Liquid-Phase Sintering of Tungsten Carbide-Cobalt by Laser Radiation

Author(s):  
Thorsten Glaeser ◽  
Axel Demmer ◽  
Fritz Klocke

Laser Sintering is a powder metallurgical process. The principle of Laser Sintering is based on a local densification of powdered materials as a result of the absorption of laser radiation. Through a cyclic repetition of material application, densification and the lowering of a build-up plate, a three dimensional geometry develops. Within the Laser Sintering (liquid-phase sintering) of tungsten carbide-cobalt (WC-Co) the low melting material, the metal binder phase cobalt, is temporarily transferred into the liquid phase. The high melting WCphase is not melted and remains fine dispersed in the metal binder phase after cooling of the material.

2008 ◽  
Vol 55-57 ◽  
pp. 353-356
Author(s):  
Nawarat Wora-uaychai ◽  
Nuchthana Poolthong ◽  
Ruangdaj Tongsri

In this research, titanium carbide-nickel (TiC-Ni) composites, with tungsten carbide addition, were fabricated by using a powder metallurgy technique. The TiC-Ni mixtures containing between 0-15 wt. % tungsten carbide (WC), were compacted and then sintered at 1300°C and 1400°C, respectively. The phase formation and microstructure of the WC-added TiC-Ni composites have been investigated by X-ray diffraction and scanning electron microscopy techniques. Mechanical properties of these composites were assessed by an indentation technique. The X-ray diffraction patterns showed no evidence of tungsten rich phases in the sintered WC-added cermets. This indicates that during the sintering process, tungsten carbide particles were dissolved in metallic binder phase (Ni phase) via dissolution/re-precipitation process during liquid phase sintering. The liquid phase formed during sintering process could improve sinterability of TiC-based cermets i.e., it could lower sintering temperatures. The TiC-Ni composites typically exhibited a core-rim structure. The cores consisted of undissolved TiC particles enveloped by rims of (Ti, W)C solid solution phase. Hardness of TiC-Ni composites increased with WC content. Sintering temperature also had a slight effect on hardness values.


Metals ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 787
Author(s):  
Ernesto Chicardi ◽  
Francisco José Gotor Martínez

In this work, a titanium–tantalum carbonitride based cermet, with cobalt as the binder phase and boron as a sintering additive, was developed by a mechanically induced self-sustaining reaction process using two different methodologies. The boron additive was added to prevent the formation of brittle intermetallic compounds generally formed during the liquid phase sintering step due to the excessive ceramic dissolution into the molten binder phase. A systematic study was carried out to understand the effects of boron addition on the nature of the phases, microstructure, and mechanical properties of cermets. With the boron addition, the formation of two different boride solid solutions, i.e., (Ti,Ta)B2 and (Ti,Ta)3B4, was observed. Moreover, the nature of the binder was also modified, from the (Ti,Ta)Co2 brittle intermetallic compound (for cermets without boron addition) to ductile and tough (Ti,Ta)Co3 and α-Co phases (for cermets with boron addition). These modifications caused, as a general trend, the increase of hardness and toughness in cermets.


Author(s):  
Catherine Shearer

Integrated package technologies continue to be the dominant trend in the electronics packaging industry. In particular, heterogeneous integration of logic and memory or sensing is an enormous growth segment for both mobile electronics and IoT applications. In the mobile microprocessor segment of the field, the most advanced technologies will be implemented in the early adopter class. New package architectures and interconnect schemes will be vetted and implemented without significant cost pressure, performance is the driver. In the IoT segment and downstream mobile, however; lower cost alternatives to cutting edge packaging architectures are needed to drive market growth. Sintering pastes offer an opportunity to cost-effectively enable cutting edge 3D package capability for a wider variety of applications. In this paper we will explore the use of transient liquid phase sintering (TLPS) pastes in package-on-package (POP) schemes for integrated logic with memory or sensing functions in through mold via architectures. Through mold via technology has been well established in the industry and has significantly contributed to the adoption of three dimensional packaging architectures. The advantages of using TLPS pastes in similar structures will be detailed.


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