scholarly journals Reduced-Order Distributed Fault Diagnosis for Large-Scale Nonlinear Stochastic Systems

Author(s):  
Elaheh Noursadeghi ◽  
Ioannis A. Raptis

This paper deals with the distributed fault detection and isolation problem of uncertain, nonlinear large-scale systems. The proposed method targets applications where the computation requirements of a full-order failure-sensitive filter would be prohibitively demanding. The original process is subdivided into low-order interconnected subsystems with, possibly, overlapping states. A network of diagnostic units is deployed to monitor, in a distributed manner, the low-order subsystems. Each diagnostic unit has access to a local and noisy measurement of its assigned subsystem's state, and to processed statistical information from its neighboring nodes. The diagnostic algorithm outputs a filtered estimate of the system's state and a measure of statistical confidence for every fault mode. The layout of the distributed failure-sensitive filter achieves significant overall complexity reduction and design flexibility in both the computational and communication requirements of the monitoring network. Simulation results demonstrate the efficiency of the proposed approach.

Author(s):  
Elaheh Noursadeghi ◽  
Ioannis Raptis

This paper deals with the problem of designing a distributed fault detection and isolation algorithm for nonlinear large-scale systems that are subjected to multiple fault modes. To solve this problem, a network of detection nodes is deployed to monitor the monolithic system. Each node consists of an estimator with partial observation of the system’s state. The local estimator executes a distributed variation of the particle filtering algorithm; that process the local sensor measurements and the fault progression model of the system. In addition, each node communicates with its neighbors by sharing pre-processed information. The communication topology is defined using graph theoretic tools. The information fusion between the neighboring nodes is performed by a distributed average consensus algorithm to ensure the agreement on the value of the local estimates. The simulation results demonstrate the efficiency of the proposed approach.


Energies ◽  
2020 ◽  
Vol 14 (1) ◽  
pp. 176
Author(s):  
Iñigo Aramendia ◽  
Unai Fernandez-Gamiz ◽  
Adrian Martinez-San-Vicente ◽  
Ekaitz Zulueta ◽  
Jose Manuel Lopez-Guede

Large-scale energy storage systems (ESS) are nowadays growing in popularity due to the increase in the energy production by renewable energy sources, which in general have a random intermittent nature. Currently, several redox flow batteries have been presented as an alternative of the classical ESS; the scalability, design flexibility and long life cycle of the vanadium redox flow battery (VRFB) have made it to stand out. In a VRFB cell, which consists of two electrodes and an ion exchange membrane, the electrolyte flows through the electrodes where the electrochemical reactions take place. Computational Fluid Dynamics (CFD) simulations are a very powerful tool to develop feasible numerical models to enhance the performance and lifetime of VRFBs. This review aims to present and discuss the numerical models developed in this field and, particularly, to analyze different types of flow fields and patterns that can be found in the literature. The numerical studies presented in this review are a helpful tool to evaluate several key parameters important to optimize the energy systems based on redox flow technologies.


2020 ◽  
Vol 53 (2) ◽  
pp. 1862-1867
Author(s):  
Mahathi Anand ◽  
Abolfazl Lavaei ◽  
Majid Zamani

2021 ◽  
Author(s):  
Cemanur Aydinalp ◽  
Sulayman Joof ◽  
Mehmet Nuri Akinci ◽  
Ibrahim Akduman ◽  
Tuba Yilmaz

In the manuscript, we propose a new technique for determination of Debye parameters, representing the dielectric properties of materials, from the reflection coefficient response of open-ended coaxial probes. The method retrieves the Debye parameters using a deep learning model designed through utilization of numerically generated data. Unlike real data, using synthetically generated input and output data for training purposes provides representation of a wide variety of materials with rapid data generation. Furthermore, the proposed method provides design flexibility and can be applied to any desired probe with intended dimensions and material. Next, we experimentally verified the designed deep learning model using measured reflection coefficients when the probe was terminated with five different standard liquids, four mixtures,and a gel-like material.and compared the results with the literature. Obtained mean percent relative error was ranging from 1.21±0.06 to 10.89±0.08. Our work also presents a large-scale statistical verification of the proposed dielectric property retrieval technique.


2014 ◽  
Vol 62 (3) ◽  
pp. 571-582 ◽  
Author(s):  
J.M. Kościelny ◽  
M. Syfert

Abstract The survey presents a selection of the methods of the fault detection and isolation suitable to be useful for the diagnostics of the complex, large scale industrial processes. The paper focuses on these methods that have appropriately high level of potential applicability in industrial practice. The novelty of the paper relies on the discussion of the dependency of the level of knowledge about diagnosed process and recommended diagnostic approaches. Appropriate recommendations were given in the convenient form of the table


2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000377-000397
Author(s):  
Jon G. Aday ◽  
Ted Tessier ◽  
Kazuhisa Itoi ◽  
Satoshi Okude

Embedded die substrate technologies are being developed in an assortment of configurations and for different market segments. The technology being discussed in this paper will be focused on both a fan out technology – ChipsetT Fan-Out and a system in package approach (ChipsetT SiP) in which a multiple component bill of materials (BOM) is used. The Chipset process is based on the WABE (Wafer and Board Level Embedding) technology. WABE technology is based on co-lamination of multilayer polyimide flex wiring and conductive z-axis sintered metal interconnections. This ChipsetT Fan Out technology allows for large scale production of fan out type solutions which can allow for very thin packages in addition to unique pin out solutions such as pin compatibility for a competitor part. The ChipsetT SiP also allows embedding of single or multiple silicon die and/or components. Additional components can also be placed using conventional SMT on the top or bottom side of the package. There is a great deal of design flexibility with this technology which makes it a great solution for applications trying to reduce their x-y size or z-height. When utilizing RDL technology on the embedded die we are able to do the fine pitch routing in order to allow the substrate to route at larger pitches ensuring an overall cost effective solution. This paper will focus on the different classes of applications that have benefited from this technology and will discuss the benefits and tradeoffs of the different solutions that have been engineered. Assembly and reliability data will be presented on several of the applications showing a robust solution set.


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