scholarly journals A Review On Transient Thermal Management of Electronic Devices

2021 ◽  
Author(s):  
John Mathew ◽  
Shankar Krishnan
Keyword(s):  
Thermal Management ◽  
Laser Diode ◽  
High Power ◽  
Electronic Devices ◽  
Thermal Response ◽  
Heat Pipes ◽  
Design Guidelines ◽  
Thermal Design ◽  
Laser Diode Arrays ◽  
Transient Thermal

Abstract Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

High Power Laser Diode Arrays for Pumping Solid State Laser and Pumping Characteristics

1996 ◽  
Vol 24 (Supplement) ◽  
pp. 85-88
Author(s):  
H. Kan ◽  
T. Kanzaki ◽  
H. Miyajima ◽  
Y. Ito ◽  
K. Matsui ◽  
...  
Keyword(s):  
Solid State ◽  
Laser Diode ◽  
High Power ◽  
Solid State Laser ◽  
High Power Laser ◽  
Power Laser ◽  
State Laser ◽  
Laser Diode Arrays ◽  
High Power Laser Diode

Uniform high power nine and 18 element individually addressable laser diode arrays

1991 ◽  
Vol 27 (5) ◽  
pp. 464 ◽  
Author(s):  
D.W. Nam ◽  
R.R. Craig ◽  
D.G. Mehuys ◽  
D.F. Welch
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Laser Diode Arrays

High Heat Flux Boiling Heat Transfer for Laser Diode Arrays

2016 ◽  
Author(s):  
Todd M. Bandhauer ◽  
Taylor A. Bevis
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Laser Diode ◽  
Boiling Heat Transfer ◽  
Single Phase ◽  
Laser Diodes ◽  
Heat Fluxes ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients ◽  
Laser Diode Arrays

The principle limit for achieving higher brightness of laser diode arrays is thermal management. State of the art laser diodes generate heat at fluxes in excess of 1 kW cm−2 on a plane parallel to the light emitting edge. As the laser diode bars are packed closer together, it becomes increasingly difficult to remove large amounts of heat in the diminishing space between neighboring diode bars. Thermal management of these diode arrays using conduction and natural convection is practically impossible, and, therefore, some form of forced convective cooling must be utilized. Cooling large arrays of laser diodes using single-phase convection heat transfer has been investigated for more than two decades by multiple investigators. Unfortunately, either large fluid temperature increases or very high flow velocities must be utilized to reject heat to a single phase fluid, and the practical threshold for single phase convective cooling of laser diodes appears to have been reached. In contrast, liquid-vapor phase change heat transport can occur with a negligible increase in temperature and, due to a high enthalpy of vaporization, at comparatively low mass flow rates. However, there have been no prior investigations at the conditions required for high brightness edge emitting laser diode arrays: >1 kW cm−2 and >10 kW cm−3. In the current investigation, flow boiling heat transfer at heat fluxes up to 1.1 kW cm−2 was studied in a microchannel heat sink with plurality of very small channels (45 × 200 microns) using R134a as the phase change fluid. The high aspect ratio channels (4.4:1) were manufactured using MEMS fabrication techniques, which yielded a large heat transfer surface area to volume ratio in the vicinity of the laser diode. To characterize the heat transfer performance, a test facility was constructed that enabled testing over a range of fluid saturation temperatures (15°C to 25°C). Due to the very small geometric features, significant heat spreading was observed, necessitating numerical methods to determine the average heat transfer coefficient from test data. This technique is crucial to accurately calculate the heat transfer coefficients for the current investigation, and it is shown that the analytical approach used by many previous investigations requires assumptions that are inadequate for the very small dimensions and heat fluxes observed in the present study. During the tests, the calculated outlet vapor quality exceeded 0.6 and the base heat flux reached a maximum of 1.1 kW cm−2. The resulting experimental heat transfer coefficients are found to be as large a 58.1 kW m−2 K−1 with an average uncertainty of ±11.1%, which includes uncertainty from all measured and calculated values, required assumptions, and geometric discretization error from meshing.

scholarly journals THIN THERMAL MANAGEMENT MODULES USING FLATTENED HEAT PIPES AND PIEZOELECTRIC FANS FOR ELECTRONIC DEVICES

2021 ◽  
Vol 17 (0) ◽  
Author(s):  
Randeep Singh ◽  
Jason Velardo ◽  
Mohammad Shahed Ahamed ◽  
Masataka Mochizuki ◽  
Abhijit Date ◽  
...  
Keyword(s):  
Thermal Management ◽  
Electronic Devices ◽  
Heat Pipes ◽  
Piezoelectric Fans

scholarly journals A novel technique for improving beam quality of high power laser diode arrays

2007 ◽  
Vol 56 (10) ◽  
pp. 5831
Author(s):  
Su Zhou-Ping ◽  
Lou Qi-Hong ◽  
Dong Jing-Xing ◽  
Zhou Jun ◽  
Wei Yun-Rong
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Beam Quality ◽  
High Power Laser ◽  
Power Laser ◽  
Novel Technique ◽  
Laser Diode Arrays ◽  
High Power Laser Diode

Efficient high power reliable InGaAs/AlGaAs (940 nm) monolithic laser diode arrays

1999 ◽  
Vol 35 (20) ◽  
pp. 1739 ◽  
Author(s):  
X. He ◽  
A. Ovtchinnikov ◽  
S. Yang ◽  
J. Harrison ◽  
A. Feitisch
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Laser Diode Arrays

Thermal Design and Testing of a Passive Helmet Heat Exchanger With Additively Manufactured Components

2018 ◽  
Author(s):  
Kailyn Cage ◽  
Monifa Vaughn-Cooke ◽  
Mark Fuge ◽  
Briana Lucero ◽  
Dusan Spernjak ◽  
...  
Keyword(s):  
Heat Exchanger ◽  
Heat Pipe ◽  
Thermal Management ◽  
Heat Pipes ◽  
Thermal Design ◽  
Analytical Models ◽  
Small Scale ◽  
Dimensional System ◽  
Concept Design ◽  
Environmental Chamber

Additive manufacturing (AM) processes allow for complex geometries to be developed in a cost- and time-efficient manner in small-scale productions. The unique functionality of AM offers an ideal collaboration between specific applications of human variability and thermal management. This research investigates the intersection of AM, human variability and thermal management in the development of a military helmet heat exchanger. A primary aim of this research was to establish the effectiveness of AM components in thermal applications based on material composition. Using additively manufactured heat pipe holders, the thermal properties of a passive evaporative cooler are tested for performance capability with various heat pipes over two environmental conditions. This study conducted a proof-of-concept design for a passive helmet heat exchanger, incorporating AM components as both the heat pipe holders and the cushioning material targeting internal head temperatures of ≤ 35°C. Copper heat pipes from 3 manufactures with three lengths were analytically simulated and experimentally tested for their effectiveness in the helmet design. A total of 12 heat pipes were tested with 2 heat pipes per holder in a lateral configuration inside a thermal environmental chamber. Two 25-hour tests in an environmental chamber were conducted evaluating temperature (25°C, 45°C) and relative humidity (25%, 50%) for the six types of heat pipes and compared against the analytical models of the helmet heat exchangers. Many of the heat pipes tested were good conduits for moving the heat from the head to the evaporative wicking material. All heat pipes had Coefficients of Performance under 3.5 when tested with the lateral system. Comparisons of the analytical and experimental models show the need for the design to incorporate a re-wetting reservoir. This work on a 2-dimensional system establishes the basis for design improvements and integration of the heat pipes and additively manufactured parts with a 3-dimensional helmet.

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