Improved Inkjet-Printed Pattern Fidelity: Suppressing Bulges by Segmented and Symmetric Drop Placement

2020 ◽  
Vol 8 (3) ◽  
Author(s):  
Ragheb Abunahla ◽  
Md Saifur Rahman ◽  
Paria Naderi ◽  
Gerd Grau
Keyword(s):  
Circuit Design ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Promising Technique ◽  
Line Shapes ◽  
Manufacturing Accuracy ◽  
Drying Conditions ◽  
Line Patterns ◽  
Circuit Density

Abstract Inkjet printing is a promising technique for printed micro-electronics due to low cost, customizability and compatibility with large-area, flexible substrates. However, printed line shapes can suffer from bulges at the start of lines and at corner points in 2D line patterns. The printed pattern can be multiple times wider than the designed linewidth. This can severely impact manufacturing accuracy and achievable circuit density. Bulging can be difficult to prevent without changing the ink-substrate-system, the drying conditions or the circuit design, all of which can be undesirable. Here, we demonstrate a novel printing methodology that solves this issue by changing the order in which drops are placed on the substrate. The pattern is split up into segments of three drops where the central drop is printed last. This symmetric printing prevents the unwanted ink flow that causes bulging. Larger bulge-free patterns are created by successively connecting segments. Line formation in both traditional linear printing and our novel segmented and symmetric printing was analyzed to understand and optimize results. The printing of X-, T-, and L-shapes is considerably improved compared with the traditional linear printing methodology.

An Investigation onto Polydimethylsiloxane (PDMS) Printing Plate of Multiple Functional Solid Line by Flexographic

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil
Keyword(s):  
Laser Ablation ◽  
Line Width ◽  
High Speed ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Printing Plate ◽  
Roll To Roll ◽  
Printing Processes

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.

Hologram Images Patterned in Shrink BOPP Film by Large-Area Roller Nanoimprint Lithography

2013 ◽  
Vol 873 ◽  
pp. 503-506 ◽  
Author(s):  
Meng Lin Jiang ◽  
Shi Wei Lin ◽  
Wen Kai Jiang
Keyword(s):  
Formation Mechanism ◽  
High Throughput ◽  
Nanoimprint Lithography ◽  
Low Cost ◽  
Nanometer Scale ◽  
Flexible Substrates ◽  
Large Area ◽  
Biaxially Oriented Polypropylene ◽  
Oriented Polypropylene ◽  
Lithography Technique

Thermal roller nanoimprint lithography with the ability of larger area micro-to nanometer-scale patterning on flexible substrates possesses the advantages of low cost and high throughput, and is widely being practiced in industry. Hologram images have been successfully embossed in shrink biaxially oriented polypropylene films by the large-area roller nanoimprint lithography technique. The defects which occur during embossing processes have been studied in order to identify the underlying formation mechanism.

scholarly journals Shear-Force Sensors on Flexible Substrates Using Inkjet Printing

2019 ◽  
Vol 2019 ◽  
pp. 1-11 ◽  
Author(s):  
Andreas Albrecht ◽  
Mauriz Trautmann ◽  
Markus Becherer ◽  
Paolo Lugli ◽  
Almudena Rivadeneyra
Keyword(s):  
Inkjet Printing ◽  
Shear Force ◽  
Low Cost ◽  
Force Sensor ◽  
Flexible Substrates ◽  
Large Area ◽  
Force Sensitivity ◽  
Sensing Systems ◽  
Force Range ◽  
Printing Techniques

Printing techniques are a promising way of fabricating low-cost electronics without the need for masking and etching. In recent years, additive printing techniques, such as inkjet and screen printing, have been adopted to fabricate low-cost and large-area electronics on flexible substrates. In this work, a three-axial normal and shear force sensor was designed and printed that consists of four miniaturized, printed capacitors. The partially overlapping electrodes are arranged in a manner, so that force sensitivity in orthogonal directions is achieved. A silicone rubber is used as an elastic dielectric and spacer between the two electrodes. The base unit of this sensor has been fabricated using inkjet printing and characterized for normal and shear forces. The force response was investigated in a force range from 0.1 N to 8 N, the normal-force sensitivity was determined to be Sz=5.2 fF/N, and the shear-force sensitivity was Sy=13.1 fF/N. Due to its sensing range, this sensor could be applicable in tactile sensing systems like wearables and artificial electronic skins.

Large Area Microcontact Printing Presses for Plastic Electronics

2004 ◽  
Vol 846 ◽  
Author(s):  
Hee Hyun Lee ◽  
Etienne Menard ◽  
Nancy G. Tassi ◽  
John A. Rogers ◽  
Graciela B. Blanchet
Keyword(s):  
High Resolution ◽  
High Speed ◽  
Microcontact Printing ◽  
Low Cost ◽  
Manufacturing Processes ◽  
Flexible Substrates ◽  
Large Area ◽  
Plastic Electronics ◽  
Roll To Roll ◽  
Micron Size

ABSTRACTLow cost fabrication is key to the successful introduction of organic electronics and roll to roll manufacturing processes. We propose here that extending flexography into the micron size resolution regime may provide an economical commercialization path for plastic devices. Flexography is a high-speed technique commonly used for printing onto very large area flexible substrates.[1] Although low resolution and poor registration are characteristics of today's flexographic process, it has many similarities with soft lithographic techniques. This work shows that large, (12”×12”) high-resolution printing plates appropriate for use on small tag and label flexographic presses can be prepared using simple and inexpensive flexographic compatible processes. We illustrate the use of these plates for three representative soft lithographic processes: microcontact printing, replica molding, and phase shift lithography.

An original flexible structure for Organic Photovoltaic Devices

2004 ◽  
Vol 814 ◽  
Author(s):  
Ornella Sanna ◽  
Mario Cossu ◽  
Tomas Pilia ◽  
Annalisa Bonfiglio
Keyword(s):  
Low Cost ◽  
Organic Photovoltaic ◽  
Flexible Substrates ◽  
Photovoltaic Devices ◽  
Organic Photovoltaic Devices ◽  
Large Area ◽  
Insulating Material ◽  
Roll To Roll ◽  
Supporting Layer ◽  
Poly Ethylene

ABSTRACTA simple idea is proposed for the realization of organic photovoltaic devices on flexible substrates. According to this, a poly(ethylene terephtalate) layer (Mylar), transparent, a few micrometers thick and completely flexible, works as mechanical support. It is an insulating material, which has good mechanical and dielectric properties and, most important, it is completely transparent to ultraviolet light. For this reason it could be suitable for being used as transparent supporting layer for large area photovoltaic devices. Furthermore, its mechanical properties allow to employ it in a roll-to-roll lamination procedure that could give rise to low cost extended films carrying solar cells on the surface.

Computer simulation study about the dependence of amorphous silicon photonic waveguides efficiency on the material quality

2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira
Keyword(s):  
Amorphous Silicon ◽  
High Throughput Screening ◽  
Simulation Analysis ◽  
Low Cost ◽  
Deposition Process ◽  
Large Area ◽  
Sidewall Roughness ◽  
Sensing Applications ◽  
Fabrication Defects ◽  
The Impact

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.

scholarly journals High Performance Printed Electronics on Large Area Flexible Substrates

2020 ◽  
Author(s):  
Mahesh Soni ◽  
Dhayalan Shakthivel ◽  
Adamos Christou ◽  
Ayoub Zumeit ◽  
Nivasan Yogeswaran ◽  
...  
Keyword(s):  
High Performance ◽  
Printed Electronics ◽  
Flexible Substrates ◽  
Large Area

A novel low cost texturization method for large area commercial mono-crystalline silicon solar cells

2006 ◽  
Vol 90 (20) ◽  
pp. 3557-3567 ◽  
Author(s):  
U. Gangopadhyay ◽  
K.H. Kim ◽  
S.K. Dhungel ◽  
U. Manna ◽  
P.K. Basu ◽  
...  
Keyword(s):  
Solar Cells ◽  
Crystalline Silicon ◽  
Low Cost ◽  
Silicon Solar Cells ◽  
Large Area ◽  
Crystalline Silicon Solar Cells

scholarly journals Superhydrophobicity and Durability in Recyclable Polymers Coating

2021 ◽  
Vol 13 (15) ◽  
pp. 8244
Author(s):  
Francesca Cirisano ◽  
Michele Ferrari
Keyword(s):  
Thermal Treatment ◽  
Superhydrophobic Surface ◽  
Low Cost ◽  
Spray Coating ◽  
Large Area ◽  
Average Roughness ◽  
Water Contact ◽  
Alkaline Environments ◽  
Fine Control ◽  
Recycle And Reuse

Highly hydrophobic and superhydrophobic materials obtained from recycled polymers represent an interesting challenge to recycle and reuse advanced performance materials after their first life. In this article, we present a simple and low-cost method to fabricate a superhydrophobic surface by employing polytetrafluoroethylene (PTFE) powder in polystyrene (PS) dispersion. With respect to the literature, the superhydrophobic surface (SHS) was prepared by utilizing a spray- coating technique at room temperature, a glass substrate without any further modification or thermal treatment, and which can be applied onto a large area and on to any type of material with some degree of fine control over the wettability properties. The prepared surface showed superhydrophobic behavior with a water contact angle (CA) of 170°; furthermore, the coating was characterized with different techniques, such as a 3D confocal profilometer, to measure the average roughness of the coating, and scanning electron microscopy (SEM) to characterize the surface morphology. In addition, the durability of SH coating was investigated by a long-water impact test (raining test), thermal treatment at high temperature, an abrasion test, and in acidic and alkaline environments. The present study may suggest an easy and scalable method to produce SHS PS/PTFE films that may find implementation in various fields.

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