Brownian-Motion-Based Convective-Conductive Model for the Thermal Conductivity of Nanofluids

2005 ◽  
Author(s):  
Ravi Prasher
Keyword(s):  
Thermal Conductivity ◽  
Research Community ◽  
Particle Sizes ◽  
Brownian Movement ◽  
Liquid Temperature ◽  
Interfacial Resistance ◽  
Conduction Model ◽  
The Past ◽  
Order Of Magnitude ◽  
Base Liquid

The research community has been perplexed for the past five years with the unusually high effective thermal conductivity of nanofluids. Although various mechanisms and models have been proposed in the literature to explain the high conductivity of these nanofluids, no concrete conclusions have been reached. Through an order-of-magnitude analysis of various possible mechanisms, we show that convection caused by the Brownian movement of these nanoparticles is primarily responsible for the enhancement in the thermal conductivity of such colloidal nanofluids. We also introduce a convective-conductive model which accurately captures the effects of particle size, choice of base liquid, thermal interfacial resistance between the particles and liquid, temperature, etc. This model is a combination of the Maxwell-Garnett (MG) conduction model and the convection caused by the Brownian movement of the nanoparticles, and reduces to the MG model for large particle sizes.

Brownian-Motion-Based Convective-Conductive Model for the Effective Thermal Conductivity of Nanofluids

2005 ◽  
Vol 128 (6) ◽  
pp. 588-595 ◽  
Author(s):  
Ravi Prasher ◽  
Prajesh Bhattacharya ◽  
Patrick E. Phelan
Keyword(s):  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Particle Sizes ◽  
Brownian Movement ◽  
Liquid Temperature ◽  
Interfacial Resistance ◽  
Conduction Model ◽  
Order Of Magnitude ◽  
Base Liquid ◽  
Good Agreement

Here we show through an order-of-magnitude analysis that the enhancement in the effective thermal conductivity of nanofluids is due mainly to the localized convection caused by the Brownian movement of the nanoparticles. We also introduce a convective-conductive model which accurately captures the effects of particle size, choice of base liquid, thermal interfacial resistance between the particles and liquid, temperature, etc. This model is a combination of the Maxwell-Garnett (MG) conduction model and the convection caused by the Brownian movement of the nanoparticles, and reduces to the MG model for large particle sizes. The model is in good agreement with data on water, ethylene glycol, and oil-based nanofluids, and shows that the lighter the nanoparticles, the greater the convection effect in the liquid, regardless of the thermal conductivity of the nanoparticles.

Enhanced thermal conductivity of epoxy/alumina composite through multiscale-disperse packing

2020 ◽  
Vol 55 (1) ◽  
pp. 17-25
Author(s):  
Hongkun Li ◽  
Weidong Zheng
Keyword(s):  
Thermal Conductivity ◽  
Volume Fraction ◽  
Mean Field ◽  
High Volume ◽  
Theory Model ◽  
Spherical Particles ◽  
Particle Sizes ◽  
Interfacial Resistance ◽  
Steady State Method ◽  
Cure Shrinkage

Inspired by the size of the voids in closest packing structures, we propose to use the combination of spherical particles with different size scales to increase the loading fraction of the fillers in epoxy-based composites. In this study, high loading up to 79 vol% has been achieved with multiscale particle sizes of spherical Al2O3 particles. The highest thermal conductivity of Al2O3-filled liquid epoxy measured by steady-state method is 6.7 W m−1 K−1 at 25°C, which is approximately 23 times higher than the neat epoxy (0.28 W m−1 K−1). Three models based on Maxwell mean-field scheme (MMF), differential effective medium (DEM) and percolation theory model (PTM) were utilized to assess our measured thermal conductivity data. We found that both DEM and PTM models could give good results at high volume fraction regime. We have also observed a considerable reduction (10–15%) of thermal conductivity in our Al2O3-filled cured epoxy samples. We attribute this reduction to the increasing of thermal interfacial resistance between Al2O3 particles and cured epoxy matrix, induced by cure shrinkage during the reaction. Our experiments have demonstrated that systems with multiscale particle sizes exhibit lower viscosity and can be filled with much higher fraction of fillers. We thus expect that higher thermal conductivity (probably >12 W m−1 K−1 based on DEM) can be achieved in future via filling higher thermal conductivity spherical fillers (e.g., AlN, SiC), increasing loading fraction by multiscale-disperse packing and reducing the effect from cure shrinkage.

Contact Resistance Measurement and Its Effect on the Thermal Conductivity of Packed Sphere Systems

2004 ◽  
Vol 126 (6) ◽  
pp. 886-895 ◽  
Author(s):  
W. W. M. Siu ◽  
S. H.-K. Lee
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Effective Thermal Conductivity ◽  
Transient Behavior ◽  
Contact Radius ◽  
Transient Temperature ◽  
Interfacial Resistance ◽  
Conduction Model ◽  
Scale Modeling ◽  
Packed Sphere

There has been a growing interest in porous systems with a smaller length-scale modeling requirement on the order of each particle, where the existing tools tend to be inadequate. To address this, a Discrete Conduction Model was recently proposed to allow for the transient temperature calculation of 3D random packed-sphere systems for various microstructures. Since many of the motivating applications involve contacting spheres and since there has been a limited number of contact-resistance studies on spheres undergoing elastic deformation, the objective of this study is to obtain measurements of the contact resistances between metallic spheres in elastic contact, as well as to quantify their influence on the effective thermal conductivity. To accomplish this, an experiment was constructed utilizing air and interfacial resistance to replace the functions of the guard heater and vacuum chamber, and in so doing, enabled transient observations. The overall uncertainty was estimated to be ±6%, and the results were benchmarked against available data. A correlation was obtained relating the contact resistance with the contact radius, and results showed the contact resistance to have minimal transient behavior. The results also showed that the neglect of contact resistance could incur an error in the effective thermal conductivity calculation as large as 800%, and a guideline was presented under which the effect of the contact resistance may be ignored. A correlation accounting for the effect of contact resistance on the effective thermal conductivity was also presented.

Evaluating Qualitative Research

2017 ◽  
Author(s):  
Jeasik Cho
Keyword(s):  
Qualitative Research ◽  
Large Scale ◽  
Academic Research ◽  
Research Community ◽  
Assessment Tools ◽  
Journal Articles ◽  
Journal Editors ◽  
The Past ◽  
Grant Proposals

This book provides the qualitative research community with some insight on how to evaluate the quality of qualitative research. This topic has gained little attention during the past few decades. We, qualitative researchers, read journal articles, serve on masters’ and doctoral committees, and also make decisions on whether conference proposals, manuscripts, or large-scale grant proposals should be accepted or rejected. It is assumed that various perspectives or criteria, depending on various paradigms, theories, or fields of discipline, have been used in assessing the quality of qualitative research. Nonetheless, until now, no textbook has been specifically devoted to exploring theories, practices, and reflections associated with the evaluation of qualitative research. This book constructs a typology of evaluating qualitative research, examines actual information from websites and qualitative journal editors, and reflects on some challenges that are currently encountered by the qualitative research community. Many different kinds of journals’ review guidelines and available assessment tools are collected and analyzed. Consequently, core criteria that stand out among these evaluation tools are presented. Readers are invited to join the author to confidently proclaim: “Fortunately, there are commonly agreed, bold standards for evaluating the goodness of qualitative research in the academic research community. These standards are a part of what is generally called ‘scientific research.’ ”

The effect of variable properties and rotation in a visco-thermoelastic orthotropic annular cylinder under the Moore–Gibson–Thompson heat conduction model

2021 ◽  
pp. 146442072098589
Author(s):  
Ahmed E Aboueregal ◽  
Hamid M Sedighi
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stresses ◽  
Thermal Conductivity Coefficient ◽  
Variable Properties ◽  
Transformation Technique ◽  
Present Contribution ◽  
Conduction Model ◽  
Thermoelastic Model ◽  
Shock Heating ◽  
Physical Fields

The present contribution aims to address a problem of thermoviscoelasticity for the analysis of the transition temperature and thermal stresses in an infinitely circular annular cylinder. The inner surface is traction-free and subjected to thermal shock heating, while the outer surface is thermally insulated and free of traction. In this work, in contrast to the various problems in which the thermal conductivity coefficient is considered to be fixed, this parameter is assumed to be variable depending on the temperature change. The problem is studied by presenting a new generalized thermoelastic model of thermal conductivity described by the Moore–Gibson–Thompson equation. The new model can be constructed by incorporating the relaxation time thermal model with the Green–Naghdi type III model. The Laplace transformation technique is used to obtain the exact expressions for the radial displacement, temperature and the distributions of thermal stresses. The effects of angular velocity, viscous parameter, and variance in thermal properties are also displayed to explain the comparisons of the physical fields.

scholarly journals Sustainable Panels Made with Industrial and Agricultural Waste: Thermal and Environmental Critical Analysis of the Experimental Results

2021 ◽  
Vol 11 (2) ◽  
pp. 494
Author(s):  
Paola Ricciardi ◽  
Elisa Belloni ◽  
Francesca Merli ◽  
Cinzia Buratti
Keyword(s):  
Thermal Conductivity ◽  
Life Cycle ◽  
Rice Husk ◽  
Agricultural Waste ◽  
Embodied Energy ◽  
Waste Materials ◽  
Impact Reduction ◽  
Combined Solution ◽  
Order Of Magnitude ◽  
Recycled Waste

Recycled waste materials obtained from industrial and agricultural processes are becoming promising thermal and acoustic insulating solutions in building applications; their use can play an important role in the environmental impact reduction. The aim of the present paper is the evaluation of the thermal performance of recycled waste panels consisting of cork scraps, rice husk, coffee chaff, and end-life granulated tires, glued in different weight ratios and pressed. Six panels obtained from the mixing of these waste materials were fabricated and analyzed. In particular, the scope is the selection of the best compromise solutions from the thermal and environmental points of view. To this aim, thermal resistances were measured in laboratory and a Life Cycle Assessment (LCA) analysis was carried out for each panel; a cross-comparative examination was performed in order to optimize their properties and find the best panels solutions to be assembled in the future. Life Cycle Analysis was carried out in terms of primary Embodied Energy and Greenhouse Gas Emissions, considering a ‘‘cradle-to-gate” approach. The obtained thermal conductivities varied in the 0.055 to 0.135 W/mK range, in the same order of magnitude of many traditional systems. The best thermal results were obtained for the panels made of granulated cork, rice husk, and coffee chaff in this order. The rubber granulate showed higher values of the thermal conductivity (about 0.15 W/mK); a very interesting combined solution was the panel composed of cork (60%), rice husk (20%), and coffee chaff (20%), with a thermal conductivity of 0.08 W/mK and a Global Warming Potential of only 2.6 kg CO2eq/m2. Considering the Embodied Energy (CED), the best solution is a panel composed of 56% of cork and 44% of coffee chaff (minimum CED and thermal conductivity).

scholarly journals Healthcare Applications of Artificial Intelligence and Analytics: A Review and Proposed Framework

2020 ◽  
Vol 10 (18) ◽  
pp. 6553
Author(s):  
Sabrina Azzi ◽  
Stéphane Gagnon ◽  
Alex Ramirez ◽  
Gregory Richards
Keyword(s):  
Artificial Intelligence ◽  
Chronic Care ◽  
Review Paper ◽  
Research Community ◽  
Patient Needs ◽  
Care Needs ◽  
Healthcare Applications ◽  
Medical Specialties ◽  
The Past ◽  
Promising Application

Healthcare is considered as one of the most promising application areas for artificial intelligence and analytics (AIA) just after the emergence of the latter. AI combined to analytics technologies is increasingly changing medical practice and healthcare in an impressive way using efficient algorithms from various branches of information technology (IT). Indeed, numerous works are published every year in several universities and innovation centers worldwide, but there are concerns about progress in their effective success. There are growing examples of AIA being implemented in healthcare with promising results. This review paper summarizes the past 5 years of healthcare applications of AIA, across different techniques and medical specialties, and discusses the current issues and challenges, related to this revolutionary technology. A total of 24,782 articles were identified. The aim of this paper is to provide the research community with the necessary background to push this field even further and propose a framework that will help integrate diverse AIA technologies around patient needs in various healthcare contexts, especially for chronic care patients, who present the most complex comorbidities and care needs.

Through-Plane Thermal Conductivity of PEMFC Porous Transport Layers

2010 ◽  
Vol 8 (2) ◽  
Author(s):  
Odne S. Burheim ◽  
Jon G. Pharoah ◽  
Hannah Lampert ◽  
Preben J. S. Vie ◽  
Signe Kjelstrup
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Residual Water ◽  
Order Of Magnitude ◽  
Thermal Conductivities

We report the through-plane thermal conductivities of the several widely used carbon porous transport layers (PTLs) and their thermal contact resistance to an aluminum polarization plate. We report these values both for wet and dry samples and at different compaction pressures. We show that depending on the type of PTL and the existence of residual water, the thermal conductivity of the materials varies from 0.15 W K−1 m−1 to 1.6 W K−1 m−1, one order of magnitude. This behavior is the same for the contact resistance varying from 0.8 m2 K W−1 to 11×10−4 m2 K W−1. For dry PTLs, the thermal conductivity decreases with increasing polytetrafluorethylene (PTFE) content and increases with residual water. These effects are explained by the behavior of air, water, and PTFE in between the PTL fibers. It is also found that Toray papers of differing thickness exhibit different thermal conductivities.

High partial thermal conductivity of luminescence sites: a crucial factor for reducing the heat-induced lowering of the luminescence efficiency

2021 ◽  
Author(s):  
Ni Luo ◽  
Jing Xu ◽  
Xiyue Cheng ◽  
ZhenHua Li ◽  
Yidong Huang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stability ◽  
Practical Applications ◽  
Good Thermal Stability ◽  
The Past ◽  
Luminescence Efficiency ◽  
Thermal Stability Of

The good thermal stability of a phosphor is crucial for its practical applications. Unfortunately, in the past decades, only Gurney-Mott equation was available to describe the relation between the luminescence...

Measurement of Thermal Conductivity of a Flexible Substrate

2014 ◽  
Author(s):  
Vivek Vishwakarma ◽  
Ankur Jain
Keyword(s):  
Thermal Conductivity ◽  
Analytical Model ◽  
Flexible Substrate ◽  
Thermal Response ◽  
Experimental Methodology ◽  
Plastic Substrate ◽  
The Past ◽  
Thin Plastic ◽  
Transient Thermal ◽  
Transient Thermal Response

A number of past papers have described experimental techniques for measurement of thermal conductivity of substrates and thin films of technological interest. Nearly all substrates measured in the past are rigid. There is a lack of papers that report measurements on a flexible substrate such as thin plastic. The paper presents an experimental methodology to deposit a thin film microheater device on a plastic substrate. This device, comprising a microheater line and a temperature sensor line is used to measure the thermal conductivity of the plastic substrate using the transient thermal response of the plastic substrate to a heating current. An analytical model describing this thermal response is presented. Thermal conductivity of the plastic substrate is determined by comparison of experimental data with the analytical model. Results described in this paper may aid in development of an understanding of thermal transport in flexible substrates.

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