Ni+ and He+ Implantation Effects on the Hardness and Microstructure of Heat-Treated X750 Superalloy

2020 ◽  
Vol 7 (1) ◽  
Author(s):  
Maisaa N. Tawfeeq ◽  
Robert J. Klassen
Keyword(s):  
Electron Microscopy ◽  
Indentation Hardness ◽  
Hardness Testing ◽  
Strengthening Phase ◽  
Tem Analysis ◽  
Helium Bubbles ◽  
Implantation Damage ◽  
Transmission Electron ◽  
Heat Treated ◽  
Helium Ion

Abstract Nickel and Helium ion implantation-induced hardening and microstructural evolution of X750 in the heat-treated (HT) and solution annealed (SA) conditions were investigated using nano-indentation hardness testing and electron microscopy (scanning electron microscopy (SEM) and transmission electron microscopy (TEM)). Irradiation crystal damage up to ψ = 5 dpa was invoked with Ni+ implantation while He+ implantation up to CHe = 5000 appm was performed on samples the HT and SA conditions. The X750 alloy displayed generally increasing hardness with increasing Ni+ implantation damage but a perturbation in the trend occurred when ψ ≤ 0.5 dpa, and the hardness dropped by about 30% and 2% for the HT and the SA samples, respectively. TEM analysis indicated that this softening was associated with disordering and dissolution of the γ′ strengthening phase. The hardening behavior observed at higher implantation damage (ψ = 1 dpa) resulted in reformation of Al/Ti-rich regions within the microstructure phase. The hardness of the X750 increased continuously with increasing implanted He+ up to CHe = 1000 appm. This was associated with the formation of helium bubbles as observed by TEM. Slight drop in hardness in the HT condition at CHe = 5000 appm indicated that high levels of He+ implantation destabilize the γ′ precipitates as was confirmed with TEM observed disappearance of γ′ super-lattice reflections.

Transmission Electron Microscopy of an Aluminum-Silver-Stainless Steel Solid State Bond

1985 ◽  
Vol 43 ◽  
pp. 172-173
Author(s):  
M. J. Carr ◽  
J. F. Shewbridge ◽  
T. O. Wilford
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Solid State ◽  
Specimen Preparation ◽  
Dimensional Control ◽  
Tem Analysis ◽  
Metal Parts ◽  
Dissimilar Metal ◽  
Transmission Electron ◽  
Short Time

Strong solid state bonds are routinely produced between physical vapor deposited (PVD) silver coatings deposited on sputter cleaned surfaces of two dissimilar metal parts. The low temperature (200°C) and short time (10 min) used in the bonding cycle are advantageous from the standpoint of productivity and dimensional control. These conditions unfortunately produce no microstructural changes at or near the interface that are detectable by optical, SEM, or microprobe examination. Microstructural problems arising at these interfaces could therefore easily go undetected by these techniques. TEM analysis has not been previously applied to this problem because of the difficulty in specimen preparation. The purpose of this paper is to describe our technique for preparing specimens from solid state bonds and to present our initial observations of the microstructural details of such bonds.

The effect of small additions of Cu on precipitation in Al-Mg-Si alloys

1990 ◽  
Vol 48 (2) ◽  
pp. 442-443
Author(s):  
M. Tamizifar ◽  
G. Cliff ◽  
R.W. Devenish ◽  
G.W. Lorimer
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Scanning Transmission Electron Microscope ◽  
Argon Atmosphere ◽  
Age Hardening ◽  
X Ray ◽  
Transmission Electron ◽  
Heat Treated ◽  
Analytical Electron ◽  
Scanning Transmission

Small additions of copper, <1 wt%, have a pronounced effect on the ageing response of Al-Mg-Si alloys. The object of the present investigation was to study the effect of additions of copper up to 0.5 wt% on the ageing response of a series of Al-Mg-Si alloys and to use high resolution analytical electron microscopy to determine the composition of the age hardening precipitates.The composition of the alloys investigated is given in Table 1. The alloys were heat treated in an argon atmosphere for 30m, water quenched and immediately aged either at 180°C for 15 h or given a duplex treatment of 180°C for 15 h followed by 350°C for 2 h2. The double-ageing treatment was similar to that carried out by Dumolt et al. Analyses of the precipitation were carried out with a HB 501 Scanning Transmission Electron Microscope. X-ray peak integrals were converted into weight fractions using the ratio technique of Cliff and Lorimer.

TEM Sample Preparation Tricks for Advanced DRAMs

2015 ◽  
Author(s):  
Ching Shan Sung ◽  
Hsiu Ting Lee ◽  
Jian Shing Luo
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Tem Analysis ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Characterization Of Materials

Abstract Transmission electron microscopy (TEM) plays an important role in the structural analysis and characterization of materials for process evaluation and failure analysis in the integrated circuit (IC) industry as device shrinkage continues. It is well known that a high quality TEM sample is one of the keys which enables to facilitate successful TEM analysis. This paper demonstrates a few examples to show the tricks on positioning, protection deposition, sample dicing, and focused ion beam milling of the TEM sample preparation for advanced DRAMs. The micro-structures of the devices and samples architectures were observed by using cross sectional transmission electron microscopy, scanning electron microscopy, and optical microscopy. Following these tricks can help readers to prepare TEM samples with higher quality and efficiency.

A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB

2002 ◽  
Author(s):  
Chin Kai Liu ◽  
Chi Jen. Chen ◽  
Jeh Yan.Chiou ◽  
David Su
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Tem Analysis ◽  
Sensitive Issue ◽  
Transmission Electron

Abstract Focused ion beam (FIB) has become a useful tool in the Integrated Circuit (IC) industry, It is playing an important role in Failure Analysis (FA), circuit repair and Transmission Electron Microscopy (TEM) specimen preparation. In particular, preparation of TEM samples using FIB has become popular within the last ten years [1]; the progress in this field is well documented. Given the usefulness of FIB, “Artifact” however is a very sensitive issue in TEM inspections. The ability to identify those artifacts in TEM analysis is an important as to understanding the significance of pictures In this paper, we will describe how to measure the damages introduced by FIB sample preparation and introduce a better way to prevent such kind of artifacts.

scholarly journals Structural Analysis of Jumbo Coliphage phAPEC6

2020 ◽  
Vol 21 (9) ◽  
pp. 3119 ◽  
Author(s):  
Jeroen Wagemans ◽  
Jessica Tsonos ◽  
Dominique Holtappels ◽  
Kiandro Fortuna ◽  
Jean-Pierre Hernalsteens ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Capsid Protein ◽  
Tem Analysis ◽  
Host Interaction ◽  
Cryo Electron Microscopy ◽  
Transmission Electron ◽  
Tail Sheath ◽  
Associated Proteins ◽  
Contractile Tail ◽  
Phage Capsid

The phAPEC6 genome encodes 551 predicted gene products, with the vast majority (83%) of unknown function. Of these, 62 have been identified as virion-associated proteins by mass spectrometry (ESI-MS/MS), including the major capsid protein (Gp225; present in 1620 copies), which shows a HK97 capsid protein-based fold. Cryo-electron microscopy experiments showed that the 350-kbp DNA molecule of Escherichia coli virus phAPEC6 is packaged in at least 15 concentric layers in the phage capsid. A capsid inner body rod is also present, measuring about 91 nm by 18 nm and oriented along the portal axis. In the phAPEC6 contractile tail, 25 hexameric stacked rings can be distinguished, built of the identified tail sheath protein (Gp277). Cryo-EM reconstruction reveals the base of the unique hairy fibers observed during an initial transmission electron microscopy (TEM) analysis. These very unusual filaments are ordered at three annular positions along the contractile sheath, as well as around the capsid, and may be involved in host interaction.

TEM Characterization of As-Deposited and Annealed Ni/Al Multilayer Thin Film

2010 ◽  
Vol 16 (6) ◽  
pp. 662-669 ◽  
Author(s):  
S. Simões ◽  
F. Viana ◽  
A.S. Ramos ◽  
M.T. Vieira ◽  
M.F. Vieira
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Cross Section ◽  
Ion Beam ◽  
Microstructural Characterization ◽  
Multilayer Thin Films ◽  
Tem Analysis ◽  
Plan View ◽  
Transmission Electron

AbstractReactive multilayer thin films that undergo highly exothermic reactions are attractive choices for applications in ignition, propulsion, and joining systems. Ni/Al reactive multilayer thin films were deposited by dc magnetron sputtering with a period of 14 nm. The microstructure of the as-deposited and heat-treated Ni/Al multilayers was studied by transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) in plan view and in cross section. The cross-section samples for TEM and STEM were prepared by focused ion beam lift-out technique. TEM analysis indicates that the as-deposited samples were composed of Ni and Al. High-resolution TEM images reveal the presence of NiAl in small localized regions. Microstructural characterization shows that heat treating at 450 and 700°C transforms the Ni/Al multilayered structure into equiaxed NiAl fine grains.

scholarly journals Characterization of glycidyl methacrylate based magnetic nanocomposites

2019 ◽  
Vol 73 (1) ◽  
pp. 25-35
Author(s):  
Bojana Markovic ◽  
Vojislav Spasojevic ◽  
Aleksandra Dapcevic ◽  
Zorica Vukovic ◽  
Vladimir Pavlovic ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Magnetic Nanoparticles ◽  
Glycidyl Methacrylate ◽  
Mercury Porosimetry ◽  
Magnetic Nanocomposite ◽  
Magnetic Nanocomposites ◽  
Tem Analysis ◽  
X Ray ◽  
Force Microscopy ◽  
Transmission Electron

Magnetic and non-magnetic macroporous crosslinked copolymers of glycidyl methacrylate and trimethylolpropane trimethacrylate were prepared by suspension copolymerization and functionalized with diethylenetriamine. The samples were characterized by mercury porosimetry, scanning electron microscopy with energy-dispersive X-ray spectroscopy (SEM-EDS), Fourier transform infrared spectroscopy analysis (FTIR-ATR), thermogravimetric analysis (TGA), X-ray diffractometry (XRD), atomic force microscopy (AFM), transmission electron microscopy (TEM) and SQUID magnetometry. The FTIR-ATR analysis of synthesized magnetic nanocomposites confirmed the presence of magnetite and successful amino- functionalization. Non-functionalized and amino-functionalized nanocomposites exhibited superparamagnetic behavior at 300 K, with a saturation magnetization of 5.0 emu/g and 2.9 emu/g, respectively. TEM analysis of the magnetic nanocomposite has shown that magnetic nanoparticles were homogeneously dispersed in the polymer matrix. It was demonstrated that incorporation of magnetic nanoparticles enhanced the thermal stability of the magnetic nanocomposite in comparison to the initial non-magnetic macroporous copolymer.

Evaluation of 4330M Steel for Fasteners Applications

2017 ◽  
Vol 380 ◽  
pp. 198-211 ◽  
Author(s):  
A. Al Sumait ◽  
C. Delgado ◽  
F. Aldhabib ◽  
X. Sun ◽  
F. Alzubi ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Scanning Electron Microscopy ◽  
Tensile Testing ◽  
Grain Structure ◽  
Hardness Testing ◽  
Heat Treated ◽  
Different Types ◽  
Strength And Ductility ◽  
Scanning Electron

The objective of the study was to optimize the strength and ductility values of the 4330M steel. Optimization was conducted through different types of heat treatments. Tensile testing, hardness testing, optical microscopy, and Scanning Electron Microscopy (SEM) were used to evaluate the mechanical properties and microstructure of the as-received and the heat treated samples. The alloy was provided from two vendors; vendor H and vendor S. Results showed that by increasing the tempering temperatures, strength values decreases, while ductility values remain unchanged. Vendor H samples had higher strength values and much finer grain structure which was revealed only at 5000x magnification.

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