Experimental Investigation of Composite Phase Change Material Heat Sinks for Enhanced Passive Thermal Management

2020 ◽  
Vol 143 (1) ◽  
Author(s):  
Collier S. Miers ◽  
Amy Marconnet
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Test Platform ◽  
Regeneration Cycle ◽  
Change Material

Abstract Phase change materials (PCMs) are effective at storing thermal energy and are attractive for use in electronics to smooth temperature peaks during periods of high demand; however, the use of PCMs has been somewhat limited due to the poor thermal properties of the materials. Here, we propose a design for a tunable composite PCM heat sink for passive thermal management in electronic systems and develop an improved test platform to directly compare performance between different designs and PCMs. The composite design leverages high conductivity pathways, which are machined into aluminum heat sinks, and back-filled with PCMs. Two package sizes are considered with several internal fin structures. All designs are evaluated using a test platform with realistic power profiles, controlled interfacial loading, and in situ temperature measurement. The composite PCM heat sinks are benchmarked against solid aluminum packages of the same size. This study focuses on three commercially available PCMs. Performance is evaluated based on (1) the time it takes the test heater chip below each composite PCM package to reach the cut-off temperature of 95 °C and (2) the period of a full melt-regeneration cycle. A range of heat fluxes are considered in this study spanning 6.8–14.5 W cm−2. The isokite design with PlusICE S70 extends the time to reach 95 °C by 36.2% when compared to the solid package, while weighing 17.3% less, making it advantageous for mobile devices.

Studies on Optimum Distribution of Fins in Heat Sinks Filled With Phase Change Materials

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
S. K. Saha ◽  
K. Srinivasan ◽  
P. Dutta
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Volume Fraction ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Optimum Distribution ◽  
Cross Sectional ◽  
Change Material ◽  
Small Cross Sectional Area

This paper deals with phase change material (PCM), used in conjunction with thermal conductivity enhancer (TCE), as a means of thermal management of electronic systems. Eicosane is used as PCM, while aluminium pin or plate fins are used as TCE. The test section considered in all cases is a 42×42mm2 base with a TCE height of 25mm. An electrical heater at the heat sink base is used to simulate the heat generation in electronic chips. Various volumetric fractions of TCE in the conglomerate of PCM and TCE are considered. The case with 8% TCE volume fraction was found to have the best thermal performance. With this volume fraction of TCE, the effects of fin dimension and fin shape are also investigated. It is found that a large number of small cross-sectional area fins is preferable. A numerical model is also developed to enable an interpretation of experimental results.

Phase change material/heat pipe and Copper foam-based heat sinks for thermal management of electronic systems

2020 ◽  
Vol 32 ◽  
pp. 101971
Author(s):  
Muhammad Aamer Hayat ◽  
Hafiz Muhammad Ali ◽  
Muhammad Mansoor Janjua ◽  
William Pao ◽  
Changhe Li ◽  
...  
Keyword(s):  
Phase Change ◽  
Heat Pipe ◽  
Phase Change Material ◽  
Thermal Management ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Copper Foam ◽  
Change Material

A comparison of the performance of constant and dual height pin fins in phase change material cooling technique

2020 ◽  
pp. 1-30
Author(s):  
Maibam Romio Singh ◽  
Asis Giri
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Power Level ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Pin Fins ◽  
Favorable Temperature ◽  
Change Material ◽  
Operational Time

Abstract This experimental study explores the passive cooling of electronic devices using phase change materials (PCM). Pin fins configurations made of aluminium are considered as thermal conductive enhancers and eicosane as the PCM for the study. The experiments are carried out for five different heat fluxes ranging from 1.17 kW/m2 to 2.35 kW/m2 corresponding to a power level of 4 W to 8 W. The effect of number of fins, type of fins and volumes of PCM has been reviewed. It has been observed that the introduction of fins enhances the heat transfer and more elongation in operational time is achieved in case of dual height heat sinks. Also, volume of PCM, number of fins and heat fluxes directly affect in maintaining the device within a favorable temperature range. All the experiments are performed in a temperature controlled room to avoid environment fluctuation.

An experimental study of enhanced heat sinks for thermal management using n-eicosane as phase change material

2018 ◽  
Vol 132 ◽  
pp. 52-66 ◽  
Author(s):  
Adeel Arshad ◽  
Hafiz Muhammad Ali ◽  
Wei-Mon Yan ◽  
Ahmed Kadhim Hussein ◽  
Majid Ahmadlouydarab
Keyword(s):  
Experimental Study ◽  
Phase Change ◽  
Phase Change Material ◽  
Thermal Management ◽  
Heat Sinks ◽  
Change Material

Feasibility Assessment of the Integration of Microfluidics and NEPCM for Cooling Microelectronics Systems

2012 ◽  
Author(s):  
Julaunica Tigner ◽  
Tamara Floyd-Smith
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Microfluidic Channels ◽  
Pumping Power ◽  
Feasibility Assessment ◽  
Cooling Method ◽  
The Difference ◽  
Microchannel Cooling ◽  
Change Material

The growing demand for microelectronic systems to be smaller and faster has increased the energy released by these devices in the form of heat. Microelectronic systems such as laptop computers and hand held devices are not exempted from these demands. The primary traditional technologies currently used to remove heat generated in these devices are fins and fans. In this study, traditional methods were compared to more novel methods like cooling using forced convection in microfluidic channels and stagnant nanoparticle enhanced phase change materials (NEPCM). For this study, the difference between the surface temperature of a simulated microelectronic system without any cooling and with a particular cooling method was compared for several cooling scenarios. Higher ΔT values indicate more effective cooling. The average ΔT values for fans, fins, NEPCM and microchannels with water were 2°C, 5°C, 3°C and 4°C respectively. These results suggest that, separately, microchannel cooling and NEPCM are promising methods for managing heat in microelectronic systems. Even more interesting than NEPCM or microchannel cooling alone is the potential cooling that can be achieved by combining the two methods to achieve multimode cooling first by the phase change of the NEPCM and then by circulating the nanofluid (melted NEPCM) through microchannels. A feasibility assessment, however, reveals that the combination of the two methods is not equal to the sum of the parts due to the viscosity and associated pumping power requirements for the melted phase change material. Nonetheless, the combination of the method still holds promise as a competitive alternative to existing thermal management solutions.

scholarly journals A Meta Study of the Relationship Between Phase Change Material Parameters and Temperature Reduction in Fire Fighter Protective Clothing

2019 ◽  
Vol 6 ◽  
pp. 28-37
Author(s):  
Josef Richmond ◽  
Lesley Spencer ◽  
Tommy Tran ◽  
Evan Williams
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Protective Clothing ◽  
Phase Change Materials ◽  
High Heat ◽  
Heat Fluxes ◽  
Fire Fighter ◽  
High Flux ◽  
Temperature Reduction ◽  
Change Material

Firefighters are exposed to high risk scenarios in which the prevention of extreme heat injuries is largely dependent on the effectiveness of their protective clothing. The following meta-study examines contemporary literature to determine the usefulness of phase change materials (PCM’s) in improving the effectiveness of the current firefighter protective clothing (FFPC) model in order to better protect firefighters. The time- temperature for multiple PCM’s in environments with low, medium and high heat fluxes (taken as 2.5-5 kW/m2 for 700 seconds, 10-15 kW/m2 for 300 seconds and 20-40 kW/m2for 30 seconds respectively) were compared in terms of the rate of temperature increase and final temperature. The study found that PCM I produced the best temperature reduction in a low flux, PCM K did so in a medium flux, and PCM B did so in a high flux. The study also found that overall the PCMs were most effective in a low flux, therefore further study should be directed towards creating PCMs that are more effective in high-flux environments. Keywords: Phase Change Material; Fire Fighter Protective Clothing; Heat Flux

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