Fundamental Machining Characteristics of Ultrasonic-Assisted Electrochemical Grinding of Ti–6Al–4V

2018 ◽  
Vol 140 (7) ◽  
Author(s):  
Sisi Li ◽  
Yongbo Wu ◽  
Mitsuyoshi Nomura ◽  
Tatsuya Fujii
Keyword(s):  
Surface Damage ◽  
Drop Out ◽  
Wheel Wear ◽  
Work Surface ◽  
Ultrasonic Assisted ◽  
Conventional Grinding ◽  
Chip Adhesion ◽  
Wheel Radius ◽  
Electrochemical Grinding ◽  
Machining Characteristics

The Ti–6Al–4V is a widely used alloy in the aerospace industry. In order to improve the grindability of Ti–6Al–4V, a hybrid material removal process is proposed in this study. This process is a combination of ultrasonic assisted grinding (UAG) and electrochemical grinding (ECG), hereafter called ultrasonic assisted electrochemical grinding (UAECG). For confirming the feasibility of the proposed technique, an experimental setup was constructed and the fundamental machining characteristics of UAECG in the grinding of Ti–6Al–4V were experimentally investigated. The results obtained from the investigation can be summarized as follows: (1) the normal and tangential forces in UAECG were decreased approximately 57% and 56%, respectively, comparing with conventional grinding (CG). (2) The work-surface roughness Ra both in ECG and UAECG was negative correlation to the electrolytic voltage, UI, and the surface damage; (3) the wheel radius wear in UAECG was considerably smaller than that in ECG when UI < 10 V. The chip adhesion and the grain fracture mainly affected the working lives of the wheels in ECG and UAECG, whereas the wheel wear in CG was predominantly attributed to the grain drop out; (4) a titanium dioxide (TiO2) layer, which had a 78 nm thickness was achieved on the work surface in the condition of UI = 20 V, leading that the Vickers microhardness of work surface in ultrasonic assisted electrochemical was lower than that in CG by 15%.

Fundamental Investigation of Ultrasonic Assisted Pulsed Electrochemical Grinding of Ti-6Al-4V

2016 ◽  
Vol 874 ◽  
pp. 279-284 ◽  
Author(s):  
Si Si Li ◽  
Yong Bo Wu ◽  
Mitsuyoshi Nomura
Keyword(s):  
Vibration Amplitude ◽  
Material Removal ◽  
Input Voltage ◽  
Grinding Forces ◽  
Work Surface ◽  
Fundamental Investigation ◽  
Ultrasonic Assisted ◽  
Conventional Grinding ◽  
Actual Material ◽  
Electrochemical Grinding

Aiming at the development of a novel grinding technology for the highly efficient machining of difficult to machine materials such as Ti-6Al-4V, an ultrasonic assisted pulsed electrochemical grinding (UAECG) method was proposed. The current work is to reveal the fundamental grinding characteristics of the UAECG of Ti-6Al-4V by experimentally investigating the effect of vibration amplitude on grinding forces, actual material removal and work-surface roughness under different process parameters such as the input voltage and rotational speed. Summarizing the obtained results revealed that the grinding forces in UAECG are significantly smaller than those in conventional grinding (CG).

Fundamental Machining Characteristics of Ultrasonic Assisted Turning of Titanium Alloy Ti-6Al-4V

2013 ◽  
Vol 797 ◽  
pp. 344-349 ◽  
Author(s):  
Yong Bo Wu ◽  
Jing Ti Niu ◽  
M. Fujimoto ◽  
Mitsuyoshi Nomura
Keyword(s):  
Titanium Alloy ◽  
Cutting Force ◽  
High Efficiency ◽  
Experimental Investigations ◽  
Work Surface ◽  
Ultrasonic Assisted ◽  
Cutting Force Components ◽  
Level 3 ◽  
Force Components ◽  
Machining Characteristics

In this paper, a new machining method is proposed for the high efficiency turning of titanium alloy Ti-6Al-4V in which the cutting tool is ultrasonically vibrated. An experimental setup is constructed by installing an ultrasonic cutting unit onto a NC lathe followed by experimental investigations on the fundamental machining characteristics. The results obtained in the current work showed that (1) the cutting force decreases with the increase in the power supplying level (i.e., the ultrasonic vibration (UV) amplitude), e.g., the cutting force components in X-. Y-and Z-directions were decreased by 48%, 45% and 87%, respectively, once the UV has been applied to the tool at the power supplying level of 50%; (2) the cutting marks with knit pattern are formed on work-surface with UV while the parallel distributed cutting marks are generated without UV, and the surface roughness is decreased by up to 10% when the UV is applied at an appropriate power supplying level; (3) the work-surface straightness is improved by 46% once the UV is applied.

Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire – Surface Formation Characteristics

2010 ◽  
Vol 126-128 ◽  
pp. 367-372 ◽  
Author(s):  
Zhi Qiang Liang ◽  
Xi Bin Wang ◽  
Yong Bo Wu ◽  
Wen Xiang Zhao
Keyword(s):  
Surface Roughness ◽  
High Performance ◽  
Depth Of Cut ◽  
Surface Formation ◽  
Work Surface ◽  
Ultrasonic Assisted Grinding ◽  
Bending Mode ◽  
Ultrasonic Assisted ◽  
Conventional Grinding ◽  
Elliptical Motion

This study investigates surface formation characteristics in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire. During EUAG process, the workpiece is imposed to ultrasonically vibrate in two directions, i.e., vertical and parallel to work-surface, by using an elliptical ultrasonic vibrator. In our previous work, the vibrator has been produced by bonding a piezoelectric ceramic device (PZT) on a metal elastic body. When two alternating current voltages with a phase difference are applied to the PZT at the same frequency that is close to the resonant frequency of the longitudinal and bending mode of the vibrator, two dimensional ultrasonic vibrations are generated simultaneously, resulting in an elliptical motion on the end face of the vibrator. In this paper, to clarify the work-surface formation characteristics in EUAG of sapphire material, grinding experiments are carried out involving sapphire substrate. In experiments, work-surface roughness is measured, and the ground work-surface morphology is examined by scanning electron microscope (SEM). The experimental results are summarized as: (1) Compared with conventional grinding (CG), the elliptical vibration leads to a decrease of surface roughness up to 25% in EUAG; (2) The surface roughness has a monotonously increasing trend with the increasing wheel depth of cut in both EUAG and CG, but has little variation with the worktable feed rate. As the wheel speed increases, the surface roughness decreases until it reaches a minimum, and then increases in a monotonous trend in both EUAG and CG; (3) The surface quality in EUAG has a significant improvement, and it is prone to achieve the ductile regime grinding of sapphire compared with CG. These indicate that the elliptical ultrasonic assisted grinding is an efficient technique for high performance machining of monocrystal sapphire.

Research on Surface Formation Mechanism in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire Using Structure Function Fractal Method

2015 ◽  
Author(s):  
Qiuyan Wang ◽  
Zhiqiang Liang ◽  
Xibin Wang ◽  
Wenxiang Zhao ◽  
Yongbo Wu ◽  
...  
Keyword(s):  
Fractal Dimension ◽  
Structure Function ◽  
Ground Surface ◽  
Surface Characteristics ◽  
Fractal Method ◽  
Surface Formation ◽  
Work Surface ◽  
Ultrasonic Assisted Grinding ◽  
Ultrasonic Assisted ◽  
Conventional Grinding

This study investigates surface formation characteristics in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using structure function fractal method. During the EUAG process, the workpiece is imposed to ultrasonically vibrate in two directions, i.e., vertical and parallel to work-surface, by using an elliptical ultrasonic vibrator. To clarify the work-surface formation characteristics in EUAG of sapphire material, grinding experiments are carried out involving sapphire substrate. In experiments, work-surface roughness is measured, and the ground work-surface morphology is examined by scanning electron microscope (SEM) and its fractal dimension was calculated by structure function method. The fractal dimension of ground surface in EUAG is bigger than that in conventional grinding (CG), meaning that the ground surface in EUAG is more exquisite and better than that in CG. Therefore, the fractal analysis method has the potential to reveal the ground surface characteristics in EUAG of monocrystal sapphire.

Wear Behavior of Grain Cutting Edge in Ultrasonic Assisted Grinding Using Mini-Size Wheel

2015 ◽  
Vol 9 (4) ◽  
pp. 365-372 ◽  
Author(s):  
Masakazu Fujimoto ◽  
◽  
Yongbo Wu ◽  
Mitsuyoshi Nomura ◽  
Hidenari Kanai ◽  
...  
Keyword(s):  
Wear Behavior ◽  
Diamond Wheel ◽  
Cutting Edge ◽  
Grinding Forces ◽  
Wheel Wear ◽  
Workpiece Surface ◽  
Ultrasonic Assisted Grinding ◽  
Ultrasonic Assisted ◽  
Conventional Grinding ◽  
The Stability

This paper deals with the wear behavior of the mini-size diamond wheel used in Ultrasonic Assisted Grinding (UAG). The aim is to understand the wheel wear behavior. Sequential changes of the surface topography of the mini-size wheel, such as the number and shape of grains of the cutting edge, during the on-surface UAG process were observed and evaluated quantitatively using a Scanning Electron Microscope with four electron probes (3D-SEM). The obtained results show that a good wheel surface is maintained during the UAG process compared with the Conventional Grinding (CG) process. In particular, a number of sharp grain cutting edges are larger in the UAG process than those of the CG process. Additionally, these results are closely related to the stability of grinding forces and the reduction of the finished workpiece surface.

Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire – Wear Behaviors of Resin Bond Diamond Wheel

2010 ◽  
Vol 126-128 ◽  
pp. 573-578 ◽  
Author(s):  
Yong Bo Wu ◽  
Zhi Qiang Liang ◽  
Xi Bin Wang ◽  
Wei Min Lin
Keyword(s):  
Diamond Wheel ◽  
Grinding Force ◽  
Grinding Forces ◽  
Wheel Wear ◽  
Wear Process ◽  
Work Surface ◽  
Ultrasonic Assisted Grinding ◽  
Abrasive Grains ◽  
Experimental Apparatus ◽  
Ultrasonic Assisted

This paper describes the wear behaviors of a resin bond diamond wheel in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire. The EUAG is a new grinding method proposed by the present authors in which an elliptical ultrasonic vibration is imposed on the workpiece by using an elliptical ultrasonic vibrator. In our previous work, an experimental apparatus mainly composed of the vibrator was produced and grinding experiments were conducted involving sapphire workpiece. In this paper, further investigations focusing on the wear behaviors of resin bond diamond wheel in EUAG of sapphire were carried out experimentally. The obtained results showed that: (1) the wheel wear process can be divided to three regions according to the variation trend of grinding forces, i.e., an initial region, a steady region, and a deteriorated region; (2) in the initial and steady regions, the grinding forces and the ratio of the normal grinding force to the tangential grinding force in EUAG are much smaller than that in conventional grinding (CG), but in deteriorated region, the grinding forces in EUAG are increased significantly up to be larger than that in CG whereas the grinding forces ratio has few difference between those in EUAG and CG; (3) in all the regions, the work-surface in EUAG is much smoother than that in CG whereas the wheel wear has little influence on the work-surface roughness; (4) the wheel wear in CG is mainly caused by the attrition wear and the macro-fracture and pullout of abrasive grains, while in EUAG by the micro-fracture and cleavage of abrasive grains.

Experimental Research on Surface Roughness of Ultrasonic Assisted Grinding on 7075 Aluminum Alloy

2021 ◽  
Vol 1047 ◽  
pp. 62-67
Author(s):  
Shen Wang ◽  
Le Tong ◽  
Guang Jun Chen ◽  
Mao Xun Wang ◽  
Bin Dai ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Aluminum Alloy ◽  
Processing Parameters ◽  
7075 Aluminum Alloy ◽  
Machined Surface ◽  
Ultrasonic Assisted Grinding ◽  
Great Performance ◽  
Ultrasonic Assisted ◽  
Conventional Grinding ◽  
Micro Morphology

7075 aluminum alloy is widely used due to its great performance, especially in aerospace area. In this paper, ultrasonic-assisted grinding technology is used to process 7075 aluminum alloy. The data is obtained through experiments, and the surface roughness and morphology of ultrasonic assisted grinding and conventional grinding under different spindle speeds, feed rates, and amplitudes are analyzed. Research has found that the increase in spindle speed and amplitude will improve the quality of the machined surface and reduce the surface roughness by 82.1% and 36%. However, with the increase of feed rate, the surface quality decreased significantly, and the surface roughness increased by 55.6%. The surface micro-morphology of the machined workpiece is observed, and the effects of different processing parameters on the surface micro-morphology are obtained.

Effect of Complex Electrodischarge Grinding for Electrically Conductive PCD

2011 ◽  
Vol 325 ◽  
pp. 276-281 ◽  
Author(s):  
Manabu Iwai ◽  
Shinichi Ninomiya ◽  
Kiyoshi Suzuki
Keyword(s):  
High Efficiency ◽  
Low Cost ◽  
Surface Condition ◽  
High Hardness ◽  
Grinding Wheel ◽  
Wheel Wear ◽  
Electrically Conductive ◽  
Grinding Method ◽  
Conventional Grinding ◽  
Composite Diamond

Polycrystalline Composite Diamond (PCD) is excellent in chipping resistance despite its very high hardness. However, it is not easy to EDM or grind PCD. To realize high efficiency and high quality processing of PCD simply and at low cost, the authors devised new PCD (EC-PCD) by using electrically conductive diamond particles and applied a complex electrodischarge grinding method. In this study, investigation is made on effective grinding condition to realize high efficiency, low and stable grinding force and low wheel wear in complex electrodischarge grinding. As a result, superior grinding property was obtained when the grinding wheel was set at minus polarity, and set peak current of iP = 4 and 6 A was applied. Furthermore it also became clear that additional conventional grinding process followed after complex electrodischarge grinding improved the surface condition.

Experimental Study on the Mechanism of Axial Ultrasonic-Assisted Grinding

2012 ◽  
Vol 490-495 ◽  
pp. 2449-2453
Author(s):  
S.X. Yuan ◽  
M. Xiao
Keyword(s):  
Experimental Study ◽  
Grinding Force ◽  
Paper Analysis ◽  
Kinematics Model ◽  
Ultrasonic Assisted Grinding ◽  
Ultrasonic Assisted ◽  
Conventional Grinding

This paper analysis the mechanism of axial ultrasonic-assisted grinding(AUAG), by establishing the kinematics model of a single grit; The reason why AUAG forces are more lower than conventional grinding(CG) forces is presented, and the experiments of the grinding force in AUAG comparison with CG were carried out. The results indicate that the grinding force of the superalloy in AUAG is about 40% to 50% less than that in CG.

A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer

2014 ◽  
Vol 983 ◽  
pp. 208-213 ◽  
Author(s):  
Yong Bo Wu ◽  
Li Jun Wang
Keyword(s):  
Surface Quality ◽  
Silicon Wafer ◽  
Removal Rate ◽  
High Profile ◽  
Work Surface ◽  
Ultrasonic Assisted ◽  
Polishing Efficiency ◽  
Profile Accuracy ◽  
Abrasive Process ◽  
Fixed Abrasive

Chemical mechanical polishing (CMP) is often employed to obtain a super smooth work-surface of a silicon wafer. However, as a conventional CMP is a loose abrasive process, it is hard to achieve the high profile accuracy and lots of slurry must be supplied during CMP operations. As an alternate solution, a fixed abrasive CMP process can offer better geometrical accuracy and discharges less waste disposal. In this paper, in order to enhance the polishing efficiency and improve the work-surface quality, a novel ultrasonic assisted fixed abrasive CMP (UF-CMP) is proposed and the fundamental machining characteristics of the UF-CMP of a silicon wafer is investigated experimentally. The results show that with the ultrasonic assistance, the material removal rate (MRR) is increased, and the surface quality is improved.

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