Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

2019 ◽  
Vol 141 (1) ◽  
Author(s):  
Phil Geng
Keyword(s):  
Data Center ◽  
Structural Design ◽  
Central Processor ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Central Processor Unit ◽  
The Finite Element Analysis ◽  
Processor Unit ◽  
Design Options

For more than a decade, land grid array (LGA) has been one of the main central processor unit (CPU) packages developed at Intel and AMD, and widely used in different computer systems. LGA loading mechanism has become more critical to achieve mechanical, thermal, and electrical functions with the increasing retention force requirement. During the development of the loading mechanisms for LGA packages and sockets, socket pin contact to LGA pad under retention load, solder joint reliability under shock load, socket pin fretting under vibration, and load degradation are some of the key structural risks. This paper reviews the structural designs of different loading mechanism solutions systematically and summarizes the key structural concerns and advantages. While the finite element analysis (FEA) was used to guide the design options in early platform architectural definition, this review discusses the evolution of Xeon LGA loading mechanisms developed at the Intel Data Center Group.

scholarly journals Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling

2021 ◽  
pp. 37-43
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Good Prediction ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Temperature Boundary ◽  
Temperature Ramp ◽  
The Finite Element Analysis ◽  
Thermal Cycling Process

This paper aims to present a thermo-mechanical modeling approach to predict the solder joint reliability of a leadframe-based package under powered thermal cycling (PTC) test from -40oC to 105oC. The study involves modeling the PTC condition as a standard thermal cycling with a modified temperature boundary to account for the temperature increase due to the applied power to the device package mounted on board. The temperature ramp and dwell times were maintained. Based on the finite element analysis (FEA) results and comparison with actual data, modeling a PTC as a modified thermal cycling process provides a good prediction of the solder joint life. The analysis is simpler and would be beneficial for getting quick assessments of new leadframe package designs.

Research on Designing the Information Management Platform of Physical Education Based on B/S Model

2014 ◽  
Vol 989-994 ◽  
pp. 5481-5485
Author(s):  
Guo Ying Wang
Keyword(s):  
Physical Education ◽  
Information Management ◽  
Central Processor ◽  
Communication Interface ◽  
Information Platform ◽  
Management Platform ◽  
Central Processor Unit ◽  
Framework Model ◽  
Processor Unit ◽  
S Model

This paper, by using multi-layer B/S framework model, combines with VB programming to carry out innovative design of physical education (PE) platform, which has got the B/S framework platform of PE management. PE information management platform mainly comprises the teacher end, the central processor unit (CPU) and the student end, where the communication interface mainly comprises the editor and the computer, and the input of teacher end includes the computer buttons, sensors, and so on. While for the core parts of the system, they are the CPU and the memory demonstrated by PE. Student end through the I/O expansion function analyzes and displays the teaching sound and video signal displayed by using LED or LCD. Finally, the paper designs the data analysis and transfer function of PE information platform, and obtains the curve of information throughput with time changing, which provides a new computer method for the research of PE.

Three-Dimensional Nonlinear Dynamics of Nonintegral Riser Bundle

1991 ◽  
Vol 35 (01) ◽  
pp. 40-57
Author(s):  
Nickolas Vlahopoulos ◽  
Michael M. Bernitsas
Keyword(s):  
Degrees Of Freedom ◽  
Three Dimensional ◽  
Small Strain ◽  
Computer Code ◽  
Three Dimensions ◽  
Central Processor ◽  
Beam Columns ◽  
Central Processor Unit ◽  
Processor Unit ◽  
Strain Model

The dynamic behavior of a nonintegral riser bundle is studied parametrically. The dynamics of each component-riser is analyzed by a three-dimensional, nonlinear, large deflection, small strain model with coupled bending and torsion. Component-risers are slender, thin-walled, extensible or inextensible tubular beam-columns, subject to response and deformation dependent hydrodynamic loads. The con-nector equations of equilibrium are used to derive the connector forces and moments. Substructuring can thus be achieved even though in three dimensions connectors do not impose linearly dependent deflections at substructure interfaces. The developed time incremental and iterative finite-element computer code is used to analyze the effects of water depth, distribution of connectors, distance between component risers and number of finite elements in the numerical model. The problem of total CPU (central processor unit) time and the advantages of substructuring are discussed by running cases of up to 1094 degrees of freedom.

Design of a Temperature-Constrained Governor to Save Energy in an Open Multi-Frequency Green Router

2013 ◽  
Vol 9 (3) ◽  
pp. 16-34
Author(s):  
Alfio Lombardo ◽  
Diego Reforgiato ◽  
Vincenzo Riccobene ◽  
Giovanni Schembra
Keyword(s):  
Energy Saving ◽  
Engine Performance ◽  
Central Processor ◽  
Clock Frequency ◽  
Traffic Loading ◽  
Working Temperature ◽  
Positive Side ◽  
Central Processor Unit ◽  
Save Energy ◽  
Processor Unit

In the last years a new challenge turned out for both researchers and industries in telecommunications area is represented by green networks. Besides energy saving that is possible to achieve, another positive side effect of this is the reduction of the working temperature of internal components of telecommunications devices (switches, home gateway, routers, etc.). This idea is encouraging the development of routers of reduced dimensions as long as there is the knowledge that the temperature remains in a given range. For this reason the target of this paper is to propose a governor policy that provides the best trade-off between quality of service and energy saving in respect of a given target on the working temperature. More specifically, such a governor is in charge to manage the clock frequency of the Central Processor Unit (CPU) of the green router according to the traffic loading the router, varying the processing engine performance, the working temperature and the power consumption of the hardware at the same time. The proposed policy is then applied to a case study and evaluated by simulation to show how it can be used for the above purposes, and to allow green router designers to control the temperature statistics of a router and design the governor parameters to maintain the mean temperature below a given threshold.

Structure Analysis of Electron Gun Deflection Coil Based on ProE and ANSYS

2011 ◽  
Vol 201-203 ◽  
pp. 1352-1355
Author(s):  
Hai Lang Liu ◽  
Rui Bin Zhang ◽  
Yi Ping Huang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Structure Analysis ◽  
Structural Design ◽  
Electron Gun ◽  
Structure Modeling ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
Coil Size

Through the example of the electron gun deflection coil, this paper implements the structure modeling with ProE and makes the finite element analysis with ANSYS .The structure analysis is performed by the combination of the advantages of two softwares. The reasonableness of the design is verified. This method helps to optimize the structural design of the coil. The production of precision of the coil was improved, and coil size can effectively control and reduce material waste.

A new CUDA-based GPU implementation of the two-dimensional Athena code

2013 ◽  
Vol 61 (1) ◽  
pp. 239-250
Author(s):  
A. Wasiljew ◽  
K. Murawski
Keyword(s):  
Dimensional Space ◽  
Test Cases ◽  
Double Precision ◽  
Central Processor ◽  
Two Dimensional ◽  
Central Processor Unit ◽  
Hardware Configuration ◽  
Cuda Architecture ◽  
Processor Unit ◽  
Gpu Implementation

Abstract We present a new version of the Athena code, which solves magnetohydrodynamic equations in two-dimensional space. This new implementation, which we have named Athena-GPU, uses CUDA architecture to allow the code execution on Graphical Processor Unit (GPU). The Athena-GPU code is an unofficial, modified version of the Athena code which was originally designed for Central Processor Unit (CPU) architecture. We perform numerical tests based on the original Athena-CPU code and its GPU counterpart to make a performance analysis, which includes execution time, precision differences and accuracy. We narrowed our tests and analysis only to double precision floating point operations and two-dimensional test cases. Our comparison shows that results are similar for both two versions of the code, which confirms correctness of our CUDA-based implementation. Our tests reveal that the Athena-GPU code can be 2 to 15-times faster than the Athena-CPU code, depending on test cases, the size of a problem and hardware configuration.

A statistical long-range transport model for simulation of wet sulphate deposition

1989 ◽  
Vol 16 (3) ◽  
pp. 258-266 ◽  
Author(s):  
J. M. Byrne ◽  
E. A. McBean ◽  
K. B. Shipley ◽  
G. J. Farquhar
Keyword(s):  
Long Range ◽  
Transport Model ◽  
Long Range Transport ◽  
Central Processor ◽  
Central Processor Unit ◽  
Range Transport ◽  
Sulphate Deposition ◽  
Time Requirements ◽  
Processor Unit ◽  
Relative Errors

A statistical long-range transport of air pollutants model (UW-LRT) is utilized to simulate wet SO4 deposition in eastern North America in 1980. Model results compare favorably to an analyzed deposition field. In a comparison of the relative errors associated with four long-range transport models, the UW-LRT model demonstrates the lowest variation from recorded, analyzed deposition data. The UW-LRT model has modest data input and central processor unit time requirements. Key words: acid rain, long-range transport, spatial deposition, mathematical models.

scholarly journals Improving the Solder Joint Reliability of a Power Leadframe Package Using Thermomechanical Simulation

2019 ◽  
pp. 1-6
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Mold Material ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Thermomechanical Simulation ◽  
Board Level

Leadframe-based packages are commonly used for semiconductor power devices. With these packages, heat dissipation is much better compared with laminate substrated-based packages. However, the solder joint reliability requirement under thermal cycling condition is also higher and this is what makes the development of a power package challenging. One of the usual requirements from customers is that there should be no solder joint failure up to 2,000 thermal cycles. This paper presents the thermomechanical simulation of a power leadframe package that was conducted to improve its solder joint reliability. Board level solder joint cycle life was predicted using finite element analysis and the result was validated with actual solder life result from board level reliability evaluation. Since available solder prediction equation was for the characteristic life (63.2% accumulative failure), using the normalized characteristic life was implemented for predicting the number of cycles to first failure of the solder joint connection and the approach showed good agreement with the actual result. Results also indicated that the choice of epoxy mold material and the type of PCB (printed circuit board) have a significant contribution to the solder joint reliability performance.

scholarly journals Study on the Impact of Lead Sidewall Solder Coverage and Corner Lead Size on Joint Reliability

2021 ◽  
pp. 62-69
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Integrated Circuit ◽  
High Speed ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Solder Fatigue ◽  
The Impact

Solder joint reliability is very important to ensure that an integrated circuit (IC) semiconductor package is functional within its intended life span as the solder joint establishes electrical connection between the IC and the printed circuit board (PCB). Solder fatigue failure or crack under thermal cycling is one of the common problems with board-mounted packages. There are several factors or package characteristics that have impact on solder fatigue life like package size and material properties of the package components. This paper presents a thermo-mechanical modeling of a leadframe-based semiconductor package to study the impact of lead sidewall solder coverage and corner lead size on the solder joint reliability. Finite element analysis (FEA) technique was used to calculate the solder life considering 50% and 100% package lead sidewall solder coverage as well as smaller and larger critical corner leads of the package. The results of the analysis showed that higher lead sidewall solder coverage and larger lead could significantly increase solder life. Therefore, ensuring lead sidewall solder wettability to have higher solder coverage is beneficial. The study also reveals that packages with side wettable flanks are not only enabling high speed automated optical inspection required for the automotive industry, but they are also providing improved solder joint reliability.

scholarly journals IoT Gas Leakage Detector and Warning Generator

2020 ◽  
Vol 10 (4) ◽  
pp. 6142-6146
Author(s):  
B. F. Alshammari ◽  
M. T. Chughtai
Keyword(s):  
Detection System ◽  
Gas Detection ◽  
The Internet ◽  
Central Processor ◽  
Atmospheric Conditions ◽  
Gas Leakage ◽  
Central Processor Unit ◽  
Industrial Monitoring ◽  
Processor Unit ◽  
The Internet Of Things

This paper presents an industrial monitoring system design using the Internet of Things (IoT). The gas sensor (MQ-5) captured information is posted into a data cloud. The sensor detects the leakage of gas under most atmospheric conditions. All the components are controlled by an Arduino (UNO-1) that acts as a central processor unit in the setup t. As soon as a gas leakage is detected by the sensor, the alarm is raised in the form of a buzzer. This alarm is supported by an LCD to display the location of leakage, alert the observer, and activate the exhaust fan in the particular section to extract leaked gas. The requirement of a gas detection system is not only to monitor continuously the surroundings but also to help prevent the gas leakage hence minimizing the chances of fire and damage.

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