scholarly journals Regulative Characteristic of Methanol–Copper Heat Pipes for Asteroid Lander “MASCOT”

2020 ◽  
Vol 142 (5) ◽  
Author(s):  
Volodymyr Baturkin ◽  
Vitali Feidelheimer ◽  
Kaname Sasaki ◽  
Eugen Mikulz ◽  
Tra-Mi Ho

Abstract Variable conductance heat pipes (VCHPs) are the main part of the MASCOT (mobile asteroid surface SCOuT) lander thermal control system (TCS). They provide variable conductivity by utilizing the heat transfer limitations. This allows the heat pipes to act as thermal switches without additional constructive elements, thus leveraging the simple and compact design of conventional heat pipes. Two cylindrical methanol–copper heat pipes with shell length of 0.482 m and 0.438 m and external diameter of 0.006 m, having copper discrete metal fiber wick and copper shell were constructed and verified in the temperature range between −75 and +60 °C. The purpose is to apply this design into the MASCOT TCS and to investigate the heat pipes' regulative characteristics and heat transfer limitations. VCHPs show a change of thermal resistivity from 70 K/W at a heat sink temperature of −60 °C, to 0.8 K/W at a heat sink temperature of +60 °C; with an obtained maximal heat transfer rate of 5 W and 16 W, respectively. It is found that the switching effect of the heat pipes is governed by the sonic velocity limitation, the saturation vapor pressure of the working fluid, and the maximal capillary pressure of the wick. The operation of the heat pipes as the part of the TCS has confirmed their variable thermal properties.

2018 ◽  
Vol 179 ◽  
pp. 01023
Author(s):  
Jian Yabin ◽  
Zhang Chunyuan ◽  
Wang jing ◽  
Lin Boyin ◽  
Wang Runze ◽  
...  

The heat sink temperature is often set in a semi-empirical way based on steady-state temperatures . As a result, the entrance parameters of the heat sink working fluid are often too conservative, and the rate of temperature rise is difficult to control. In this paper, transient thermal models for each component of the heat sink temperature regulation system are established. Then they are programmed into a dynamic simulation model by using Matlab/Simulink as the thermal control algorithm.It is shown that the model can accurately reflect the dynamic and steady state characteristics of the heat sink temperature regulation system, and can provide guidance for the selection of control strategies and working fluid parameters in the thermal vacuum test.


Author(s):  
Qin Sun ◽  
Jian Qu ◽  
Jianping Yuan ◽  
Hai Wang ◽  
Scott M. Thompson

Abstract The oscillating heat pipe is considered a promising candidate for high-efficiency and compact thermal control for next-generation electronics. In this paper, the visualized flow and heat transfer characteristics of two silicon-based micro oscillating heat pipes (micro-OHPs) with expanding and straight channels, respectively, were experimentally investigated. The overall size of these two micro-OHPs are both 28 mm × 23 mm × 1.025 mm and have thirty rectangular cross-section channels. The hydraulic diameter of parallel direct channel is 332.4 μm, while they are about 364.4 and 287.0 μm at the two ends of expanding channel, respectively. R141b was used as the working fluid with the volumetric filling ratio of 50%. Inside these two micro-devices, the fluid oscillating motion, including unidirectional movement and intermittent stopovers, was observed at the quasi-steady oscillation state, accompanied by bubbly flow, slug flow and annular/semi-annular flow in microchannels. The micro-OHP with expanding channels possessed better thermal performance and could achieve ephemeral circulation flow, while poorer heat transfer performance occurred for the micro-OHP with straight channels due to more localized slug/plug oscillations and intermittent stopovers. The oscillating amplitudes of liquid slugs are presented to estimate the flow behavior of working fluid inside micro-OHPs. The introduction of expanding channels in a micro-OHP is beneficial for realizing the more robust oscillating motion of liquid slugs with larger oscillating amplitudes for heat transfer enhancement.


2015 ◽  
Vol 1105 ◽  
pp. 253-258 ◽  
Author(s):  
Weerapun Duangthongsuk ◽  
Somchai Wongwises

This research presents an experimental investigation on the heat transfer performance and pressure drop characteristics of a heat sink with miniature square pin fin structure using nanofluids as coolant. ZnO-water nanofluids with particle concentrations of 0.2, 0.4 and 0.6 vol.% are used as working fluid and then compared with the data for water-cooled heat sink. Heat sink made from aluminum material with dimension around 28 x 33 x 25 mm (width x length x thickness). The heat transfer area and hydraulic diameter of the each flow channel is designed at 1,565 mm2and 1.2 mm respectively. Uniform heat flux at the bottom of heat sink is achieved using an electric heater. The experimental data illustrate that the thermal performance of heat sink using nanofluids as coolant is average 14% higher than that of the water-cooled heat sink. For pressure drop, the data show that the pressure drop of nanofluids is a few percent larger than that of the water-cooled heat sink.


2021 ◽  
Vol 2119 (1) ◽  
pp. 012088
Author(s):  
A. A. Litvintceva ◽  
N. I. Volkov ◽  
N. I. Vorogushina ◽  
V. A. Moskovskikh ◽  
V. V. Cheverda

Abstract Heat pipes are a good solution for temperature stabilization, for example, of microelectronics, because these kinds of systems are without any moving parts. Experimental research of the effect of operating parameters on the heat transfer in a cylindrical heat pipe has been conducted. The effect of the working fluid properties and the porous layer thickness on the heat flux and temperature difference in the heat pipe has been investigated. The temperature field of the heat pipe has been investigated using the IR-camera and K-type thermocouples. The data obtained by IR-camera and K-type thermocouples have been compared. It is demonstrated the power transferred from the evaporator to the condenser is a linear function of the temperature difference between them.


2020 ◽  
Vol 21 (3) ◽  
pp. 309
Author(s):  
Maryam Fallah Abbasi ◽  
Hossein Shokouhmand ◽  
Morteza Khayat

Electronic industries have always been trying to improve the efficiency of electronic devices with small dimensions through thermal management of this equipment, thus increasing the use of small thermal sinks. In this study micro heat pipes with triangular and square cross sections have been manufactured and tested. One of the main objectives is to obtain an understanding of micro heat pipes and their role in energy transmission with electrical double layer (EDL). Micro heat pipes are highly efficient heat transfer devices, which use the continuous evaporation/condensation of a suitable working fluid for two-phase heat transport in a closed system. Since the latent heat of vaporization is very large, heat pipes transport heat at small temperature difference, with high rates. Because of variety of advantage features these devices have found a number of applications both in space and terrestrial technologies. The theory of operation micro heat pipes with EDL is described and the micro heat pipe has been studied. The temperature distribution have achieved through five thermocouples installed on the body. Water and different solution mixture of water and ethanol have used to investigate effect of the electric double layer heat transfer. It was noticed that the electric double layer of ionized fluid has caused reduction of heat transfer.


Author(s):  
Ayman Megahed ◽  
Ibrahim Hassan ◽  
Tariq Ahmad

The present study focuses on the experimental investigation of boiling heat transfer characteristics and pressure drop in a silicon microchannel heat sink. The microchannel heat sink consists of a rectangular silicon chip in which 45 rectangular microchannels were chemically etched with a depth of 295 μm, width of 254 μm, and a length of 16 mm. Un-encapsulated Thermochromic liquid Crystals (TLC) are used in the present work to enable nonintrusive and high spatial resolution temperature measurements. This measuring technique is used to provide accurate full and local surface-temperature and heat transfer coefficient measurements. Experiments are carried out for mass velocities ranging between 290 to 457 kg/m2.s and heat fluxes from 6.04 to 13.06 W/cm2 using FC-72 as the working fluid. Experimental results show that the pressure drop increases as the exit quality and the flow rate increase. High values of heat transfer coefficient can be obtained at low exit quality (xe < 0.2). However, the heat transfer coefficient decreases sharply and remains almost constant as the quality increases for an exit quality higher than 0.2.


Author(s):  
Hsiang-Sheng Huang ◽  
Jung-Chang Wang ◽  
Sih-Li Chen

This article provides an experimental method to study the thermal performance of a heat sink with two pairs (outer and inner pair) of embedded heat pipes. The proposed method can determine the heat transfer rate of the heat pipes under various heating power of the heat source. A comprehensive thermal resistance network of the heat sink is also developed. The network estimates the thermal resistances of the heat sink by applying the thermal performance test result. The results show that the outer and inner pairs of heat pipes carries 21% and 27% of the total heat transfer rate respectively, while 52% of the heating power is dissipated from the base plate to the fins. The dominated thermal resistance of the heat sink is the base to heat pipes resistance which is strongly affected by the thermal performance of the heat pipes. The total thermal resistance of the heat sink shows the lowest value, 0.23°C/W, while the total heat transfer rate of the heat sink is 140W and the heat transfer rate of the outer and inner pairs of heat pipes is 30W and 38 W, respectively.


Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.


Author(s):  
Mehdi Taslimifar ◽  
Maziar Mohammadi ◽  
Ali Adibnia ◽  
Hossein Afshin ◽  
Mohammad Hassan Saidi ◽  
...  

Homogenous dispersing of nanoparticles in a base fluid is an excellent way to increase the thermal performance of heat transfer devices especially Heat Pipes (HPs). As a wickless, cheap and efficient heat pipe, Pulsating Heat Pipes (PHPs) are important candidates for thermal application considerations. In the present research an Open Loop Pulsating Heat Pipe (OLPHP) is fabricated and tested experimentally. The effects of working fluid namely, water, Silica Coated ferrofluid (SC ferrofluid), and ferrofluid without surface coating of nanoparticles (ferrofluid), charging ratio, heat input, and application of magnetic field on the overall thermal performance of the OLPHPs are investigated. Experimental results show that ferrofluid has better heat transport capability relative to SC ferrofluid. Furthermore, application of magnetic field improves the heat transfer performance of OLPHPs charged with both ferrofluids.


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