scholarly journals Selecting Optimal Parallel Microchannel Configuration(s) for Active Hot Spot Mitigation of Multicore Microprocessors in Real Time

2017 ◽  
Vol 139 (10) ◽  
Author(s):  
Lakshmi Sirisha Maganti ◽  
Purbarun Dhar ◽  
T. Sundararajan ◽  
Sarit K. Das
Keyword(s):  
Heat Flux ◽  
Real Time ◽  
Heat Load ◽  
Hot Spot ◽  
Heat Removal ◽  
Lagrangian Model ◽  
Brownian Diffusion ◽  
Multicore Microprocessors ◽  
Flow Maldistribution ◽  
Hot Zone

Design of effective microcooling systems to address the challenges of ever increasing heat flux from microdevices requires deep examination of real-time problems and has been tackled in depth. The most common (and apparently misleading) assumption while designing microcooling systems is that the heat flux generated by the device is uniform, but the reality is far from this. Detailed simulations have been performed by considering nonuniform heat load employing the configurations U, I, and Z for parallel microchannel systems with water and nanofluids as the coolants. An Intel® Core™ i7-4770 3.40 GHz quad core processor has been mimicked using heat load data retrieved from a real microprocessor with nonuniform core activity. This study clearly demonstrates that there is a nonuniform thermal load induced temperature maldistribution along with the already existent flow maldistribution induced temperature maldistribution. The suitable configuration(s) for maximum possible overall heat removal for a hot zone while maximizing the uniformity of cooling have been tabulated. An Eulerian–Lagrangian model of the nanofluids shows that such “smart” coolants not only reduce the hot spot core temperature but also the hot spot core region and thermal slip mechanisms of Brownian diffusion and thermophoresis are at the crux of this. The present work conclusively shows that high flow maldistribution leads to high thermal maldistribution, as the common prevalent notion is no longer valid and existing maldistribution can be effectively utilized to tackle specific hot spot location, making the present study important to the field.

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Abas Abdoli ◽  
George S. Dulikravich ◽  
Genesis Vasquez ◽  
Siavash Rastkar
Keyword(s):  
Heat Flux ◽  
Thermal Stresses ◽  
Hot Spot ◽  
Heat Removal ◽  
High Heat ◽  
Heat Transfer Analysis ◽  
Deformation Analysis ◽  
High Heat Flux ◽  
Cooling Design ◽  
Microchannel Cooling

Two-layer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 × 2.45 mm footprint and a hot spot of 0.5 × 0.5 mm in its center was studied in this research. Two different cases were simulated in which heat fluxes of 1500 W cm−2 and 2000 W cm−2 were applied at the hot spot. Heat flux of 1000 W cm−2 was applied on the rest of the chip. Each microchannel layer had 20 channels with an aspect ratio of 4:1. Direction of the second microchannel layer was rotated 90 deg with respect to the first layer. Fully three-dimensional (3D) conjugate heat transfer analysis was performed to study the heat removal capacity of the proposed two-layer microchannel cooling design for high heat flux chips. In the next step, a linear stress analysis was performed to investigate the effects of thermal stresses applied to the microchannel cooling design due to variations of temperature field. Results showed that two-layer microchannel configuration was capable of removing heat from high heat flux chips with a hot spot.

scholarly journals Simultaneous real time estimation of heat flux and hot spot temperature in machining process using infrared camera

2021 ◽  
Vol 28 ◽  
pp. 101352
Author(s):  
Rodrigo Gustavo Dourado da Silva ◽  
Diego Correa Ferreira ◽  
Fernando Viana Avelar Dutra ◽  
Sandro Metrevelle Marcondes Lima e Silva
Keyword(s):  
Heat Flux ◽  
Real Time ◽  
Hot Spot ◽  
Infrared Camera ◽  
Time Estimation ◽  
Machining Process ◽  
Real Time Estimation ◽  
Spot Temperature

STABLE, CALM, AND HIGH-HEAT-FLUX HEAT REMOVAL USING A POROUS-MICRO-CHANNEL

2017 ◽  
Author(s):  
Tomio Okawa ◽  
Junki Ohashi ◽  
Ryo Hirata ◽  
Koji Enoki
Keyword(s):  
Heat Flux ◽  
Heat Removal ◽  
High Heat ◽  
High Heat Flux ◽  
Micro Channel

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

scholarly journals MHD squeezed Darcy–Forchheimer nanofluid flow between two h–distance apart horizontal plates

Open Physics ◽  
2020 ◽  
Vol 18 (1) ◽  
pp. 1100-1107
Author(s):  
Ghulam Rasool ◽  
Waqar A. Khan ◽  
Sardar Muhammad Bilal ◽  
Ilyas Khan
Keyword(s):  
Heat Flux ◽  
Fluid Flow ◽  
Velocity Field ◽  
Concentration Distribution ◽  
Numerical Data ◽  
Brownian Diffusion ◽  
Nanofluid Flow ◽  
Viscosity Parameter ◽  
Thermal Distribution ◽  
Factor Data

Abstract This research is mainly concerned with the characteristics of magnetohydrodynamics and Darcy–Forchheimer medium in nanofluid flow between two horizontal plates. A uniformly induced magnetic impact is involved at the direction normal to the lower plate. Darcy–Forchheimer medium is considered between the plates that allow the flow along horizontal axis with additional effects of porosity and friction. The features of Brownian diffusive motion and thermophoresis are disclosed. Governing problems are transformed into nonlinear ordinary problems using appropriate transformations. Numerical Runge–Kutta procedure is applied using MATLAB to solve the problems and acquire the data for velocity field, thermal distribution, and concentration distribution. Results have been plotted graphically. The outcomes indicate that higher viscosity results in decline in fluid flow. Thermal profile receives a decline for larger viscosity parameter; however, Brownian diffusion and thermophoresis appeared as enhancing factors for the said profile. Numerical data indicate that heat flux reduces for viscosity parameter. However, enhancement is observed in skin-friction for elevated values of porosity factor. Data of this paper are practically helpful in industrial and engineering applications of nanofluids.

New Thermal Issues on the Modelling of Tool-Workpiece Interaction: Application to Dry Cutting of AISI 1045 Steel

2011 ◽  
Vol 223 ◽  
pp. 286-295 ◽  
Author(s):  
Cédric Courbon ◽  
Tarek Mabrouki ◽  
Joël Rech ◽  
Denis Mazuyer ◽  
Enrico D'Eramo
Keyword(s):  
Heat Flux ◽  
Hot Spot ◽  
Orthogonal Cutting ◽  
Chip Thickness ◽  
Contact Length ◽  
Dry Cutting ◽  
Aisi 1045 Steel ◽  
Aisi 1045 ◽  
1045 Steel ◽  
Coated Carbide

The present work proposes to enhance the thermal interface denition in Finite Element (FE) simulations of machining. A user subroutine has been developed in Abaqus/Explicit © to implement a new experimentally-based heat partition model extracted from tribological tests. A 2D Arbitrary-Lagragian-Eulerian (ALE) approach is employed to simulate dry orthogonal cutting of AISI 1045 steel with coated carbide inserts. Simulation results are compared to experimental ones over a whole range of cutting speeds and feed rates in terms of average cutting forces, chip thickness, tool chip contact length and heat flux. This study emphasizes that heat transfer and temperature distribution in the cutting tool are drastically in uenced by the thermal formulation used at the interface. Consistency of the numerical results such as heat flux transmitted to the tool, peak temperature as well as hot spot location can be denitively improved.

Fluid turbulence simulations of divertor heat load for ITER hybrid scenario using BOUT++

2021 ◽  
Author(s):  
Xueyun Wang ◽  
Xueqiao Xu ◽  
Philip B Snyder ◽  
Zeyu Li
Keyword(s):  
Heat Flux ◽  
Steady State ◽  
Energy Loss ◽  
Heat Load ◽  
Type I ◽  
Fluid Turbulence ◽  
Drift Model ◽  
Steady State Operation ◽  
Different Types ◽  
The One

Abstract The BOUT++ six-field turbulence code is used to simulate the ITER 11.5MA hybrid scenario and a brief comparison is made among ITER baseline, hybrid and steady-state operation (SSO) scenarios. Peeling-ballooning instabilities with different toroidal mode numbers dominate in different scenarios and consequently yield different types of ELMs. The energy loss fractions (ΔWped/Wped) caused by unmitigated ELMs in the baseline and hybrid scenarios are large (~2%) while the one in the SSO scenario is dramatically smaller (~1%), which are consistent with the features of type-I ELMs and grassy ELMs respectively. The intra ELM divertor heat flux width in the three scenarios given by the simulations is larger than the estimations for inter ELM phase based on Goldston’s heuristic drift model. The toroidal gap edge melting limit of tungsten monoblocks of divertor targets imposes constraints on ELM energy loss, giving that the ELM energy loss fraction should be smaller than 0.4%, 1.0%, and 1.2% for ITER baseline, hybrid and SSO scenarios, correspondingly. The simulation shows that only the SSO scenario with grassy ELMs may satisfy the constraint.

Innovative Realizations of High Heat-Flux Boiling and Condensing Flows for Milli-Meter and Micro-Meter Scale Applications

2014 ◽  
Author(s):  
Michael Kivisalu ◽  
Amitabh Narain ◽  
Patcharapol Gorgitrattanagul ◽  
Ranjeeth Naik
Keyword(s):  
Heat Flux ◽  
Heat Load ◽  
High Heat ◽  
Electronic Cooling ◽  
System Level ◽  
High Heat Flux ◽  
Zero Gravity ◽  
Pressure Drops ◽  
Condensing Flows ◽  
High Heat Load

For shear driven mm-scale flows, the traditional boiler and condenser operations pose serious problems of degraded performance (low heat-flux values, high pressure drops, and device-and-system level instabilities). The innovative devices are introduced for functionality and high heat load capabilities needed for shear dominated electronic cooling situations that arise in milli-meter scale operations, certain gravity-insensitive avionics-cooling and zero-gravity applications.

Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement

2013 ◽  
Author(s):  
Enes Tamdogan ◽  
Mehmet Arik ◽  
M. Baris Dogruoz
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Light Extraction ◽  
Junction Temperature ◽  
System Level ◽  
Design Parameters ◽  
Liquid Cooling ◽  
Wide Range

With the recent advances in wide band gap device technology, solid-state lighting (SSL) has become favorable for many lighting applications due to energy savings, long life, green nature for environment, and exceptional color performance. Light emitting diodes (LED) as SSL devices have recently offered unique advantages for a wide range of commercial and residential applications. However, LED operation is strictly limited by temperature as its preferred chip junction temperature is below 100 °C. This is very similar to advanced electronics components with continuously increasing heat fluxes due to the expanding microprocessor power dissipation coupled with reduction in feature sizes. While in some of the applications standard cooling techniques cannot achieve an effective cooling performance due to physical limitations or poor heat transfer capabilities, development of novel cooling techniques is necessary. The emergence of LED hot spots has also turned attention to the cooling with dielectric liquids intimately in contact with the heat and photon dissipating surfaces, where elevated LED temperatures will adversely affect light extraction and reliability. In the interest of highly effective heat removal from LEDs with direct liquid cooling, the current paper starts with explaining the increasing thermal problems in electronics and also in lighting technologies followed by a brief overview of the state of the art for liquid cooling technologies. Then, attention will be turned into thermal consideration of approximately a 60W replacement LED light engine. A conjugate CFD model is deployed to determine local hot spots and to optimize the thermal resistance by varying multiple design parameters, boundary conditions, and the type of fluid. Detailed system level simulations also point out possible abatement techniques for local hot spots while keeping light extraction at maximum.

Submerged Jet Impingement Cooling of a Nanostructured Plate

2010 ◽  
Author(s):  
Muhsincan Sesen ◽  
Ali Kosar ◽  
Ebru Demir ◽  
Evrim Kurtoglu ◽  
Nazli Kaplan ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Silicon Wafer ◽  
Heat Removal ◽  
Jet Impingement ◽  
Wafer Surface ◽  
Small Scale ◽  
Copper Thin Film ◽  
Thin Film Layer

In this paper, the results of a series of heat transfer experiments conducted on a compact electronics cooling device based on single phase jet impingement techniques are reported. Deionized-water is propelled into four microchannels of inner diameter 685 μm which are used as nozzles and located at a nozzle to surface distance of 2.5mm. The generated jet impingement is targeted through these channels towards the surface of a nanostructured plate. This plate of size 20mmx20mm consisted of ∼600 nm long copper nanorod arrays with an average nanorod diameter of ∼150 nm, which were integrated on top of a silicon wafer substrate coated with a copper thin film layer (i.e. Cu-nanorod/Cu-film/Silicon-wafer). Heat removal characteristics induced through jet impingement are investigated using the nanostructured plate and compared to results obtained from a flat plate of copper thin film coated on silicon wafer surface. Enhancement in heat transfer up to 15% using the nanostructured plate has been reported in this paper. Heat generated by small scale electronic devices is simulated using a thin film heater placed on an aluminum base. Surface temperatures are recorded by a data acquisition system with the thermocouples integrated on the surface at various locations. Constant heat flux provided by the film heater is delivered to the nanostructured plate placed on top of the base. Volumetric flow rate and heat flux values were varied in order to better characterize the potential enhancement in heat transfer by nanostructured surfaces.

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