Automated Hybrid Analysis of Surface Mounted Electronic Assemblies

1990 ◽  
Author(s):  
Tin-Lup Wong ◽  
Junshi Wang ◽  
Karl K. Stevens
Keyword(s):  
Printed Circuit Board ◽  
Optimization Theory ◽  
Analytical Techniques ◽  
Automated Analysis ◽  
Circuit Board ◽  
Analysis Approach ◽  
Loading Conditions ◽  
Hybrid Analysis ◽  
Method Optimization ◽  
Electronic Assemblies

Abstract Simulations of surface mounted electronic assemblies under general mechanical loading conditions have been performed using an hybrid analytical/experimental analysis approach. This method combines analytical techniques with experimentally determined load-deformation characteristics of the surface-mounted assemblies to predict loadings and deformations of the assemblies. An automated analysis procedure which integrated the finite element method, optimization theory and the hybrid analysis approach was developed. This procedure can be used to study the strength of the surface mounted devices located anywhere on a printed circuit board subjected to the specified loading conditions.

Automated Hybrid Analysis of Surface Mounted Electronic Assemblies

1993 ◽  
Vol 115 (3) ◽  
pp. 435-440
Author(s):  
T.-L. Wong ◽  
J. Wang ◽  
K. K. Stevens
Keyword(s):  
Printed Circuit Board ◽  
Optimization Theory ◽  
Analytical Techniques ◽  
Automated Analysis ◽  
Circuit Board ◽  
Analysis Approach ◽  
Loading Conditions ◽  
Hybrid Analysis ◽  
Method Optimization ◽  
Electronic Assemblies

Simulations of surface mounted electronic assemblies under general mechanical loading conditions have been performed using an hybrid analytical/experimental analysis approach. This method combines analytical techniques with experimentally determined load-deformation characteristics of the surface-mounted assemblies to predict loadings and deformations of the assemblies. An automated analysis procedure which integrated the finite element method, optimization theory, and the hybrid analysis approach was developed. This procedure can be used to study the strength of surface mounted devices located anywhere on a printed circuit board subjected to specified loading conditions.

Surface temperature of electronic assemblies equipped with tilted and low-powered QFN64 subjected to free convection

2017 ◽  
Vol 27 (6) ◽  
pp. 1304-1310 ◽  
Author(s):  
Abderrahmane Baïri ◽  
Clara Ortega Hermoso ◽  
David San Martén Ortega ◽  
Iken Baïri ◽  
Zsolt Peter
Keyword(s):  
Surface Temperature ◽  
Inclination Angle ◽  
Printed Circuit Board ◽  
Electronic Device ◽  
Thermal Design ◽  
Circuit Board ◽  
Content Type ◽  
Printed Circuit ◽  
Volume Method ◽  
Electronic Assemblies

Purpose This work deals with the case of the quad flat non-lead 64 (QFN64) electronic package generating a low power range ranging from 0.01 to 0.1W. It is installed on one side of a printed circuit board (PCB) that can be inclined relative to the horizontal plane with an angle varying between 0° and 90° (horizontal and vertical positions, respectively). The surface temperature of the electronic assembly is subjected to air natural convection. Design/methodology/approach Calculations are done by means of the finite volume method for many configurations obtained by varying the generated power and the inclination angle. Findings The distribution of the surface temperature is determined on all the assembly areas (QFN and PCB). The study shows that the thermal behaviour of the electronic device is influenced by the generated power and the inclination angle. The 3D numerical survey leads to correlations allowing calculation of the average surface temperature in any part of the assembly, according to the power generated by the QFN64 and the inclination angle. Originality/value The proposed accurate correlations are original and unpublished. They optimize the thermal design of the electronic QFN64 package, which is increasingly used in many engineering fields.

Novel formaldehyde-free electroless copper for plating on next-generation substrates

2018 ◽  
Vol 2018 (1) ◽  
pp. 000628-000633
Author(s):  
Christian Wendeln ◽  
Edith Steinhäuser ◽  
Lutz Stamp ◽  
Bexy Dosse-Gomez ◽  
Elisa Langhammer ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Analytical Techniques ◽  
Circuit Board ◽  
Next Generation ◽  
Production Scale ◽  
Copper Electrolyte ◽  
Xrf Scanning ◽  
Electroless Copper ◽  
New Type ◽  
Electrical Reliability

Abstract This work describes a new type of formaldehyde-free electroless copper electrolyte that can be used for a broad set of applications and materials, especially for the processing of next-generation substrates. The plating solution was successfully applied in both, a laboratory and production-scale environment. The results have been evaluated in detail and were benchmarked against a formaldehyde-based reference. A characterization of the obtained metal films was carried out by different analytical techniques, including microscopy, X-ray fluorescence (XRF), scanning electron microscopy (SEM), adhesion tests and non-blister verification. Additionally, studies concerning chemical bath stability, throwing power and electrical reliability have been made. Based on the obtained data we believe that the current achievements represent a suitable technology to replace formaldehyde in existing printed circuit board (PCB) production without loss of process performance and thus provide a sustainable “green” alternative to the industry.

Statistical Analysis Approach to Improve the High Speed Signal Quality by Including the Manufacturing Process Variations of Printed Circuit Board

2010 ◽  
Vol 2010 (1) ◽  
pp. 000428-000433
Author(s):  
Seungyong Baek ◽  
Mike Sapozhnikov ◽  
Warren Meggitt ◽  
Philip Pun ◽  
Jason Visneski ◽  
...  
Keyword(s):  
Statistical Analysis ◽  
High Speed ◽  
Printed Circuit Board ◽  
Mode Conversion ◽  
Process Variation ◽  
Process Variations ◽  
Sensitivity Coefficient ◽  
Circuit Board ◽  
Analysis Approach ◽  
S Parameter

In this paper, we propose a statistical analysis approach to consider the contributions across wide process variation permutations. The methodology is applied to a chip-to-connector high speed differential channel design for a multi-layer PCB. In addition, the contribution factor of each process variation parameter can be determined by the use of a sensitivity analysis. The DOE can be significantly reduced by over 50,000X using the Taguchi method reduction to 27. Finally, we acquire the sensitivity coefficient of each process variation parameters and probability distribution function of differential impedance, insertion loss, return loss and mode-conversion. And ±3σ impedance values were calculated and the statistical s-parameters are plotted. From these results, we can increase the confidence level of correlation between simulation and measurement because the proposed approach let us know the trend of variation of impedance and s-parameter by process variation.

Electrochemical behavior of metal interconnects in electronic assemblies

2008 ◽  
Vol 23 (10) ◽  
pp. 2622-2629 ◽  
Author(s):  
Ling Chunxian Zou ◽  
Christopher Hunt
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Lead Free ◽  
Nacl Solution ◽  
Active Dissolution ◽  
Printed Circuit ◽  
Dry Conditions ◽  
Corrosion Behaviors ◽  
Metal Interconnects ◽  
Electronic Assemblies

The electrochemical and corrosion behaviors of solder alloys—SnAgCu (SAC), SnZnBi, SnPb, and Sn—and printed circuit board finish materials Cu and AuNi were investigated in carboxylic acids (flux) and NaCl solutions using the potentiodynamic scanning technique. The results show that SAC and Sn are passivated in the diluted flux solution, but SnPb, SnZnBi, Cu, and AuNi are under active dissolution when anodically polarized. However, passivation of SAC alloy is not observed in concentrated flux solution. Although a passive film forms on SAC in a 2% NaCl solution, the film is less stable than in the flux solution. In addition, oxidation of the most commonly used lead-free and lead solders, SAC and SnPb, at high temperature was evaluated via sequential electrochemical reduction analysis (SERA). The SERA results revealed that the SAC alloy oxidized more significantly than SnPb under hot, dry conditions.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

DIDACTIC MODEL OF LIFT

2018 ◽  
pp. 219-224
Author(s):  
Lubica Miková
Keyword(s):  
Printed Circuit Board ◽  
Base Plate ◽  
Educational Process ◽  
Circuit Board ◽  
Basic Knowledge ◽  
Practical Training ◽  
Target Setting ◽  
Lower Base ◽  
Complex Design ◽  
Starting Point

Urgency of the research. Mechatronics products become more sophisticated and complicated. Mechatronic engineers should be prepared for this complex design process. Practical experimental model helps improve educational process as preparing for practice. Target setting. Miniaturized model of the lift suitable for practical training on subjects focused to microcontrollers, sen-sors, actuators etc. Students have possibility to make practice on laboratory exercises, where they can verify theoretical knowledge obtained on lectures. The arrangement of the model has modular character, because of possibility to rearrange or adding of new function into model. The aim was to create minimized model of real lift with all functions and systems. Actual scientific researches and issues analysis. Many universities are oriented only to finished robotic kits and do not support creativity of students. Open access and open structure model missing in this field. There is a need for fast prototyping model, which allows the creation of new design of product. Uninvestigated parts of general matters defining. The question of the design of printed circuit board are uninvestigated, because they need more time than allows normal exercises. The research objective. The main aim of educational process is to educate engineers with basic knowledge, skills and handicraft. Practical models help as support devices for fulfil of this aim. All mechatronic students can practice a training on these practical models. They become as more skilled and well-oriented engineers.. The statement of basic materials. Construction consist of upper and lower base plate connected with four pillars used as linear guide for moving of lift cage. Lower base plate includes base microcontrollers boards, resistor network, power transis-tor array board, power supply terminals, relay modules, PWM module and signals terminals. Upper base plate consist of DC motor with gearing and screw mechanism for moving the lift cage. Conclusions. The model enables supports the creativity of the students. The starting point of the using of the model can be without any wired connections. Students should connect every part and try functionality of every function. The students receive the defined several problems and they have to analyze it and make any proposal for solution of defined problems.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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