Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model
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Based on experimental data, a simple R–C (thermal resistance–heat capacitance) model with software precaution strategies are proposed in this paper to predict the steady-state temperature of the circuit in an electronic packaging in real time. Further developments on the new methodology lead to real time monitoring if input power and/or the environment are changing during operations. It is concluded that the new methodologies, which make the over-temperature prediction much more reliable, efficient, sensible, and faster, can be easily employed for over-temperature protection designs on electronic packaging. [S1043-7398(00)00301-7]
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2016 ◽
Vol 745
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pp. 032095
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1985 ◽
Vol 248
(5)
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pp. C498-C509
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