optical Recording ◽  
Electronic Systems ◽  
Recording Technology ◽  
Sio2 Phase

Advances in the phase change optical recording technology strongly depend on the optical and thermal optimizations of the metal/ZnS-SiO2/phase change multilayer structure, which requires accurate modeling and thermal characterization of PC media structure. In the present work, the thermal conductivities of the amorphous and crystalline Ge4Sb1Te5 (GST) phase change; and ZnS-SiO2 dielectric layers of thickness in the range of 50 nm to 300 nm have been measured using the transient thermoreflectance technique. The data are between a factor of 2–4 different from the previously measured values for thin film and bulk samples. The thermal boundary resistance at metal/ZnS-SiO2 interface is found to be around 7×10−8 m2W−1. This might have serious implications for the future phase change recording application which attempts to achieve the high writing speeds by decreasing the thickness of ZnS-SiO2 dielectric layer.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

Effect of Conjugate Heat Transfer on MEMS-Based Thermal Shear Stress Sensor

2005 ◽  
Author(s):  
Jianghui Chao ◽  
Wei Shyy ◽  
Siddharth S. Thakur ◽  
Mark Sheplak ◽  
Renwei Mei
Keyword(s):  
Heat Transfer ◽  
Shear Stress ◽  
Conjugate Heat Transfer ◽  
Stress Measurement ◽  
State Of The Art ◽  
Technical Conference ◽  
Flow Structures ◽  
Thermal Conductivity Ratio ◽  
Electronic Systems ◽  
Physical Mechanisms

The effect of conjugate heat transfer resulting from a Micro-electromechanical Systems (MEMS)-based thermal shear stress is investigated. Due to the length scale disparity and large solid-fluid thermal conductivity ratio, a two-level computation is used to examine the relevant physical mechanisms and their influences on wall shear stress. The substantial variations in transport properties between the fluid and solid phases and their interplay in regard to heat transfer and near-wall fluid flow structures are investigated. It is demonstrated that for the state-of-the-art sensor design, the buoyancy effect can noticeably affect the accuracy of the shear stress measurement.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

scholarly journals Hybrid toponyms of Panama as a reflection of toponymic bilingualism

2021 ◽  
Vol 2 (6) ◽  
pp. 221-226
Author(s):  
Irina A. Martynenko ◽  
◽  
Olga S. Chesnokova ◽  
Keyword(s):  
English Language ◽  
Linguistic Analysis ◽  
Ethnic Composition ◽  
Electronic Systems ◽  
Place Names ◽  
Natural Conditions ◽  
Cultural Events ◽  
And Migration ◽  
Topographic Relief ◽  
Comprehensive Study

The article presents evidence of a comprehensive linguistic analysis of the toponymy of Panama. The relevance of the topic is due to the fragmented research of Panamanian toponymy and the need for a comprehensive study of socio-historical and linguocultural factors in the formation of the Panamanian toponymicon. The hypothesis of the article is as follows: toponymy of Panama has a unique heterogeneous and polystrate character, semiotically determined by historical facts, ethnic composition of the population, natural conditions of the country and migration processes. Maps, GoogleMaps, GeoNames electronic systems were used as materials and tools. It was found that Hispanic geographic names make up the largest percentage in comparison with autochthonous toponyms and hybrid (blended) toponyms. The authors identified Spanish-Indian and Spanish-English blended place names. It is substantiated that Panama is a unique area of ​​functioning of the general Spanish toponymic vocabulary. Historical and cultural events in the country were reflected in toponymy, capturing the topographic relief, including metaphorically perceived, names of first settlers, names of famous Panamanian personalities, perception of topographic objects at various stages of the country's development, influence of English language, which together form the toponymic dominants of the Panamanian society, heterogeneity and unique hybrid Indian-Spanish-English character of toponymicon, on the basis of which the term “toponymic multilinguism” is proposed.

A Survey of Sensor Technologies for Prognostics and Health Management of Electronic Systems

2014 ◽  
Vol 602-605 ◽  
pp. 2229-2232 ◽  
Author(s):  
Wen Xue Yang ◽  
Zhe Chen ◽  
Feng Yang
Keyword(s):  
Life Cycle ◽  
Early Warning ◽  
Health Management ◽  
Life Cycle Costs ◽  
Electronic Systems ◽  
Sensor Systems ◽  
Prognostics And Health Management ◽  
Electronic Products ◽  
System Failures

Recently, the field of Prognostics and Health Management (PHM) for electronic products and systems has received increasing attention due to the potentialities to provide early warning of system failures, reduce life cycle costs, and forecast maintenance as needed. This paper introduces the sensors and their sensor technologies. The required attributes of sensors for the development for PHM of electronics are discussed. Finally, their trends in sensor systems are presented.

Self-Heating Modeling of Magnetic Recording Read Head

2005 ◽  
Author(s):  
Y. Yang ◽  
L. Baril ◽  
E. Schreck ◽  
A. Wallash ◽  
M. Asheghi
Keyword(s):  
Magnetic Recording ◽  
Temperature Rise ◽  
Areal Density ◽  
Technical Conference ◽  
Normal Operation ◽  
Electronic Systems ◽  
Element Analysis ◽  
Self Heating ◽  
Read Head ◽  
Gmr Sensor

The performance and reliability of the GMR heads are adversely affected by self-heating due to the aggressive scaling of its dimensions to increase areal density. In this manuscript, the self-heating of the GMR head during the normal operation is investigated. An analytical model is developed to estimate the temperature rise in the GMR sensor due to self-heating for magnetic recording areal densities from 2.8 to 80 Gbits/in2, which agrees well with the FEM simulations. This model is subsequently used to investigate the influence of the GMR head constituent materials’ thermal properties on the device temperature rise. A 3-D finite element analysis was also performed to predict the level of self-heating in lead-overlaid (LOL) design, which agrees well with the experimental data obtained using steady-state and transient measurements.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

Sign in / Sign up

Export Citation Format

Share Document