FIDOE: A Framework for Intelligent Distributed Ontologies in Engineering

2008 ◽  
Author(s):  
Paul Witherell ◽  
Sundar Krishnamurty ◽  
Ian R. Grosse ◽  
Jack Wileden
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Distributed Environment ◽  
Design Problems ◽  
Design Changes ◽  
Pcb Design ◽  
Common Domain ◽  
Distributed Process ◽  
Solid Foundation ◽  
Future Work

This paper presents FIDOE, a Framework for Intelligent Distributed Ontologies in Engineering. FIDOE consists of a suite of logic rules and templates for interactively developing relationships between properties of linked ontologies. The logical rules embedded in FIDOE automatically operate on various discipline-specific ontologies to systematically identify influences, direct and indirect, of proposed design modifications on other aspects of the design through common domain concepts. Once potential influences are identified, FIDOE enables the user to precisely define the domain relationships, using predefined templates, between the identified domain concepts that enumerate influence types. This tool, thus, provides a pervasive, real time awareness of the implications of design changes during the design process in a distributed environment. The application of FIDOE to distributed and multidisciplinary design problems is detailed with the aid of an industry-provided printed circuit board (PCB) design. Here, commonalities among indirectly connected domain ontologies (electrical, mechanical and thermal domains) are identified using the developed query method and subsequent relationships are defined. These relationships are then applied to provide a collaborative understanding and awareness of the distributed process, all while demonstrating the effectiveness of this approach. This awareness was successfully able to address some previously identified industry concerns, returning promising results while laying a solid foundation for future work.

Experimental Study on PCB Micro Drilling Force

2012 ◽  
Vol 246-247 ◽  
pp. 1017-1021 ◽  
Author(s):  
Feng Gong ◽  
Bai Qiang Chen ◽  
Ji Bin Li
Keyword(s):  
Experimental Study ◽  
Cutting Force ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Drilling Machine ◽  
Drilling Force ◽  
Printed Circuit ◽  
Market Competitiveness ◽  
Pcb Design ◽  
Micro Drilling

With the development of high density, multi-functions, miniaturization and multi-layer on printed circuit board (PCB) design, great challenges have been presented to the miniaturization of drilling on PCB. In order to meet the hole precision, quality and improve the performance, efficiency of mechanical drilling, further research should be done on the cutting state. Kistler high-precision micro-force platform was used in this paper to test and analyze the cutting force, investigate the general laws of micro drilling, and optimize the parameters for HANS PCB drilling machine. Thereby, to improve the efficiency and precision of the drilling, range of processing, and increasing market competitiveness.

Research of Reliable Design of Printed Circuit Board Suited for Smart Grid

2012 ◽  
Vol 229-231 ◽  
pp. 1503-1506
Author(s):  
Chuan Liu ◽  
Zai Chao Huang ◽  
Peng Wu ◽  
Zhi Gang Wu ◽  
Lei Chen
Keyword(s):  
Smart Grid ◽  
Communication System ◽  
Energy Demand ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Self Healing ◽  
Stage Of Development ◽  
Pcb Design ◽  
Smart Grid Communication

Electric utilities faced with the prospect of increasing customer rates are seeking solutions to challenges presented by rising global energy demand, aging infrastructure, increasing fuel costs and renewable portfolio standards in light of climate change. Many consider Smart Grid to be one such solution. The most two significant characteristics of Smart Grid are self-healing ability and high reliability. As the bottom stage of development of Smart Grid communication system, the signal quality and self reliability of PCB design directly influence the entire performance of the communication system. This article focuses on analyzing reliable PCB design suited for Smart Grid communication system from power supply, thermal dispersion and trace routing.

scholarly journals The Development of a Modified Design Chain Operations Reference Model in New Product Development of the Printed Circuit Board: A Case Study

2020 ◽  
Vol 10 (11) ◽  
pp. 3703
Author(s):  
Ping-Shun Chen ◽  
Jimmy Ching-Ming Chen ◽  
Wen-Tso Huang ◽  
Li-Yin Kuo
Keyword(s):  
Product Development ◽  
New Product Development ◽  
Printed Circuit Board ◽  
Reference Model ◽  
New Product ◽  
Circuit Board ◽  
Future Research ◽  
Printed Circuit ◽  
Design Chain ◽  
Pcb Design

New product development (NPD) is a process of interactions among multiple parties. With stronger competition in the electronic product market, reducing NPD cycle time has become a common important subject in the information technology (IT) industry. The main topic of this research is process improvements in the research and development (R&D) department of the case company by studying how product competitiveness can be enhanced in the current rapid proceeding technology industry. The process-oriented and hierarchical structure is used to analyze the processes of a new printed circuit board (PCB) design and test, and then a modified design chain operations reference (DCOR) model is introduced to explore problems and suggest corresponding solutions. This research also specifies a clear design chain structure for the case firm and improves its R&D process by brainstorming. The goal is to increase the case firm’s PCB design chain efficiency by shortening the delivery time and reducing the problems of risks arising during the NPD. Finally, this research reviews the essence of the design chain management, draws conclusions, and points out directions for future research.

scholarly journals Development of Op-Amp Based Piezoelectric Rectifier for Low Power Energy Harvesting Applications

2018 ◽  
Vol 150 ◽  
pp. 01012
Author(s):  
Muhamad Syazmie Bin Sepeeh ◽  
Farahiyah Binti Mustafa ◽  
Anis Maisarah Binti Mohd Asry ◽  
Sy Yi Sim ◽  
Mastura Shafinaz Binti Zainal Abidin
Keyword(s):  
Energy Harvesting ◽  
Printed Circuit Board ◽  
Input Voltage ◽  
Circuit Board ◽  
Op Amp ◽  
Full Wave ◽  
Piezoelectric Energy ◽  
Half Wave ◽  
Future Work ◽  
Piezoelectric Devices

In this study, the development of operational amplifier (op-amp) based rectifier for piezoelectric energy harvesting applications was studied. The two stage op-amp full wave rectifier was used to convert the AC signal to DC signal voltage received by piezoelectric devices. The inverted half wave rectifier integrated with full wave rectifier were designed and simulated using MultiSIM software. The circuit was then fabricated onto a printed circuit board (PCB), using standard fabrication process. The achievement of this rectifier was able to boost up the maximum voltage of 5 V for input voltage of 800 mV. The output of the rectifier was in DC signal after the rectification by the op-amp. In term of power, the power dissipation was reduced consequently the waste power decreases. Future work includes optimization of the rectifying circuit to operate more efficiently can be made to increase the efficiency of the devices.

scholarly journals Modified Power Factor Correction (PFC) Control and Printed Circuit Board (PCB) Design for High-Efficiency and High-Power Density On-Board Charger

Energies ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 605
Author(s):  
Jaeil Baek ◽  
Moo-Hyun Park ◽  
Taewoo Kim ◽  
Han-Shin Youn
Keyword(s):  
Power Density ◽  
Power Factor ◽  
High Power ◽  
Printed Circuit Board ◽  
High Efficiency ◽  
Power Factor Correction ◽  
Circuit Board ◽  
High Power Density ◽  
Printed Circuit ◽  
Pcb Design

This paper presents a modified power factor correction (PFC) ON/OFF control and three-dimensional (3D) printed circuit board (PCB) design for a high-efficiency and high-power density onboard charger (OBC). By alternately operating one of two boost modules of the PFC stage at a 50% or less load condition, the proposed PFC control can reduce the load-independent power loss of the PFC stage, such as core loss and capacitor charging loss of switches. It enables OBCs to have high efficiency across a wide output power range and better thermal performance. The 3D-PCB design decouples a trade-off relationship of the PCB trace design and heat spreader design, increasing the power density of OBCs. A 3.3 kW prototype composed of an interleaved totem-pole bridgeless boost PFC converter and full-bridge (FB) LLC converter has been built and tested to verify the proposed PFC control and 3D-PCB effectiveness design. The prototype has 95.7% full power efficiency (98.2% PFC stage efficiency) and 52 W/in3 power density.

scholarly journals DRY FILM PHOTORESIST APPLICATION TO A PRINTED CIRCUIT BOARD (PCB) USING A MASKLESS PHOTOLITHOGRAPHY METHOD

2020 ◽  
Author(s):  
Dedi Suwandi
Keyword(s):  
Blue Light ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Digital Light Processing ◽  
Pcb Design ◽  
Projector Lamp ◽  
Light Color ◽  
Dry Film ◽  
Dry Film Photoresist ◽  
Pcb Routing

This paper offers an alternative method of making PCB routing using a negative dry film photoresist and a maskless photolithography method. The objective of this research is to determine the correct parameters for the process of making PCB design easier, cheaper and safer.Electronic circuit design was created on a laptop or PC using Autodesk EAGLE software with a combination of result is black and blue light color. PCB routing design was inserted into a PowerPoint slide to display on a commercial Digital Light Processing (DLP) projector. Nomodifications were made to a projector, which was mounted directly on a stand with a downwardfacing position. The projector lamp replaced an ultraviolet or X-ray source during the exposureprocess, exposing PCB coated in negative dry film photoresist. After the exposure process, the PCB was inserted into the developer solution, causing the blue light irradiated part to remain while the blackened sections dissolved. The PCB was then added to an etching solution to scrape the copper unprotected by the photoresist. The PCB was finally soaked in a remover solution to remove the photoresist. Once complete, the process generated a laptop-designed PCB routing. Electrical lines can be created using this method with a size of 100 µm and a lane edge deviation of 5 µm. The goal of research to make PCB routing cheaper, easier and safer was achieved. Evidenced by the installation of electronic components and then tested, the results are all components function well.

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