Universal Gray Finite Elements for Heat Transfer Analysis in the Presence of Uncertainties

Author(s):  
Ashkan Nejadpak ◽  
Singiresu S. Rao

Abstract A new finite element method is presented for the analysis of uncertain heat transfer problems using universal gray number theory. The universal gray number representation involves normalization of the uncertain parameters based on their lower and upper bound values with its own distinctive rules of arithmetic operations which makes this method distinctive from conventional interval analysis approaches. This work introduces the concept of fuzzy finite element-based heat transfer analysis using universal gray number theory, that compared to the interval-based fuzzy analysis, would yield significantly improved and more accurate results. Heat transfer problems, including a one-dimensional tapered fin, a two-dimensional hollow rectangle representing a thin slice of a chimney of a thermal power plant, and a three-dimensional (axisymmetric) solid body with different boundary conditions, were considered for the uncertainty analysis. It is shown that, in each case, the interval values of the response parameters given by the universal gray number theory are consistent with the ranges of the input parameters, compared to those given by the interval analysis. It is also revealed that universal gray number theory is more inclusive and less computationally intensive compared to the interval analysis.

Author(s):  
Minh Ngoc Nguyen ◽  
Tich Thien Truong ◽  
Tinh Quoc Bui

The present work is devoted to the analysis of non-linear heat transfer problems using the recent development of consective-interpolation procedure. Approximation of temperature is enhanced by taking into account both the nodal values and their averaged nodal gradients, which results in an improved finite element model. The novel formulation possesses many desirable properties including higher accuracy and higher-order continuity, without any change of the total number of degrees of freedom. The non-linear heat transfer problems equation is linearized and iteratively solved by the Newton-Raphson scheme. To show the accuracy and efficiency of the proposed method, several numerical examples are hence considered and analyzed.


2015 ◽  
Vol 18 (2) ◽  
pp. 21-28
Author(s):  
Minh Ngoc Nguyen ◽  
Nha Thanh Nguyen ◽  
Tinh Quoc Bui ◽  
Thien Tich Truong

A consecutive-interpolation 4-node quadrilateral finite element (CQ4) is further extended to solve twodimensional heat transfer problems, taking the average nodal gradients as interpolation condition, resulting in highorder continuity solution without smoothing operation and without increasing the number of degrees of freedom. The implementation is straightforward and can be easily integrated into any existing FEM code. Several numerical examples are investigated to verify the accuracy and efficiency of the proposed formulation in two-dimensional heat transfer analysis.


Author(s):  
Kimihide Odagiri ◽  
Kieran Wolk ◽  
Stefano Cappucci ◽  
Stefano Morellina ◽  
Scott Roberts ◽  
...  

Author(s):  
Leila Choobineh ◽  
Dereje Agonafer ◽  
Ankur Jain

Heterogeneous integration in microelectronic systems using interposer technology has attracted significant research attention in the past few years. Interposer technology is based on stacking of several heterogeneous chips on a common carrier substrate, also referred to as the interposer. Compared to other technologies such as System-on-Chip (SoC) or System-in-Package (SiP), interposer-based integration offers several technological advantages. However, the thermal management of an interposer-based system is not well understood. The presence of multiple heat sources in various die and the interposer itself needs to be accounted for in any effective thermal model. While a finite-element based simulation may provide a reasonable temperature prediction tool, an analytical solution is highly desirable for understanding the fundamentals of the heat transfer process in interposers. In this paper, we describe our recent work on analytical modeling of heat transfer in interposer-based microelectronic systems. The basic governing energy conservation equations are solved to derive analytical expressions for the temperature distribution in an interposer-based microelectronic system. These solutions are combined with an iterative approach to provide the three-dimensional temperature field in an interposer. Results are in excellent agreement with finite-element solutions. The analytical model is utilized to study the effect of various parameters on the temperature field in an interposer system. Results from this work may be helpful in the thermal design of microelectronic systems containing interposers.


2016 ◽  
Vol 2016 ◽  
pp. 1-7 ◽  
Author(s):  
Estaner Claro Romão

This paper proposes an efficient alternative to construction of the linear system coming from a solution via the Finite Element Method that is able to significantly decrease the time of construction of this system. From the presentation of the methodology used and a numerical application it will be clear that the purpose of this work is to be able to decrease 6-7 times (on average) the linear system building time.


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