Mini-Channel Liquid Cooling System for Improving Heat Transfer Capacity and Thermal Uniformity in Battery Packs for Electric Vehicles

2021 ◽  
Vol 18 (3) ◽  
Author(s):  
Congbo Li ◽  
Yongsheng Li ◽  
Sanjay Srinivaas ◽  
Jinwen Zhang ◽  
Shiyang Qu ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Cooling Water ◽  
Channel Structure ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Liquid Cooling ◽  
Temperature Deviation ◽  
Battery Packs ◽  
Heat Transfer Capacity

Abstract Temperature is a significant factor affecting performance and safety of energy storage systems such as battery packs. How to design a reliable battery thermal management system (BTMS) is still a hot issue at present. Most of the past researches have focused on methods of reducing temperature rise. This paper mainly studies how to reduce the temperature deviation of the battery pack while ensuring heat dissipation conditions. This paper designs a mini-channel liquid cooling BTMS with a side cover to improve heat transfer capacity and thermal uniformity in battery packs. By analyzing different side cover materials, cooling water temperature, and water channel structure, the influence of different parameters on battery heat dissipation and uniformity is obtained. The main findings are: (1) the presence of the side cover can effectively reduce the maximum temperature and temperature deviation, and the material with high thermal conductivity is more likely to dissipate heat, (2) The increase of cooling water inlet temperature can improve temperature uniformity, and (3) When the cross-sectional area is fixed, as the channel depth increases, the temperature deviation gradually decreases.

scholarly journals Analysis on the Influence Mechanism of Cooling Water on Turbocharger and Optimum Coolant Mass Flow Rate Intelligent Prediction

2021 ◽  
Vol 2021 ◽  
pp. 1-14
Author(s):  
Chunping Lu ◽  
Jianyu Li ◽  
Dongli Tan
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Gasoline Engine ◽  
Cooling Water ◽  
Test Method ◽  
Inlet Temperature ◽  
Wall Roughness ◽  
Engine Exhaust ◽  
Cooling Performance ◽  
Water Chamber

Due to the high speed and high temperature of engine exhaust, the turbocharger bears very high heat load. The heat dissipation of turbocharger is an important factor to determine the service life and performance of turbocharger. In this paper, a mathematical model of the fluid-structure interaction heat transfer of the water-cooled bearing body of turbocharger was established and the cooling performance of a 1.8 L gasoline engine turbocharger was analyzed. The effects of cooling water inlet flow, engine exhaust temperature, cooling water inlet temperature, and wall roughness of cooling water chamber on the cooling performance of important parts of the bearing body were analyzed by the numerical simulation method. In addition, the cooling water flow required by bearing body with a different structure under different working conditions was studied based on the orthogonal test method. The predicted result shows a good agreement with the experiment result, which could provide a reference for relevant production design and cooling strategy. In the range larger than the thickness of laminar flow bottom layer of the cooling water chamber wall, the increase of wall roughness height can enhance the heat transfer between the fluid and the solid.

Channel Size Optimization for 3D-IC Integrated Interlayer Microchannel Liquid Cooling

2016 ◽  
Author(s):  
D. D. Ma ◽  
G. D. Xia ◽  
W. Wang ◽  
X. F. Li ◽  
Y. T. Jia
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Rectangular Channel ◽  
Channel Structure ◽  
Maximum Temperature ◽  
Liquid Cooling ◽  
3D Ic ◽  
Flow Rates ◽  
Multi Objective ◽  
Contraction Ratio

3D-IC is getting increasingly attractive, as it improves speed and frequency, and reduces power consumption, noise and latency. However, three dimension (3D) integration technologies bring a new serious challenge to chip thermal management with the power density increased exponentially. Interlayer microchannel liquid cooling is thought as a promising and scalable solution for cooling high heat flux 3D-IC. In this paper, firstly channel number, channel width and height parameters of rectangular channel are optimized by the method of multi-objective parameter optimization under given overall size of 5mm in length and 5mm in width. The results show the total thermal resistances can reach very small under individual constraint condition of volume flow rates, but the pressure drop is too larger to accept. The minimum thermal resistance structure can be got by multi-objective optimization at various constraint conditions. It is found that the channel height and width increase with increasing of flow rates at pumping power less than 0.1W and pressure drop less than 20kPa. Secondly, the zigzag channels are designed on the basis of the optimized rectangular channel structure. The expansion and contraction ratio as an important parameter is optimized by numerical simulation. The thermal enhancement factor and Nusselt number measure the comprehensive performances of heat transfer. The results show heat transfer characteristic is enhanced with the decreasing of expansion and contraction ratio. Besides, the maximum junction temperature and maximum temperature difference are also reduced. 3D-IC with wave channel of β=3/7 is more promising for interlayer cooling.

A Numerical Study on Conjugate Heat Transfer for Supercritical CO2 Turbine Blade With Cooling Channels

2020 ◽  
Author(s):  
Akshay Khadse ◽  
Andres Curbelo ◽  
Ladislav Vesely ◽  
Jayanta S. Kapat
Keyword(s):  
Heat Transfer ◽  
Turbine Blade ◽  
Gas Turbines ◽  
Supercritical Co2 ◽  
Conjugate Heat Transfer ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Cooling Channels ◽  
Blade Cooling ◽  
Turbine Inlet

Abstract The first stage of turbine in a Brayton cycle faces the maximum temperature in the cycle. This maximum temperature may exceed creep temperature limit or even melting temperature of the blade material. Therefore, it becomes an absolute necessity to implement blade cooling to prevent them from structural damage. Turbine inlet temperatures for oxy-combustion supercritical CO2 (sCO2) are promised to reach blade material limit in near future foreseeing need of turbine blade cooling. Properties of sCO2 and the cycle parameters can make Reynolds number external to blade and external heat transfer coefficient to be significantly higher than those typically experience in regular gas turbines. This necessitates evaluation and rethinking of the internal cooling techniques to be adopted. The purpose of this paper is to investigate conjugate heat transfer effects within a first stage vane cascade of a sCO2 turbine. This study can help understand cooling requirements which include mass flow rate of leakage coolant sCO2 and geometry of cooling channels. Estimations can also be made if the cooling channels alone are enough for blade cooling or there is need for more cooling techniques such as film cooling, impingement cooling and trailing edge cooling. The conjugate heat transfer and aerodynamic analysis of a turbine cascade is carried out using STAR CCM+. The turbine inlet temperature of 1350K and 1775 K is considered for the study considering future potential needs. Thermo-physical properties of this mixture are given as input to the code in form of tables using REFPROP database. The blade material considered is Inconel 718.

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Ki Wook Jung ◽  
Eunho Cho ◽  
Hyoungsoon Lee ◽  
Chirag Kharangate ◽  
Feng Zhou ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Single Phase ◽  
Flow Instability ◽  
Heated Surface ◽  
Heat Fluxes ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Fluid Temperature ◽  
Ir Camera

Abstract High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in two-dimensional (2D) plane. Utilizing direct “embedded cooling” strategy in combination with top access three-dimensional (3D) manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. This study presents the experimental results for single-phase thermofluidic performance of an embedded silicon microchannel cold plate (CP) bonded to a 3D manifold for heat fluxes up to 300 W/cm2 using single-phase R-245fa. The heat exchanger consists of a 5 × 5 mm2 heated area with 25 parallel 75 × 150 μm2 microchannels, where the fluid is distributed by a 3D-manifold with four microconduits of 700 × 250 μm2. Heat is applied to the silicon heat sink using electrical Joule-heating in a metal serpentine bridge and the heated surface temperature is monitored in real-time by infrared (IR) camera and electrical resistance thermometry. The maximum and average temperatures of the chip, pressure drop, thermal resistance, and average heat transfer coefficient (HTC) are reported for flow rates of 0.1, 0.2. 0.3, and 0.37 L/min and heat fluxes from 25 to 300 W/cm2. The proposed embedded microchannels-3D manifold cooler, or EMMC, device is capable of removing 300 W/cm2 at maximum temperature 80 °C with pressure drop of less than 30 kPa, where the flow rate, inlet temperature, and pressures are 0.37 L/min, 25 °C and 350 kPa, respectively. The experimental uncertainties of the test results are estimated, and the uncertainties are the highest for heat fluxes < 50 W/cm2 due to difficulty in precisely measuring the fluid temperature at the inlet and outlet of the microcooler.

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

2019 ◽  
Author(s):  
Ki Wook Jung ◽  
Hyoungsoon Lee ◽  
Chirag Kharangate ◽  
Feng Zhou ◽  
Mehdi Asheghi ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Pressure Drop ◽  
Single Phase ◽  
Heat Fluxes ◽  
Experimental Results ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Fluid Temperature ◽  
Ir Camera

Abstract High performance and economically viable thermal cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in 2D-plane. Utilizing direct “embedded cooling” strategy in combination with top access 3D-manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. Here, we present the experimental results for single-phase thermofluidic performance of an embedded silicon microchannel cold-plate bonded to a 3D manifold for heat fluxes up to 300 W/cm2 using single-phase R-245fa. The heat exchanger consists of a 52 mm2 heated area with 25 parallel 75 × 150 μm2 microchannels, where the fluid is distributed by a 3D-manifold with 4 micro-conduits of 700 × 250 μm2. Heat is applied to the silicon heat sink using electrical Joule-heating in a metal serpentine bridge and the heated surface temperature is monitored in real-time by Infra-red (IR) camera and electrical resistance thermometry. The experimental results for maximum and average temperatures of the chip, pressure drop, thermal resistance, average heat transfer coefficient for flow rates of 0.1, 0.2. 0.3 and 0.37 lit/min and heat fluxes from 25 to 300 W/cm2 are reported. The proposed Embedded Microchannels-3D Manifold Cooler, or EMMC, device is capable of removing 300 W/cm2 at maximum temperature 80 °C with pressure drop of less than 30 kPa, where the flow rate, inlet temperature and pressures are 0.37 lit/min, 25 °C and 350 kPa, respectively. The experimental uncertainties of the test results are estimated, and the uncertainties are the highest for heat fluxes < 50 W/cm2 due to difficulty in precisely measuring the fluid temperature at the inlet and outlet of the micro-cooler.

Effect of Mass Flow Rate on Dryer Room Radiator Pressure Drop and Heat Transfer

2016 ◽  
Vol 836 ◽  
pp. 102-108
Author(s):  
Mirmanto ◽  
Emmy Dyah Sulistyowati ◽  
I Ketut Okariawan
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Mass Flow Rate ◽  
Mass Flow ◽  
Flow Rate ◽  
Electrical Power ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Mass Flow Rates ◽  
Room Model

In the rainy season, in tropical countries, to dry stuffs is difficult. Using electrical power or fossil energy is an expensive way. Therefore, it is wise to utilize heat waste. A device that can be used for this purpose is called radiator. The effect of mass flow rate on pressure drop and heat transfer for a dryer room radiator have been experimentally investigated. The room model size was 1000 mm x 1000 mm x 1000 mm made of plywood and the overall radiator dimension was 360 mm x 220 mm x 50 mm made of copper pipes with aluminium fins. Three mass flow rates were investigated namely 12.5 g/s, 14 g/s and 16.5 g/s. The water temperature at the entrance was increased gradually and then kept at 80°C. The maximum temperature reached in the dryer room was 50°C which was at the point just above the radiator. The effect of the mass flow rate on the room temperature was insignificant, while the effect on the pressure drop was significant. Moreover, the pressure drop decreased as the inlet temperature increased. In general, the radiator is recommended to be used as the heat source in a dryer room.

Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling

2012 ◽  
Author(s):  
Gongnan Xie ◽  
Yanquan Liu ◽  
Bengt Sunden ◽  
Weihong Zhang ◽  
Jun Zhao
Keyword(s):  
Heat Transfer ◽  
Double Layer ◽  
Pressure Loss ◽  
Heat Dissipation ◽  
Thermal Characteristics ◽  
Parallel Flow ◽  
Air Cooling ◽  
Pumping Power ◽  
Liquid Cooling ◽  
Counter Flow

The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to manage the increase of the dissipated heat. The traditional air-cooling may not meet the requirements, and therefore a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid, but these microchannels are often designed to be single-layer channels. In this paper, the laminar heat transfer and pressure loss in a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flowrates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics, and the parallel-flow layout is found to be better for heat dissipation when the pumping power is limited, while the counter-flow layout is better when a high pumping power is provided.

Improved Heat Dissipation Capability on Electronic Motor Control Devices

2005 ◽  
Author(s):  
Wei Tong
Keyword(s):  
Heat Transfer ◽  
Motor Control ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Vortex Generators ◽  
Maximum Temperature ◽  
Complex Heat Transfer ◽  
Pin Fins ◽  
Control Devices

Heat sinks have been widely used in electronic industry to maintain the operation temperatures of electronic devices lower than their allowable values and thus are often critical to the device performance and life. However, it is difficult to design heat sinks to satisfy all design specifications optimally under complex heat transfer phenomena. The present work discloses a new design of heat sinks to improve heat dissipation capability for electric motor control devices. The heat sink contains a plurality of raindrop-shaped pin fins, acting as vortex generators to increase the rate of heat transfer and in turn, to increase the cooling efficiency of the heat sinks. Numerical results have shown that with the new designed heat sinks, the maximum temperature can reduce about 30% over the conventional heat sinks.

Thermal Management of a Li-Ion Battery for Electric Vehicles Using PCM and Water-Cooling Board

2019 ◽  
Vol 814 ◽  
pp. 307-313
Author(s):  
Gu Yu Yu ◽  
Sum Wai Chiang ◽  
Wei Chen ◽  
Hong Da Du
Keyword(s):  
Thermal Management ◽  
Heat Dissipation ◽  
Cooling Water ◽  
Optimum Operating ◽  
Maximum Temperature ◽  
Li Ion Battery ◽  
Optimum Operating Temperature ◽  
Maximum Temperature Difference ◽  
Li Ion ◽  
Battery Module

A novel thermal management system (TMS) for Li-ion battery module using phase change material (PCM) and cooling water as the heat dissipation source to control battery temperature rise has been developed. Graphite sheets were applied to compensate low thermal conductivity of battery and PCM and improve temperature uniformity of the batteries. One discharge (1C rate)-charge (2C rate) circle was applied in battery modules to test the effectiveness of this TMS. A three dimensional numerical model of the battery module with the TMS was conducted. The results show that this TMS basically meets the demand about the maximum temperature difference of battery module and totally keeps the maximum temperature within the optimum operating temperature range (≤45°C).

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