On Temporal Biphilicity: Definition, Relevance, and Technical Implementation in Boiling Heat Transfer

2017 ◽  
Vol 139 (11) ◽  
Author(s):  
Christophe Frankiewicz ◽  
Daniel Attinger
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Large Scale ◽  
High Efficiency ◽  
Pool Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Functional Surfaces ◽  
Phase Change Heat Transfer

Solid–fluid interfaces switching from a superhydrophilic to a superhydrophobic wetting state are desired for their ability to control and enhance phase-change heat transfer. Typically, these functional surfaces are fabricated from polymers and modify their chemistry or texture upon the application of a stimulus. For integration in relevant phase-change heat transfer applications, several challenges need to be overcome, of chemical stability, mechanical and thermal robustness, as well as large scale manufacturing. Here, we describe the design and fabrication of metallic surfaces that reversibly switch between hydrophilic and superhydrophobic states, in response to pressure and temperature stimuli. Characterization of the surfaces in pool boiling experiments verifies their thermal and mechanical robustness, and the fabrication method is scalable to large areas. During pool boiling experiments, it is experimentally demonstrated that the functional surfaces can be actively switched between a high-efficiency mode suitable at low heat flux, and a high-power mode suitable for high heat flux applications.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

Observations of the Critical Heat Flux Process During Pool Boiling of FC-72

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
J. Jung ◽  
S. J. Kim ◽  
J. Kim
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Critical Heat Flux ◽  
Pool Boiling ◽  
High Heat ◽  
Line Length ◽  
Boiling Curve ◽  
High Heat Flux ◽  
Transfer Coefficients ◽  
Ir Camera

Experimental work was undertaken to investigate the process by which pool-boiling critical heat flux (CHF) occurs using an IR camera to measure the local temperature and heat transfer coefficients on a heated silicon surface. The wetted area fraction (WF), the contact line length density (CLD), the frequency between dryout events, the lifetime of the dry patches, the speed of the advancing and receding contact lines, the dry patch size distribution on the surface, and the heat transfer from the liquid-covered areas were measured throughout the boiling curve. Quantitative analysis of this data at high heat flux and transition through CHF revealed that the boiling curve can simply be obtained by weighting the heat flux from the liquid-covered areas by WF. CHF mechanisms proposed in the literature were evaluated against the observations.

High Heat Flux Phase Change on Silicon Wick Structures

2012 ◽  
Author(s):  
Qingjun Cai ◽  
Avijit Bhunia ◽  
Yuan Zhao
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Test Chamber ◽  
Nucleate Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Wick Structure ◽  
Silicon Pillars

Silicon is the major material in IC manufacture. It has high thermal conductivity and is compatible with precision micro-fabrication. It also has decent thermal expansion coefficient to most semiconductor materials. These characteristics make it an ideally underlying material for fabricating micro/mini heat pipes and their wick structures. In this paper, we focus our research investigations on high heat flux phase change capacity of the silicon wick structures. The experimental wick sample is composed of silicon pillars 320μm in height and 30 ∼ 100μm in diameter. In a stainless steel test chamber, synchronized visualizations and measurements are performed to crosscheck experimental phenomena and data. Using the mono-wick structure with large silicon pillar of 100μm in diameter, the phase change on the silicon wick structure reaches its maximum heat flux at 1,130W/cm2 over a 2mm×2mm heating area. The wick structure can fully utilize the wick pump capability to supply liquid from all 360° directions to the center heating area. In contrast, the large heating area and fine silicon pillars 10μm in diameter significantly reduces liquid transport capability and suppresses generation of nucleate boiling. As a result, phase change completely relies on evaporation, and the CHF of the wick structure is reduced to 180W/cm2. An analytical model based on high heat flux phase change of mono-porous wick structures indicates that heat transfer capability is subjected to the ratio between the wick particle radius and the heater dimensions, as well as vapor occupation ratio of the porous volume. In contrast, phase change heat transfer coefficients of the wick structures essentially reflect material properties of wick structure and mechanism of two-phase interactions within wick structures.

Enhanced Pool Boiling Performance on Micro-, Nano-, and Hybrid-Structured Surfaces

2011 ◽  
Author(s):  
Qian Li ◽  
Wei Wang ◽  
Chris Oshman ◽  
Benoit Latour ◽  
Chen Li ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Thermal Management ◽  
Pool Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Structured Surfaces ◽  
Maximum Heat Transfer ◽  
Functional Components

Thermal management plays an important role in both high power electronics and energy conversion systems. A key issue in thermal management is the dissipation of the high heat flux generated by functional components. In this paper, various microstructures, nanostructures and hybrid micro/nano-structures were successfully fabricated on copper (Cu) surfaces, and the corresponding pool boiling heat transfer performance was systematically studied. It is found that the critical heat flux (CHF) of hybrid structured surfaces is about 15% higher than that of the surfaces with nanowires only and micro-pillars only. More importantly, the superheat at CHF for the hybrid structured surface is much smaller than that of the micro-pillared surface (about 35%), and a maximum heat transfer coefficient (HTC) of about 90,000W/m2K is obtained. Compared with the known best pool boiling performance on biporous media, a much larger HTC and much lower superheat at a heat flux of 250W/cm2 have been obtained on the novel hybrid-structured surfaces.

High Heat Flux Dissipation Using Symmetric Dual-Taper Manifold in Pool Boiling

2019 ◽  
Author(s):  
Aranya Chauhan ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pool Boiling ◽  
Heat Removal ◽  
Heating Surface ◽  
High Heat ◽  
Copper Surface ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Continuous Increase

Abstract The trend of miniaturization in electronics presents a great challenge in the thermal management of devices. The continuous increase in the number of transistors in the processor leads to high heat flux generation, limiting the performance of the device. Boiling heat transfer offers a great heat removal competency while maintaining the low chip temperatures. The critical heat flux (CHF) dictates the maximum heat removal ability, and heat transfer coefficient (HTC) defines the efficiency of the boiling process. This pool boiling study is focused on using a manifold containing a symmetric dual taper over the heating surface. The heat transfer performance of this configuration is evaluated for different taper angles in the manifold. The macro-convection assisted by vapor columns during boiling enhance the CHF and HTC limit significantly. A CHF of 287 W/cm2 with an HTC of 116 kW/cm2°C was achieved with a plain copper surface, representing greater than a 2-fold increases in each over a plain surface.

Effect of Channel Width on Pool Boiling Enhancement of Open Microchannels With Selective Sintered Porous Coatings

2015 ◽  
Author(s):  
Arvind Jaikumar ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
High Speed ◽  
Pool Boiling ◽  
Underlying Mechanism ◽  
High Heat ◽  
Channel Width ◽  
High Heat Flux ◽  
Porous Coatings ◽  
Open Microchannel

Thermal management in microelectronic devices involves development of high heat flux removal systems to meet the cooling requirements. Pool boiling addresses these demands by using latent heat transfer. In this study, heat transfer surfaces are fabricated by depositing porous coatings on an open microchannel surface. Screen printing and sintering are identified as techniques to deposit porous coatings and ensure substrate bonding respectively. Firstly, the effect of selective enhancement was studied by depositing porous coatings on (i) fin tops only (sintered-fin-tops), (ii) channels only (sintered-channels), and (iii) completely covering the boiling surface (sintered-throughout). The pool boiling performance with saturated distilled water at atmospheric pressure was obtained and a maximum critical heat flux (CHF) of 313 W/cm2 at a wall superheat of 7.5 °C was reported here for a sintered-throughout surface. Furthermore, the effect of channel width on sintered-throughout surfaces was studied. The results indicated that channel width plays an important in improving the performance. High speed videos are taken to understand the underlying mechanism. Additional nucleation sites and separate liquid-vapor pathways are identified as contributing mechanisms for the enhancement in CHF and heat transfer coefficient (HTC).

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