A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

1999 ◽  
Vol 122 (2) ◽  
pp. 147-151 ◽  
Author(s):  
Adam Kuhl ◽  
Jianmin Qu
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Adhesive Systems ◽  
Adhesive Material ◽  
Element Analysis ◽  
Interfacial Toughness ◽  
Loading Direction ◽  
Wide Range ◽  
Phase Angles

An experimental technique using sandwiched Brazil-nut specimens to quantitatively characterize interfacial fracture toughness over a wide range of phase angles is presented. Specimens are made by sandwiching a thin layer of adhesive material between two metal substrates. Tensile loads are applied to the specimens at various loading angles. Through the use of fracture mechanics and finite element analysis, interfacial fracture toughness as a function of loading phase angle is determined from the experimentally obtained critical load and loading direction. The fracture toughness curves for several different Cu/adhesive systems are obtained. [S1043-7398(00)00302-9]

scholarly journals Solutions and Discussions of thin film Undergoing the Nonlinear Peeling

2003 ◽  
Vol 795 ◽  
Author(s):  
Yueguang Wei ◽  
Siqi Shu ◽  
Ying Du LNM
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Effective Strain ◽  
Slope Angle ◽  
Interfacial Crack ◽  
Crack Tip ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Element Analysis ◽  
Von Mises

ABSTRACTBased on the bending model, three double-parameter criteria characterizing thin film peeling process are introduced and analyzed in detail. Three double-parameter criteria include: (1) the interfacial fracture toughness and the separation strength, (2) the interfacial fracture toughness and the interfacial crack tip slope angle of thin film, and (3) the interfacial fracture toughness and the critical von Mises effective strain of thin film at crack tip. Based on the three double-parameter criteria, the thin film nonlinear peeling problems are solved analytically for each case. The results show that the solutions of thin film nonlinear peeling based on the bending model are very sensitive to the model parameter selections. Through analyses and comparisons for different solutions, a connection between solutions based on the bending models and based on the two-dimensional elastic-plastic finite element analysis is obtained.

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

2002 ◽  
Vol 124 (2) ◽  
pp. 106-110 ◽  
Author(s):  
Timothy Ferguson ◽  
Jianmin Qu
Keyword(s):  
Fracture Toughness ◽  
Interfacial Adhesion ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Interfacial Toughness ◽  
Solder Mask ◽  
Effect Of Moisture ◽  
Point Bend ◽  
Four Point Bend Test

Moisture poses a significant threat to the reliability of microelectronic assemblies and can be attributed as being the principal cause of many premature package failures. Of particular concern is characterizing the role of moisture with respect to the acceleration of the onset of package delamination. In this paper the effect of moisture on the interfacial fracture toughness of two no-flow underfill materials with a commercially available solder mask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four-point bend test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85°C/85%RH for 725 hours. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture.

scholarly journals Apparent Interfacial Fracture Toughness of Resin/Ceramic Systems

2006 ◽  
Vol 85 (11) ◽  
pp. 1037-1041 ◽  
Author(s):  
A. Della Bona ◽  
K.J. Anusavice ◽  
J.J. Mecholsky
Keyword(s):  
Fracture Toughness ◽  
Fracture Mechanics ◽  
Interfacial Fracture ◽  
Crack Size ◽  
Interfacial Fracture Toughness ◽  
Critical Crack ◽  
Interfacial Toughness ◽  
Microtensile Test ◽  
Ceramic Microstructure ◽  
Critical Crack Size

We suggest that the apparent interfacial fracture toughness (KA) may be estimated by fracture mechanics and fractography. This study tested the hypothesis that the KA of the adhesion zone of resin/ceramic systems is affected by the ceramic microstructure. Lithia disilicate-based (Empress2-E2) and leucite-based (Empress-E1) ceramics were surface-treated with hydrofluoric acid (HF) and/or silane (S), followed by an adhesive resin. Microtensile test specimens (n = 30; area of 1 ± 0.01 mm2) were indented (9.8 N) at the interface and loaded to failure in tension. We used tensile strength (σ) and the critical crack size (c) to calculate KA (KA = Yσc1/2) (Y = 1.65). ANOVA and Weibull analyses were used for statistical analyses. Mean KA (MPa·m1/2) values were: (E1HF) 0.26 ± 0.06; (E1S) 0.23 ± 0.06; (E1HFS) 0.30 ± 0.06; (E2HF) 0.31 ± 0.06; (E2S) 0.13 ± 0.05; and (E2HFS) 0.41 ± 0.07. All fractures originated from indentation sites. Estimation of interfacial toughness was feasible by fracture mechanics and fractography. The KA for the systems tested was affected by the ceramic microstructure and surface treatment.

Interfacial Fracture Toughness for Film on Substrate Determined by Indentation Method

2007 ◽  
Vol 345-346 ◽  
pp. 801-804
Author(s):  
Soo Hyun Lee ◽  
Jink Wang Kim ◽  
Su Nam Kim ◽  
Sang Bong Cho ◽  
Jon Do Yun
Keyword(s):  
Fracture Toughness ◽  
Tensile Testing ◽  
Interfacial Fracture ◽  
Interface Fracture ◽  
Interfacial Fracture Toughness ◽  
Indentation Method ◽  
Element Analysis ◽  
Fracture Toughness Measurement ◽  
Interface Fracture Toughness ◽  
Toughness Measurement

Indentation method was used to determine the interfacial fracture toughness of epoxy coating on aluminum substrate. Tensile testing followed by finite element analysis was also performed to determine the interface fracture toughness. Fracture toughness values determined by two methods were consistent, giving reliability to indentation method for interfacial fracture toughness measurement.

scholarly journals Evaluation of the Interfacial Fracture Toughness of Anodic Bonds

2007 ◽  
Vol 73 (735) ◽  
pp. 1266-1272 ◽  
Author(s):  
Yoshiaki NOMURA ◽  
Masaki NAGAI ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness
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